公开(公告)号：US07183872B2

公开(公告)日：2007-02-27

申请号：US11065232

申请日：2005-02-24

申请人： Byoung Hwa Lee ,  Dong Seok Park ,  Min Cheol Park ,  Sang Soo Park

发明人： Byoung Hwa Lee ,  Dong Seok Park ,  Min Cheol Park ,  Sang Soo Park

IPC分类号： H03H7/42 ,  H01F5/00

CPC分类号： H01P5/10

摘要： A laminated balun transformer subminiaturized with a transmission line length reduced below λ/4 without any variation of characteristics. The laminated balun transformer includes a first strip line having one end inputted to a unbalanced signal; a second strip line having connected to the first strip line; a third strip line formed in parallel with the first strip line and connected to a ground and connected to the external electrode for a first balanced signal; a fourth strip line formed in parallel with the second strip line and connected to the external electrode for a ground and the external electrode for a second balanced signal; and a capacitance forming electrode formed in parallel with a portion of the opened end of the second strip line and connected to the external electrode for the unbalanced signal.

摘要翻译： 传输线长度小于λ/ 4的小型化的不平衡 - 不平衡转换变压器，没有任何特性变化。 叠层平衡不平衡变压器包括：一端输入不平衡信号的第一带状线; 连接到第一带状线的第二带状线; 第三带状线，与第一带状线平行地形成并连接到接地并连接到外部电极用于第一平衡信号; 第四带状线，与第二条带线平行地形成并连接到用于接地的外部电极和用于第二平衡信号的外部电极; 以及电容形成电极，其与所述第二带状线的开放端部的一部分平行地形成，并且与所述不平衡信号的外部电极连接。

公开(公告)号：US08233263B2

公开(公告)日：2012-07-31

申请号：US12248476

申请日：2008-10-09

申请人： Byoung Hwa Lee ,  Sung Kwon Wi ,  Hae Suk Chung ,  Dong Seok Park ,  Sang Soo Park ,  Min Cheol Park

发明人： Byoung Hwa Lee ,  Sung Kwon Wi ,  Hae Suk Chung ,  Dong Seok Park ,  Sang Soo Park ,  Min Cheol Park

IPC分类号： H01G4/005 ,  H01G4/06 ,  H01G4/228

CPC分类号： H01G4/012 ,  H01G4/232 ,  H01G4/30

摘要： A multilayer chip capacitor includes a capacitor body including a stack of a plurality of dielectric layers and having first and second side faces and first and second end faces, a plurality of external electrodes of opposite polarity alternated on each of the first and second side faces, and a plurality of internal electrodes each including one or two leads extending to an outer face of the capacitor body and respectively connected to the external electrodes. A horizontal distance between leads of the internal electrodes of opposite polarity adjacent to each other in a stack direction is longer than a pitch between the external electrodes of opposite polarity adjacent to each other on the same side face of the capacitor body.

摘要翻译： 多层片状电容器包括电容器主体，其包括多个电介质层的叠层，并且具有第一和第二侧面以及第一和第二端面，多个相反极性的外部电极在第一和第二侧面中的每一个上交替， 以及多个内部电极，每个内部电极包括延伸到电容器主体的外表面并分别连接到外部电极的一个或两个引线。 在堆叠方向上彼此相邻的内部电极的引线之间的水平距离比在电容器主体的同一侧面上彼此相邻的外部电极之间的间距长。

公开(公告)号：US08149565B2

公开(公告)日：2012-04-03

申请号：US12421953

申请日：2009-04-10

申请人： Byoung Hwa Lee ,  Sung Kwon Wi ,  Hong Yeon Cho ,  Dong Seok Park ,  Sang Soo Park ,  Min Cheol Park

发明人： Byoung Hwa Lee ,  Sung Kwon Wi ,  Hong Yeon Cho ,  Dong Seok Park ,  Sang Soo Park ,  Min Cheol Park

