公开(公告)号：US20110074847A1

公开(公告)日：2011-03-31

申请号：US12955890

申请日：2010-11-29

申请人： Hung-Lieh Hu ,  Jui-Hua Hu ,  Francis Chee-Shuen Lee ,  Wei-Fu Lai

发明人： Hung-Lieh Hu ,  Jui-Hua Hu ,  Francis Chee-Shuen Lee ,  Wei-Fu Lai

IPC分类号： B41J2/07 ,  B41J29/38

CPC分类号： B41J2/04541 ,  B41J2/0451 ,  B41J2/04543 ,  B41J2/0455 ,  B41J2/0458

摘要： An ink jet printhead module adapted for use in a printing apparatus, the ink jet printhead module being capable of receiving address signals and chip selection signals from a printhead drive unit of the printing apparatus. The printhead module includes chip control circuits, each being capable of receiving the address signals and receiving a corresponding one of the chip selection signals. Each chip control circuit includes switching circuits and an ink jetting circuit set. Each switching circuit is capable of receiving a corresponding one of the address signals and the corresponding one of chip selection signals and outputting a switching signal. An ink jetting circuit set includes ink jetting circuits, each being capable of receiving the switching signal from the corresponding switching circuit electrically coupled to the ink jetting circuit and determining whether or not to jet out ink based on the received switching signal.

摘要翻译： 适用于打印设备的喷墨打印头模块，该喷墨打印头模块能够从打印设备的打印头驱动单元接收地址信号和切屑选择信号。 打印头模块包括芯片控制电路，每个芯片控制电路能够接收地址信号并接收相应的一个芯片选择信号。 每个芯片控制电路包括开关电路和喷墨电路组。 每个开关电路能够接收对应的一个地址信号和对应的一个芯片选择信号并输出​​开关信号。 喷墨电路组包括喷墨电路，每个喷墨电路能够接收来自与喷墨电路电耦合的相应开关电路的切换信号，并基于接收到的切换信号确定是否喷出墨。

公开(公告)号：US20090115313A1

公开(公告)日：2009-05-07

申请号：US12182218

申请日：2008-07-30

申请人： Chien-Chun LU ,  Chia-Tai Kuo ,  Chen-Peng Hsu ,  Hung-Lieh Hu ,  Chien-Jen Sun

发明人： Chien-Chun LU ,  Chia-Tai Kuo ,  Chen-Peng Hsu ,  Hung-Lieh Hu ,  Chien-Jen Sun

IPC分类号： H01J1/62 ,  H01J9/02

CPC分类号： H01L33/505 ,  H01L33/508 ,  H01L33/60 ,  H01L2924/0002 ,  H05B33/10 ,  H01L2924/00

摘要： A light emitting device and a fabricating method thereof are described. The light emitting device includes a substrate, a light emitting chip, a tubular structure, and a fluorescent conversion layer. The tubular structure is formed on a surface of the substrate. The light emitting chip is disposed on the surface of the substrate and is surrounded by the tubular structure. The fluorescent conversion layer is disposed in the tubular structure and covers the light emitting chip. A ratio of a maximal vertical thickness and a maximal horizontal thickness of the fluorescent conversion layer at the light emitting chip is between 0.1 and 10. A distance for the light ray to pass through the fluorescent conversion layer is controlled by using the tubular structure, so as to solve a problem of the conventional art that fluorescent powder coating package technique results in non-uniform color temperature of the emitted light.

摘要翻译： 描述了发光器件及其制造方法。 发光器件包括衬底，发光芯片，管状结构和荧光转换层。 管状结构形成在基板的表面上。 发光芯片设置在基板的表面上并被管状结构包围。 荧光转换层设置在管状结构中并覆盖发光芯片。 发光芯片上的荧光转换层的最大垂直厚度与最大水平厚度之比在0.1和10之间。通过使用管状结构来控制光线通过荧光转换层的距离，因此 为了解决现有技术的问题，荧光粉末涂布包装技术导致发出的光的不均匀的色温。

公开(公告)号：US06402286B1

公开(公告)日：2002-06-11

申请号：US09824791

申请日：2001-04-04

申请人： Hung-Lieh Hu ,  Yuan-Liang Lan ,  Chieh-Wen Wang ,  Jhih-Ping Lu ,  Charles C. Chang

