公开(公告)号：US20010009838A1

公开(公告)日：2001-07-26

申请号：US09805860

申请日：2001-03-13

Applicant: VLSI Technology, Inc.

Inventor： Samuel Vance Dunton ,  Yizhi Xiong

IPC: B24B049/00 ,  B24B051/00

CPC classification number: B24B37/013 ,  B24B49/12 ,  B24D7/12

Abstract: A multi-platen chemical-mechanical polishing system is used to polish a wafer. The wafer is polished at a first station. During polishing, an endpoint is detected. The endpoint is detected by generating optical radiation by a first light source. The first optical radiation travels through a translucent area in a surface of a first platen and travels through a first polishing pad. After being reflected by the wafer, the optical radiation returns through the first polishing pad through the translucent window to a first optical radiation detector. The first polishing pad has a uniform surface in that no part of the surface of the first polishing pad includes transparent material through which non-scattered optical radiation originating from the first light source can pass and be detected by the first optical radiation detector. Optical radiation that travels through the first polishing pad and is detected by the first optical radiation detector is haze scattered by inclusions within the first polishing pad. Non-scattered light is absorbed by the first polishing pad. The wafer is also polished at a second station. During polishing a final endpoint is detected. The final endpoint is detected by generating optical radiation by a second light source. The second optical radiation travels through a translucent area in a surface of a second platen and travels through a window embedded in a second polishing pad. After being reflected by the wafer, the optical radiation returns through the window embedded in the second polishing pad, through the translucent area in the surface of the second platen, to a second optical radiation detector.

Abstract translation: 多台板化学机械抛光系统用于抛光晶片。 晶片在第一站被抛光。 在抛光期间，检测到一个端点。 通过由第一光源产生光辐射来检测端点。 第一光辐射穿过第一压板的表面中的半透明区域并且穿过第一抛光垫。 在被晶片反射之后，光辐射通过第一抛光垫通过半透明窗口返回到第一光学辐射检测器。 第一抛光垫具有均匀的表面，因为第一抛光垫的表面的任何部分都不包括透明材料，通过该透明材料，源自第一光源的非散射光辐射可以通过第一光学辐射检测器检测。 穿过第一抛光垫并由第一光学辐射检测器检测的光辐射是由第一抛光垫内的夹杂物散射的雾。 非散射光被第一抛光垫吸收。 晶片也在第二站抛光。 在抛光期间，检测到最终的终点。 通过由第二光源产生光辐射来检测最终的终点。 第二光辐射穿过第二压板的表面中的半透明区域并且穿过嵌入第二抛光垫中的窗口。 在被晶片反射之后，光学辐射通过嵌入第二抛光垫中的窗口通过第二压板的表面中的半透明区域返回到第二光学辐射检测器。

公开(公告)号：US20010000501A1

公开(公告)日：2001-04-26

申请号：US09734175

申请日：2000-12-12

Applicant: ASAHI GLASS COMPANY, LTD.

Inventor： Masayuki Shinoda

IPC: H01J009/48 ,  B24B049/00 ,  B24B051/00 ,  B24B001/00 ,  B24B007/19 ,  B24B007/30 ,  H01J009/26

CPC classification number: H01J9/20 ,  C03C23/0025 ,  G06K1/126 ,  H01J9/00 ,  H01J9/42 ,  H01J29/86 ,  H01J2209/466

Abstract: Manufacturing steps for a cathode ray tube or a glass bulb for the cathode ray tube are controlled in such a manner that a two-dimensional matrix code 3 comprised of a plurality of dots is marked by laser in an outer side surface of a glass bulb 1, 5, the two-dimensional matrix code 3 containing the information which can identify individually glass bulbs, and the manufacturing steps are conducted by using a computer and the particulars specified by the serial information.