IPC分类号： H01G15/00

CPC分类号： H05K1/0231 ,  H01G2/065 ,  H01G4/35 ,  H05K2201/09318 ,  H05K2201/09481 ,  H05K2201/10636 ,  H05K2201/10969 ,  Y02P70/611

摘要： A circuit board device includes a circuit board comprising a mounting area, and first and second power lines and a ground pad formed on the mounting area, and a vertical multilayer chip capacitor (MLCC) comprising a capacitor body, a plurality of first and second polarity inner electrodes, first and second outer electrodes, and a third outer electrode, wherein the first and second power lines are separately disposed on the mounting area, connected to the first and second outer electrodes, and electrically connected to each other only by the vertical MLCC, and the ground pad is disposed between the first and second power lines and connected to the third outer electrode.

摘要翻译： 一种电路板装置，包括：电路板，包括安装区域;以及第一和第二电力线以及形成在所述安装区域上的接地焊盘;以及垂直多层片状电容器（MLCC），其包括电容器本体，多个第一和第二极性 内部电极，第一外部电极和第二外部电极以及第三外部电极，其中第一和第二电力线分别设置在安装区域上，连接到第一和第二外部电极，并且仅通过垂直MLCC 并且接地焊盘设置在第一和第二电源线之间并且连接到第三外部电极。

公开(公告)号：US08081416B2

公开(公告)日：2011-12-20

申请号：US12267112

申请日：2008-11-07

申请人： Byoung Hwa Lee ,  Sung Kwon Wi ,  Hae Suk Chung ,  Dong Seok Park ,  Sang Soo Park ,  Min Cheol Park

发明人： Byoung Hwa Lee ,  Sung Kwon Wi ,  Hae Suk Chung ,  Dong Seok Park ,  Sang Soo Park ,  Min Cheol Park

IPC分类号： H01G4/005 ,  H01G4/228

CPC分类号： H01G4/30 ,  H01G4/012 ,  H01G4/232

摘要： A multilayer chip capacitor includes a capacitor body provided by a stack of a plurality of dielectric layers, a plurality of internal electrodes disposed in the capacitor body such that the internal electrodes of opposite polarities are alternately disposed to face each other with the dielectric layer interposed between each facing set of the internal electrodes, and a plurality of external electrodes disposed on an outer face of the capacitor body and electrically connected with the internal electrode. Each of the plurality of internal electrodes includes a main electrode part, and at least one lead extending from the main electrode part to a side face of the capacitor body and connected to a corresponding one of the external electrodes. The lead extends to the corresponding external electrode to be inclined with respect to the main electrode part thereof.

摘要翻译： 多层片状电容器包括：由多个电介质层的堆叠体构成的电容器主体，设置在电容器主体中的多个内部电极，使得相互极性的内部电极交替地配置成彼此面对，其中介电层介于 每个面对的内部电极组，以及多个外部电极，设置在电容器主体的外表面上并与内部电极电连接。 多个内部电极中的每一个包括主电极部分和从电极主体的主电极部分延伸到侧面的至少一个引线，并连接到对应的一个外部电极。 引线延伸到对应的外部电极，以相对于其主电极部分倾斜。

公开(公告)号：US07974072B2

公开(公告)日：2011-07-05

申请号：US11979875

申请日：2007-11-09

申请人： Byoung Hwa Lee ,  Sung Kwon Wi ,  Hae Suk Chung ,  Dong Seok Park ,  Sang Soo Park ,  Min Cheol Park

发明人： Byoung Hwa Lee ,  Sung Kwon Wi ,  Hae Suk Chung ,  Dong Seok Park ,  Sang Soo Park ,  Min Cheol Park