发明人： Hung-Lieh Hu ,  Yuan-Liang Lan ,  Chieh-Wen Wang ,  Jhih-Ping Lu ,  Charles C. Chang

IPC分类号： B41J29393

CPC分类号： B41J2/0451 ,  B41J2/04541 ,  B41J2/0458

摘要： A function test device for optical print head heaters in thermal bubble printers, which includes: a test end power supply to provide the power needed for the test device; a linear optical coupling device serially connected between a pulse power supply for driving a print head circuit and the print head heater to detect variation of a triggering current; and an amplification circuit to amplify an output signal of the linear optical coupling device and send the signal to a microprocessor.

摘要翻译： 一种用于热气泡打印机中的光学打印头加热器的功能测试装置，其包括：测试端电源，用于提供测试装置所需的电力; 串联连接在用于驱动打印头电路的脉冲电源和打印头加热器之间以检测触发电流的变化的线性光耦合装置; 以及放大电路，用于放大线性光耦合装置的输出信号并将信号发送到微处理器。

公开(公告)号：US20130168714A1

公开(公告)日：2013-07-04

申请号：US13633878

申请日：2012-10-03

申请人： Chao-Wei Li ,  Hung-Lieh Hu

发明人： Chao-Wei Li ,  Hung-Lieh Hu

IPC分类号： H01L33/52 ,  H01L33/50

CPC分类号： H01L33/501 ,  H01L33/505 ,  H01L33/54 ,  H01L33/648

摘要： A light emitting diode package structure is provided, including a substrate, a seal assembly, an optical element, at least one light emitting diode chip, and a packaging material layer. The seal assembly is disposed on the substrate. The optical element is disposed on the seal assembly, and an enclosed space is formed between the optical element, the seal assembly, and the substrate. The light emitting diode chip is disposed on the substrate and located in the enclosed space. The packaging material layer is located in the enclosed space and at least disposed on an upper surface of the light emitting diode chip, wherein the packaging material layer includes a liquid with high viscosity and a plurality of solid particles, and the viscosity of the liquid with high viscosity is more than 3000 mPa·s.

摘要翻译： 提供了一种发光二极管封装结构，包括基板，密封组件，光学元件，至少一个发光二极管芯片和封装材料层。 密封组件设置在基板上。 光学元件设置在密封组件上，并且在光学元件，密封组件和基板之间形成封闭空间。 发光二极管芯片设置在基板上并位于封闭空间中。 包装材料层位于封闭空间中，并且至少设置在发光二极管芯片的上表面上，其中包装材料层包括具有高粘度的液体和多个固体颗粒，并且具有 高粘度大于3000mPa·s。

公开(公告)号：US20130114256A1

公开(公告)日：2013-05-09

申请号：US13410312

申请日：2012-03-02

申请人： Hsiang-Chi Chung ,  Ji-Feng Chen ,  Hung-Lieh Hu ,  Chen-Kun Chen

发明人： Hsiang-Chi Chung ,  Ji-Feng Chen ,  Hung-Lieh Hu ,  Chen-Kun Chen

IPC分类号： F21V5/04 ,  F21V29/00

CPC分类号： F21V11/14 ,  F21K9/23 ,  F21Y2103/10 ,  F21Y2105/10 ,  F21Y2107/20 ,  F21Y2115/10

摘要： An LED light source includes a carrier, a plurality of LED chips and at least one set of lenses. The carrier has a mounting surface and the LED chips are mounted on the mounting surface. The set of lenses disposed on the carrier includes a first lens and a second lens, and the first lens encapsulates one of the LED chips and a lighting pattern provided from the LED chip encapsulated by the first lens is converted into a first lighting pattern. The second lens encapsulates one of the LED chips and a lighting pattern provided from the LED chip encapsulated by the second lens is converted into a second lighting pattern. The second lighting pattern is different from or compensates the first lighting pattern.

