公开(公告)号：US20210280447A1

公开(公告)日：2021-09-09

申请号：US17187299

申请日：2021-02-26

Applicant: TOKYO ELECTRON LIMITED

Inventor： Norihiko AMIKURA ,  Toshiaki TOYOMAKI

IPC: H01L21/677 ,  H01L21/67 ,  H01L21/687 ,  H01L21/68 ,  B65G47/90

Abstract: A substrate transfer system includes a load lock module, an atmospheric transfer module having a first sidewall adjacent to the load lock module and a second sidewall remote from the load lock module, the atmospheric transfer module being connected to the load lock module, and a substrate transfer robot disposed in the atmospheric transfer module. The substrate transfer robot includes a base configured to reciprocate along the first sidewall, a substrate transfer arm disposed on the base, and a flow rectifier surrounding the base, the flow rectifier being configured, upon movement of the base, to create an obliquely downward air flow in a direction opposite to a moving direction of the base.

公开(公告)号：US20210134564A1

公开(公告)日：2021-05-06

申请号：US17079947

申请日：2020-10-26

Applicant: TOKYO ELECTRON LIMITED

Inventor： Atsushi SAWACHI ,  Norihiko AMIKURA

IPC: H01J37/32

Abstract: A gas supply system includes first and second gas supply lines, first and second valves, and a controller. The first gas supply line is connected between a process gas source and a substrate processing chamber and has an intermediate node. The second gas supply line is connected between a purge gas source and the intermediate node. The first valve is disposed upstream of the intermediate node on the first gas supply line. The second valve is disposed upstream of the first valve on the first gas supply line. A controller controls the first and second valves to open the first and second valves in a first mode for supplying a process gas from the process gas source to the substrate processing chamber, and close the first and second valves in a second mode for supplying a purge gas from the purge gas source to the substrate processing chamber.

公开(公告)号：US20200278225A1

公开(公告)日：2020-09-03

申请号：US16645898

申请日：2019-05-27

Applicant: TOKYO ELECTRON LIMITED

Inventor： Norihiko AMIKURA ,  Risako MATSUDA ,  Kazuyuki MIURA

IPC: G01F1/50

Abstract: The flow rate measurement method includes: measuring a first pressure of a gas filled in a first flow path connected to a flow rate controller and a second flow path connected to the first flow path; supplying a gas to the first and second flow paths via the flow rate controller and measuring a second pressure and a temperature of the gas filled in the first and second flow paths; after the gas is exhausted from the second flow path, measuring a third pressure of the gas filled in the second flow path; measuring a fourth pressure of the gas filled in the first and second flow paths; and calculating an amount of the gas supplied to the first and second flow paths via the flow rate controller, based on the first, second, third, and fourth pressures and the temperature.

公开(公告)号：US20190212176A1

公开(公告)日：2019-07-11

申请号：US16238834

申请日：2019-01-03

Applicant: TOKYO ELECTRON LIMITED

Inventor： Risako MIYOSHI ,  Norihiko AMIKURA ,  Kazuyuki MIURA ,  Masaaki NAGASE ,  Satoru YAMASHITA ,  Yohei SAWADA ,  Kouji NISHINO ,  Nobukazu IKEDA

IPC: G01F1/50 ,  G01F25/00

CPC classification number: G01F1/50 ,  G01F25/0053

Abstract: A substrate processing system includes a gas supply unit having a first gas flow channel. A second gas flow channel of a flow rate measurement system is connected to the first gas flow channel. The flow rate measurement system further includes a third gas flow channel connected to the second gas flow channel, and a pressure sensor and a temperature sensor that measure a pressure and a temperature, respectively, in the third gas flow channel. In a method of an embodiment, a flow rate of a gas output from a flow rate controller of the gas supply unit is calculated using a build-up method. The flow rate of a gas is calculated without using the total volume of the first gas flow channel and the second gas flow channel and temperatures in the first gas flow channel and the second gas flow channel.

公开(公告)号：US20170261258A1

公开(公告)日：2017-09-14

申请号：US15450876

申请日：2017-03-06

Applicant: TOKYO ELECTRON LIMITED

Inventor： Jun HIROSE ,  Norihiko AMIKURA ,  Risako MIYOSHI

IPC: F26B3/04

CPC classification number: F26B3/04 ,  H01J37/32192 ,  H01J37/3244 ,  H01J37/32449

Abstract: A method includes a step of increasing or decreasing a flow rate of a gas of the a second gas supply system, by a predetermined time from a start of a gas treatment step of the process recipe or a by a predetermined time before a start of the gas treatment step, by using apparatus information regarding a first gas supply system of the first substrate treatment apparatus and the second gas supply system of the second substrate treatment apparatus, and arranging the treatment process, and in this step, the treatment process of the second substrate treatment apparatus performed using the process recipe conforms to the treatment process of the first substrate treatment apparatus performed using the process recipe.