IPC分类号： H01G4/005 ,  H01G4/06 ,  H01G4/02

CPC分类号： H01G4/232 ,  H01G4/005 ,  H01G4/30 ,  H03H2001/0014

摘要： A multilayer capacitor array having a plurality of multilayer capacitor devices formed in a single multilayer structure, the multilayer capacitor array including: a capacitor body formed by depositing a plurality of dielectric layers and having first and second side surfaces opposite to each other; a plurality of first polarity internal electrodes and second polarity internal electrodes, disposed oppositely to each other in the capacitor body, interposing the dielectric layer there between, and formed of a single electrode plate comprising a single lead, respectively; and a plurality of first polarity external electrodes and second polarity external electrodes, formed on the first side surface and second side surface, respectively, and connected to a correspondent polarity internal electrode via the lead, the first polarity external electrode formed on the first side surface and the second polarity external electrode formed on the second side surface, wherein the numbers of the first polarity external electrodes and the second polarity external electrodes are two or more, respectively, and are identical to each other, and a total number of the multilayer capacitor devices in the multilayer capacitor array is identical to the number of the first polarity external electrodes.

摘要翻译： 1.一种多层电容器阵列，具有形成为单层多层结构的多层多层电容器件，所述层叠电容器阵列包括：通过沉积多个电介质层而形成的电容器体，并且具有彼此相对的第一和第二侧面; 多个第一极性内部电极和第二极性内部电极，其彼此相对设置在电容器主体中，分别在其间插入电介质层，并由单个引线构成的单个电极板形成; 以及多个第一极性外部电极和第二极性外部电极，分别形成在所述第一侧面和所述第二侧面上，并且经由所述引线与相应的极性内部电极连接，所述第一极性外部电极形成在所述第一侧面 和形成在第二侧面上的第二极性外部电极，其中第一极性外部电极和第二极性外部电极的数量分别为两个或更多个，并且彼此相同，并且层叠电容器的总数 多层电容器阵列中的器件与第一极性外部电极的数量相同。

公开(公告)号：US20110085277A1

公开(公告)日：2011-04-14

申请号：US12694926

申请日：2010-01-27

申请人： Kang Heon HUR ,  Eun Hyuk Chae ,  Sung Kwon Wi ,  Doo Young Kim ,  Dong Seok Park ,  Byoung Hwa Lee ,  Sang Soo Park ,  Min Cheol Park ,  Hae Suk Chunk

发明人： Kang Heon HUR ,  Eun Hyuk Chae ,  Sung Kwon Wi ,  Doo Young Kim ,  Dong Seok Park ,  Byoung Hwa Lee ,  Sang Soo Park ,  Min Cheol Park ,  Hae Suk Chunk

IPC分类号： H01G4/005 ,  H01G4/002

CPC分类号： H01G4/005

摘要： A multilayer chip capacitor includes a capacitor body, a plurality of internal electrodes, and a plurality of external electrodes. The capacitor body is formed of a ceramic sintered product and has first and second side surfaces facing each other. The plurality of internal electrodes each of which has two leads extending to the first and second side surfaces of the capacitor body, respectively, are arranged such that the internal electrodes with one polarity and the internal electrodes with the other polarity are alternately stacked inside the capacitor body. The plurality of external electrodes are formed on the first and second side surfaces of the capacitor body along a stacked direction of the internal electrodes such that the external electrodes with one polarity and the external electrodes with the other polarity are alternately arranged on each of the first and second side surfaces, and are connected to the leads.

摘要翻译： 多层片状电容器包括电容器本体，多个内部电极和多个外部电极。 电容器体由陶瓷烧结体形成，并且具有彼此面对的第一和第二侧面。 分别具有分别延伸到电容器本体的第一和第二侧面的两个引线的多个内部电极被布置成使得具有一个极性的内部电极和具有另一个极性的内部电极交替堆叠在电容器内部 身体。 多个外部电极沿着内部电极的堆叠方向形成在电容器主体的第一和第二侧表面上，使得具有一个极性的外部电极和具有另一个极性的外部电极交替地布置在第一 和第二侧表面，并且连接到引线。