摘要翻译： LED光源包括载体，多个LED芯片和至少一组透镜。 载体具有安装表面，并且LED芯片安装在安装表面上。 设置在载体上的透镜组包括第一透镜和第二透镜，并且第一透镜封装一个LED芯片，并且从由第一透镜封装的LED芯片提供的点亮图案被转换为第一照明图案。 第二透镜封装一个LED芯片，并且从由第二透镜封装的LED芯片提供的点亮图案被转换成第二照明图案。 第二种照明模式不同于或补偿了第一种照明模式。

公开(公告)号：US08384682B2

公开(公告)日：2013-02-26

申请号：US12649357

申请日：2009-12-30

申请人： Hung-Lieh Hu ,  Chun-Hsing Lee ,  Jen-Hao Yeh ,  Sheng-Ho Huang ,  Yuan-Ching Chen ,  Yu-Ming Huang

发明人： Hung-Lieh Hu ,  Chun-Hsing Lee ,  Jen-Hao Yeh ,  Sheng-Ho Huang ,  Yuan-Ching Chen ,  Yu-Ming Huang

IPC分类号： G06F3/41

CPC分类号： G06F3/0386 ,  G06F3/0412 ,  G06F3/0421 ,  G06F2203/04109

摘要： An optical interactive panel includes a cladding layer, a first waveguide array, a second waveguide array, a first set of image sensor, and a second set of image sensor. The cladding layer has a first index of refraction. The first waveguide array has first waveguide channels formed on the cladding layer, wherein the first waveguide channels have a second index of refraction less than the first index of refraction, and extending at a first direction. The second waveguide array has second waveguide channels, formed on the cladding layer and extending at a second direction. The first set of image sensor detects a first set of light signals from the first waveguide channels to determine a first-direction location. The second set of image sensor detects a second set of light signals from the second waveguide channels to determine a second-direction location.

摘要翻译： 光学交互式面板包括包层，第一波导阵列，第二波导阵列，第一组图像传感器和第二组图像传感器。 包层具有第一折射率。 第一波导阵列具有形成在包覆层上的第一波导通道，其中第一波导通道具有小于第一折射率的第二折射率并且沿第一方向延伸。 第二波导阵列具有形成在包覆层上并在第二方向延伸的第二波导通道。 第一组图像传感器检测来自第一波导通道的第一组光信号以确定第一方向位置。 第二组图像传感器检测来自第二波导通道的第二组光信号以确定第二方向位置。

公开(公告)号：US08368099B2

公开(公告)日：2013-02-05

申请号：US12182218

申请日：2008-07-30

申请人： Chien-Chun Lu ,  Chia-Tai Kuo ,  Chen-Peng Hsu ,  Hung-Lieh Hu ,  Chien-Jen Sun

发明人： Chien-Chun Lu ,  Chia-Tai Kuo ,  Chen-Peng Hsu ,  Hung-Lieh Hu ,  Chien-Jen Sun

IPC分类号： H01L33/00

CPC分类号： H01L33/505 ,  H01L33/508 ,  H01L33/60 ,  H01L2924/0002 ,  H05B33/10 ,  H01L2924/00

摘要： A light emitting device and a fabricating method thereof are described. The light emitting device includes a substrate, a light emitting chip, a tubular structure, and a fluorescent conversion layer. The tubular structure is formed on a surface of the substrate. The light emitting chip is disposed on the surface of the substrate and is surrounded by the tubular structure. The fluorescent conversion layer is disposed in the tubular structure and covers the light emitting chip. A ratio of a maximal vertical thickness and a maximal horizontal thickness of the fluorescent conversion layer at the light emitting chip is between 0.1 and 10. A distance for the light ray to pass through the fluorescent conversion layer is controlled by using the tubular structure, so as to solve a problem of the conventional art that fluorescent powder coating package technique results in non-uniform color temperature of the emitted light.

摘要翻译： 描述了发光器件及其制造方法。 发光器件包括衬底，发光芯片，管状结构和荧光转换层。 管状结构形成在基板的表面上。 发光芯片设置在基板的表面上并被管状结构包围。 荧光转换层设置在管状结构中并覆盖发光芯片。 发光芯片上的荧光转换层的最大垂直厚度与最大水平厚度的比率为0.1至10.通过使用管状结构来控制光线穿过荧光转换层的距离，因此 为了解决现有技术的问题，荧光粉末涂布包装技术导致发出的光的不均匀的色温。