Abstract translation: 控制用于阴极射线管或阴极射线管的玻璃灯泡的制造步骤，使得由多个点组成的二维矩阵码3在玻璃灯泡1的外侧表面被激光标记 ，5，包含可以单独识别玻璃灯泡的信息的二维矩阵码3，并且通过使用计算机和由串行信息指定的细节来进行制造步骤。

公开(公告)号：US20040253910A1

公开(公告)日：2004-12-16

申请号：US10726637

申请日：2003-12-04

Inventor： Young-Sam Lim ,  Dong-Jun Lee ,  Nam-Soo Kim ,  Sung-Taek Moon ,  Kyoung-Moon Kang ,  Jae-Hyun So

IPC: B24B049/00 ,  B24B051/00 ,  B24B001/00

CPC classification number: B24B37/205 ,  B24B37/013

Abstract: A polishing pad, platen, method of monitoring, method of manufacturing, and method of detecting using a pseudo window area, where the pseudo window area has a thickness less than a thickness of a polishing layer and a thickness greater than zero.

Abstract translation: 抛光垫，压板，监测方法，制造方法以及使用伪窗口区域进行检测的方法，其中伪窗口区域的厚度小于抛光层的厚度，厚度大于零。

公开(公告)号：US20040248430A1

公开(公告)日：2004-12-09

申请号：US10457893

申请日：2003-06-09

Inventor： Rennie Barber ,  Mark Mayeda

IPC: B24B049/00 ,  H01L021/324 ,  H01L021/64 ,  H01L021/477 ,  H01L021/00 ,  B24B051/00 ,  H01L021/26 ,  C23C016/00 ,  H01L021/42

CPC classification number: H01L35/00 ,  H01L21/324 ,  H01L21/67109

Abstract: A device for transferring an object between manufacturing steps includes a transfer surface for receiving an object having an initial temperature from a first manufacturing step, for transporting the object from the first manufacturing step to another manufacturing step, and for transferring the object having a final temperature from the transfer surface to the other manufacturing step; and at least one Peltier unit coupled to the transfer surface for effecting a temperature change of the object from the initial temperature to the final temperature at a controlled rate.

Abstract translation: 用于在制造步骤之间传送物体的装置包括：传送表面，用于接收具有来自第一制造步骤的初始温度的物体，用于将物体从第一制造步骤传送到另一制造步骤，以及用于将具有最终温度的物体 从转印表面到另一个制造步骤; 以及耦合到所述转移表面的至少一个珀耳帖单元，用于以受控的速率实现所述物体从初始温度到最终温度的温度变化。

公开(公告)号：US20040242124A1

公开(公告)日：2004-12-02

申请号：US10722729

申请日：2003-11-25

Applicant: LAM Research Corporation

Inventor： Nicolas Bright ,  David J. Hemker

IPC: B24B049/00 ,  B24B051/00

CPC classification number: B24B37/015 ,  B24B37/30

Abstract: Apparatus controls the temperature of a wafer for chemical mechanical polishing operations. A wafer carrier wafer mounting surface positions a wafer adjacent to a thermal energy transfer unit for transferring energy relative to the wafer. A thermal energy detector oriented adjacent to the wafer mounting surface detects the temperature of the wafer. A controller is responsive to the detector for controlling the supply of thermal energy relative to the thermal energy transfer unit. Embodiments include defining separate areas of the wafer, providing separate sections of the thermal energy transfer unit for each separate area, and separately detecting the temperature of each separate area to separately control the supply of thermal energy relative to the thermal energy transfer unit associated with the separate area.

Abstract translation: 设备控制用于化学机械抛光操作的晶片的温度。 晶片载体晶片安装表面将晶片邻近热能传递单元定位，以相对于晶片转移能量。 定位成与晶片安装表面相邻的热能检测器检测晶片的温度。 控制器响应于检测器来控制相对于热能传递单元的热能供应。 实施例包括限定晶片的分开的区域，为每个单独的区域提供热能传递单元的分开的部分，并且单独地检测每个分离区域的温度，以单独地控制相对于与所述热能传递单元相关联的热能传递单元的热能供应 分开区域。

公开(公告)号：US20040180606A1

公开(公告)日：2004-09-16

申请号：US10790697

申请日：2004-03-03

Applicant: FANUC LTD

Inventor： Yasusuke Iwashita ,  Hiroyuki Kawamura ,  Zhiwei Tang

IPC: B24B049/00 ,  B24B051/00

CPC classification number: H02P5/52 ,  G05B2219/34027

Abstract: There is provided a synchronous control device for driving the same control object with two servomotors. The synchronous control device detects the physical quantity that represents the difference between the forces on the two servomotors, and, on the basis of the detected value, reduces the force that acts between the two servomotors.