公开(公告)号：US07889479B2

公开(公告)日：2011-02-15

申请号：US12007737

申请日：2008-01-15

申请人： Byoung Hwa Lee ,  Sung Kwon Wi ,  Sang Soo Park ,  Min Cheol Park ,  Dong Seok Park

发明人： Byoung Hwa Lee ,  Sung Kwon Wi ,  Sang Soo Park ,  Min Cheol Park ,  Dong Seok Park

IPC分类号： H01G4/228

CPC分类号： H01G4/232 ,  H01G2/06 ,  H01G4/38 ,  H01L23/50 ,  H01L2924/0002 ,  H01L2924/00

摘要： An integrated multilayer chip capacitor module including: plurality of multilayer chip capacitors arranged close to one another and co-planar with one another; and a capacitor support accommodating the multilayer chip capacitors, wherein each of the multilayer chip capacitors includes a rectangular parallelepiped capacitor body and a plurality of first and second external electrodes formed on at least two sides of the capacitor body, and the external electrodes on adjacent sides of adjacent ones of the multilayer chip capacitor in the capacitor support are electrically connected to each other by a conductive adhesive material.

摘要翻译： 一种集成多层片状电容器模块，包括：彼此靠近并且彼此共面布置的多个多层片状电容器; 以及容纳所述多层片状电容器的电容器支架，其中，所述多层片状电容器中的每一者包括长方体电容器主体和形成在所述电容器主体的至少两侧的多个第一外部电极和所述第二外部电极， 的电容器支撑体中的多层片状电容器的相邻电容器通过导电性粘合剂材料彼此电连接。

公开(公告)号：US07684204B2

公开(公告)日：2010-03-23

申请号：US12155583

申请日：2008-06-06

申请人： Byoung Hwa Lee ,  Sung Kwon Wi ,  Hae Suk Chung ,  Dong Seok Park ,  Sang Soo Park ,  Min Cheol Park

发明人： Byoung Hwa Lee ,  Sung Kwon Wi ,  Hae Suk Chung ,  Dong Seok Park ,  Sang Soo Park ,  Min Cheol Park

IPC分类号： H05K7/00

CPC分类号： H01L23/50 ,  H01G4/35 ,  H01L23/49838 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K1/0231 ,  H05K1/113 ,  H05K2201/0792 ,  H05K2201/09309 ,  H05K2201/0979 ,  H05K2201/10636 ,  Y02P70/611 ,  H01L2924/00

摘要： A circuit board including: a substrate having a mounting area for mounting a vertical multilayer chip capacitor having first and second external electrodes of a first polarity and a third external electrode of a second polarity; first to third pads arranged on the mounting area, the first and second pads having the first polarity and disposed separately from each other on the mounting area, the third pad having the second polarity and disposed between the first and second pads to be connected to the third external electrode; at least one first via formed in the substrate and connected to the first pad; at least one second via formed in the substrate and connected to the second pad; and a plurality of third vias formed in the substrate and connected to the third pad. The first via is disposed adjacent to the third pad relative to a central line of the first pad, the second via is disposed adjacent to the third pad relative to a central line of the second pad, one or more of the third vias are disposed adjacent to the first via relative to a central line of the third pad, and the rest of the third vias are disposed adjacent to the second via relative to the central line of the third pad.

摘要翻译： 一种电路板，包括：具有用于安装具有第一极性的第一和第二外部电极和第二极性的第三外部电极的垂直多层片状电容器的安装区域的基板; 布置在安装区域上的第一至第三焊盘，第一和第二焊盘具有第一极性并且在安装区域上彼此分开设置，第三焊盘具有第二极性并且设置在第一焊盘和第二焊盘之间以连接到 第三外部电极; 至少一个第一通孔，其形成在所述基板中并连接到所述第一焊盘; 至少一个第二通孔，形成在所述衬底中并连接到所述第二衬垫; 以及形成在基板中并连接到第三焊盘的多个第三通孔。 第一通孔相对于第一焊盘的中心线设置成与第三焊盘相邻，第二通孔相对于第二焊盘的中心线设置为与第三焊盘相邻，第一通孔中的一个或多个邻近 相对于第三焊盘的中心线移动到第一通孔，并且第三通孔的其余部分相对于第三焊盘的中心线设置成与第二通孔相邻。