公开(公告)号：US08178890B2

公开(公告)日：2012-05-15

申请号：US12575470

申请日：2009-10-08

申请人： Chao-Wei Li ,  Chien-Peng Hsu ,  Yao-Jun Tsai ,  Hung-Lieh Hu

发明人： Chao-Wei Li ,  Chien-Peng Hsu ,  Yao-Jun Tsai ,  Hung-Lieh Hu

IPC分类号： H01L33/00

CPC分类号： H01L33/648 ,  H01L2224/48091 ,  H01L2224/49107 ,  H01L2224/73265 ,  H01L2924/10155 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012

摘要： A light-emitting diode (LED) package structure including a carrier substrate, at least one LED chip, an optical element and a highly thermal-conductive transparent liquid is provided. The LED chip is disposed on the carrier substrate and has an active layer. The optical element is disposed on the substrate and forms a sealed space with the carrier substrate, and the LED chip is disposed in the sealed space. The highly thermal-conductive transparent liquid fills up the sealed space.

摘要翻译： 提供了包括载体基板，至少一个LED芯片，光学元件和高导热透明液体的发光二极管（LED）封装结构。 LED芯片设置在载体基板上并具有有源层。 光学元件设置在基板上并与载体基板形成密封空间，并且LED芯片设置在密封空间中。 高导热透明液体填充密封空间。

公开(公告)号：US20100084958A1

公开(公告)日：2010-04-08

申请号：US12566943

申请日：2009-09-25

申请人： Chih-Tsung Shih ,  Chen-Peng Hsu ,  Hung-Lieh Hu

发明人： Chih-Tsung Shih ,  Chen-Peng Hsu ,  Hung-Lieh Hu

IPC分类号： H01J7/24 ,  H01L33/00

CPC分类号： H01L25/167 ,  H01L33/486 ,  H01L2224/48091 ,  H01L2924/12032 ,  H01L2924/00014 ,  H01L2924/00

摘要： A light emitting diode (LED) structure, a manufacturing method thereof and a LED module are provided. The LED structure has temperature sensing function. The LED structure comprises a composite substrate and an LED. The composite substrate comprises a diode structure whose P-type semiconductor region or N-type semiconductor region has a predetermined doping concentration. The diode structure is a temperature sensor, and the sensitivity of the temperature sensor is based on the predetermined doping concentration. The LED is disposed on the composite substrate. The diode structure is used for sensing the heat emitted from the LED.

摘要翻译： 提供了一种发光二极管（LED）结构，其制造方法和LED模块。 LED结构具有温度检测功能。 LED结构包括复合衬底和LED。 复合衬底包括其P型半导体区域或N型半导体区域具有预定掺杂浓度的二极管结构。 二极管结构是温度传感器，温度传感器的灵敏度基于预定的掺杂浓度。 LED设置在复合基板上。 二极管结构用于感测从LED发出的热量。

公开(公告)号：US20090230417A1

公开(公告)日：2009-09-17

申请号：US12126935

申请日：2008-05-26

申请人： Yao-Jun Tsai ,  Chen-Peng Hsu ,  Chao-Wei Li ,  Hung-Lieh Hu

发明人： Yao-Jun Tsai ,  Chen-Peng Hsu ,  Chao-Wei Li ,  Hung-Lieh Hu

IPC分类号： H01L33/00 ,  H01L21/02

CPC分类号： H01L33/486 ,  H01L33/60 ,  H01L33/62 ,  H01L33/641 ,  H01L2224/32245 ,  H01L2224/32257 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49107 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： The present invention discloses a light emitting diode (LED) package structure, which includes a carrier, a first protrusion, a LED chip, and an adhesion layer. The first protrusion is disposed on the carrier and has a first opening to expose the carrier, wherein the first protrusion is formed by a thermal conductive material. The LED chip is disposed in the first opening on the carrier, and a ratio between a width of the first opening and a width of the LED chip is 1˜1.5. The adhesion layer is disposed between the LED chip and the carrier to bond the LED chip to the carrier.

摘要翻译： 本发明公开了一种包括载体，第一突起，LED芯片和粘附层的发光二极管（LED）封装结构。 第一突起设置在载体上并且具有第一开口以暴露载体，其中第一突起由导热材料形成。 LED芯片设置在载体上的第一开口中，第一开口的宽度与LED芯片的宽度之比为1〜1.5。 粘合层设置在LED芯片和载体之间，以将LED芯片接合到载体上。