公开(公告)号：US20250054793A1

公开(公告)日：2025-02-13

申请号：US18927144

申请日：2024-10-25

Applicant: Tokyo Electron Limited

Inventor： Norihiko AMIKURA ,  Masatomo KITA ,  Toshiyuki MAKABE ,  Shin MATSUURA ,  Nobutaka SASAKI ,  Gyeong min PARK

IPC: H01L21/677 ,  H01J37/32 ,  H01L21/67 ,  H01L21/683 ,  H01L21/687

Abstract: A substrate processing system includes a vacuum transfer module, a substrate processing module connected to the vacuum transfer module and including: a substrate processing chamber; a stage disposed in the substrate processing chamber; a first ring and a second ring disposed so as to surround a substrate placed on the stage; and a lifter configured to vertically move the first ring and the second ring with respect to the stage; a storage module connected to the vacuum transfer module and including a vertically movable ring storage; and a controller configured to selectively execute a simultaneous transfer mode in which the first ring and the second ring are simultaneously transferred between the substrate processing module and the storage module, and a sole transfer mode in which the second ring is solely transferred between the substrate processing module and the storage module.

公开(公告)号：US20240194504A1

公开(公告)日：2024-06-13

申请号：US18588356

申请日：2024-02-27

Applicant: Tokyo Electron Limited

Inventor： Norihiko AMIKURA ,  Masatomo KITA

IPC: H01L21/67 ,  H01L21/677

CPC classification number: H01L21/67196 ,  H01L21/67259 ,  H01L21/67742

Abstract: A processing system includes: a chamber in which a consumable member is installed; a storage module configured to store the consumable member; a position detection sensor configured to detect a position of the consumable member; a vacuum transfer module connected to the chamber and the storage module, the vacuum transfer module having a transfer robot configured to transfer the consumable member between the chamber and the storage module; and a controller. The controller performs processes of: (a) controlling transfer robot to transfer consumable member installed in the chamber to the storage module; (b) detecting position of the consumable member transferred to the storage module by the position detection sensor; and (c) controlling transfer robot to transfer a new consumable member different from the consumable member from the storage module to the chamber at a position adjusted based on the position of the consumable member detected in the process (b).

公开(公告)号：US20240182252A1

公开(公告)日：2024-06-06

申请号：US18525935

申请日：2023-12-01

Applicant: Tokyo Electron Limited

Inventor： Toshiaki TOYOMAKI ,  Norihiko AMIKURA ,  Seiichi KAISE ,  Masatomo KITA

IPC: B65G47/90

CPC classification number: B65G47/904 ,  B65G2201/0297

Abstract: There is a transfer module comprising: a housing; a load port disposed on a sidewall of the housing, the load port being capable of placing a container accommodating multiple objects to be transferred; a transfer device disposed in the housing and configured to transfer the objects; and a storage unit disposed in the housing and configured to temporarily accommodate the objects, wherein the housing includes: a first sidewall to which a load-lock module is connected; and a second sidewall other than a sidewall facing the first sidewall, to which the load port is connected, wherein the transfer device has a first arm having multiple forks on which the objects are placed, and the transfer device collectively transfers the objects in the container placed on the load port into the storage unit using the first arm.

公开(公告)号：US20220093438A1

公开(公告)日：2022-03-24

申请号：US17542249

申请日：2021-12-03

Applicant: TOKYO ELECTRON LIMITED

Inventor： Norihiko AMIKURA ,  Toshiaki TOYOMAKI

IPC: H01L21/677 ,  H01L21/67 ,  H01L21/68 ,  B65G47/90 ,  H01L21/687

Abstract: A substrate transfer system includes a load lock module, an atmospheric transfer module having a first sidewall adjacent to the load lock module and a second sidewall remote from the load lock module, the atmospheric transfer module being connected to the load lock module, and a substrate transfer robot disposed in the atmospheric transfer module. The substrate transfer robot includes a base configured to reciprocate along the first sidewall, a substrate transfer arm disposed on the base, and a flow rectifier surrounding the base, the flow rectifier being configured, upon movement of the base, to create an obliquely downward air flow in a direction opposite to a moving direction of the base.

公开(公告)号：US20210343559A1

公开(公告)日：2021-11-04

申请号：US17242736

申请日：2021-04-28

Applicant: TOKYO ELECTRON LIMITED

Inventor： Norihiko AMIKURA ,  Jun Hirose

IPC: H01L21/67 ,  H01L21/687

Abstract: A processing system capable of increasing an operating time of the processing system is provided. The processing system includes a vacuum transfer module, a plurality of processing modules, a plurality of load-lock modules, and a plurality of atmospheric transfer modules. The vacuum transfer module is configured to transfer a substrate in a pressure lower than an atmospheric pressure. The processing modules are connected to the vacuum transfer module and configured to process the substrate. The load-lock modules are connected to the vacuum transfer module. Each of the atmospheric transfer modules is connected to at least one of the load-lock modules and configured to transfer the substrate in an atmospheric environment.