公开(公告)号：US20100033897A1

公开(公告)日：2010-02-11

申请号：US12340200

申请日：2008-12-19

申请人： Byoung Hwa Lee ,  Sung Kwon Wi ,  Hae Suk Chung ,  Dong Seok Park ,  Sang Soo Park ,  Min Cheol Park

发明人： Byoung Hwa Lee ,  Sung Kwon Wi ,  Hae Suk Chung ,  Dong Seok Park ,  Sang Soo Park ,  Min Cheol Park

IPC分类号： H01G4/38

CPC分类号： H01G4/35 ,  H01G4/012 ,  H01G4/232 ,  H01G4/30 ,  H01G4/38

摘要： There is provided a multilayer chip capacitor a multilayer chip capacitor including: a capacitor body including first and second capacitor units arranged therein; and first to fourth outer electrodes, wherein the first capacitor unit includes first and second inner electrodes, and the first capacitor unit includes a plurality of capacitor elements each having a pair of the first and second inner electrodes repeatedly laminated, the second capacitor unit includes third and fourth inner electrodes, and the second capacitor unit includes at least one capacitor element having a pair of the third and fourth inner electrodes repeatedly laminated, and at least one of the capacitor elements of the first capacitor unit is different from the other capacitor elements of the first capacitor unit in a lamination number of the first and second inner electrodes or a resonant frequency.

摘要翻译： 提供了一种多层片状电容器，其包括：电容器主体，包括布置在其中的第一和第二电容器单元; 以及第一至第四外部电极，其中所述第一电容器单元包括第一和第二内部电极，并且所述第一电容器单元包括多个电容器元件，每个电容器元件具有反复层叠的一对第一和第二内部电极，所述第二电容器单元包括第三电极单元 和第四内部电极，并且第二电容器单元包括至少一个电容器元件，其具有重复层叠的一对第三和第四内部电极，并且第一电容器单元的电容器元件中的至少一个与其他电容器元件不同 第一电容器单元的第一和第二内部电极的叠层数或谐振频率。

公开(公告)号：US20090225492A1

公开(公告)日：2009-09-10

申请号：US12248476

申请日：2008-10-09

申请人： Byoung Hwa LEE ,  Sung Kwon Wi ,  Hae Suk Chung ,  Dong Seok Park ,  Sang Soo Park ,  Min Cheol Park

发明人： Byoung Hwa LEE ,  Sung Kwon Wi ,  Hae Suk Chung ,  Dong Seok Park ,  Sang Soo Park ,  Min Cheol Park

IPC分类号： H01G4/005

CPC分类号： H01G4/012 ,  H01G4/232 ,  H01G4/30

摘要： A multilayer chip capacitor includes a capacitor body including a stack of a plurality of dielectric layers and having first and second side faces and first and second end faces, a plurality of external electrodes of opposite polarity alternated on each of the first and second side faces, and a plurality of internal electrodes each including one or two leads extending to an outer face of the capacitor body and respectively connected to the external electrodes. A horizontal distance between leads of the internal electrodes of opposite polarity adjacent to each other in a stack direction is longer than a pitch between the external electrodes of opposite polarity adjacent to each other on the same side face of the capacitor body.

摘要翻译： 多层片状电容器包括电容器主体，其包括多个电介质层的叠层，并且具有第一和第二侧面以及第一和第二端面，多个相反极性的外部电极在第一和第二侧面中的每一个上交替， 以及多个内部电极，每个内部电极包括延伸到电容器主体的外表面并分别连接到外部电极的一个或两个引线。 在堆叠方向上彼此相邻的内部电极的引线之间的水平距离比在电容器主体的同一侧面上彼此相邻的外部电极之间的间距长。