Optically Aligned Camera Module Assembly Using Soldering

    公开(公告)号:US20190219897A1

    公开(公告)日:2019-07-18

    申请号:US16250181

    申请日:2019-01-17

    IPC分类号: G03B17/14 H04N5/225

    摘要: A camera module includes a front housing assembly having a lens and a lens holder, wherein the lens includes a plurality of optical elements, and wherein the lens holder includes a plurality of pins extending from a mating surface of the lens holder; an image sensor mounted to a substrate, wherein the substrate includes openings configured to receive the plurality of pins, and wherein the substrate is secured to the plurality of pins at a fixed position using solder, and wherein at the fixed position, the image sensor has optimal focus and alignment relative to the lens; and a back housing assembly attached to the front housing assembly via the mating surface of the lens holder.

    SIGNAL PROCESSING METHOD AND IMAGING DEVICE
    39.
    发明申请

    公开(公告)号:US20190206030A1

    公开(公告)日:2019-07-04

    申请号:US15768216

    申请日:2016-09-30

    申请人: SONY CORPORATION

    摘要: [Object] To process distortion states of images captured at different lens positions. [Solution] There is provided a signal processing method including, by a processor: calculating a distortion correction parameter on a basis of a correlation between a chief ray angle (CRA) for an image height inside a pixel and a relative position of a lens in an optical axis direction to an imaging element, the relative position being changed by an actuator. In addition, there is provided an imaging device including: an image calculation unit configured to convert an image by using a distortion correction parameter calculated on a basis of a correlation between a chief ray angle for an image height inside a pixel and a relative position of a lens in an optical axis direction to an imaging element, the relative position being changed by an actuator.