Abstract translation: 提供了一种用于使用两个伺服电机驱动相同控制对象的同步控制装置。 同步控制装置检测表示两个伺服电动机之间的力之差的物理量，并且基于检测值减小在两个伺服电动机之间作用的力。

公开(公告)号：US20040176013A1

公开(公告)日：2004-09-09

申请号：US10379497

申请日：2003-03-04

Applicant: International Business Machines Corporation

Inventor： Mark A. Church ,  Alain M. L. Desouches ,  Glenn P. Gee

IPC: B24B049/00 ,  B24B051/00 ,  B24B001/00 ,  B24B007/19 ,  B24B007/30

CPC classification number: B24B37/16 ,  B24B21/04 ,  B24B37/048 ,  B24B49/16

Abstract: An apparatus and method of lapping of rows of magnetic recording heads uses multiple fluid-filled ports with variable pressure against a flexible adhesive tape to secure to and support the row. The tape provides the necessary tangential restraining force to drag the workpiece along a lapping plate. The multiple ports beneath the tape provide the necessary normal force to press the workpiece against the lapping plate to allow lapping to occur. The amount of material removal from the row is varied by adjusting the pressure in the ports such that higher pressure is applied to those heads with higher stripe height, and lower pressure is applied to recording heads with lower stripe height. To set or adjust the port. pressures, measurements of the read sensor resistance are taken to calculate the stripe height. The stripe height is roughly proportional to the reciprocal of resistance.

Abstract translation: 研磨磁记录头的行的装置和方法使用多个流体填充的端口，其可变压力抵靠柔性胶带固定并支撑该行。 胶带提供必要的切向限制力，以沿研磨板拖动工件。 胶带下面的多个端口提供必要的法向力，以将工件压靠在研磨板上以允许研磨发生。 通过调节端口中的压力来改变从行排出的材料的量，使得较高压力施加到具有较高条纹高度的那些头部，并且较低的压力施加到具有较低条纹高度的记录头。 设置或调整端口。 采取压力，读取传感器电阻的测量值来计算条纹高度。 条纹高度大致与电阻倒数成正比。

公开(公告)号：US20040162005A1

公开(公告)日：2004-08-19

申请号：US10747290

申请日：2003-12-30

Applicant: FUJITSU LIMITED

Inventor： Koji Sudo ,  Mitsuo Takeuchi

IPC: B24B049/00 ,  B24B051/00

CPC classification number: B24B49/16 ,  B24B37/048

Abstract: The apparatus for lapping a magnetic head slider includes a lapping plate to which a bar of the magnetic head slider makes a contact by a predetermined lapping pressure, a primary oscillating mechanism that makes a primary oscillating of the bar in a radial direction of the lapping plate, and a secondary oscillating mechanism that makes a secondary oscillating of the bar in a direction perpendicular to a direction of the primary oscillating. A coarse lapping of the bar is performed by a combined oscillating of the primary oscillating and the secondary oscillating, and upon completion of the coarse lapping, the apparatus switches to the primary oscillating to finish lapping of the bar.

Abstract translation: 用于研磨磁头滑动器的装置包括：研磨板，磁头滑块的杆通过预定的研磨压力进行接触;主振荡机构，其使所述杆在所述研磨板的径向方向上主要摆动 以及辅助摆动机构，其使杆沿与主振动方向垂直的方向进行二次摆动。 通过主振荡和次振荡的组合振荡来执行棒的粗糙研磨，并且在完成粗磨后，设备切换到主振荡以完成棒的研磨。

公开(公告)号：US20040157529A1

公开(公告)日：2004-08-12

申请号：US10360683

申请日：2003-02-07

Applicant: Antenen Research Co.

Inventor： Steven B. Antenen

IPC: B24B049/00 ,  B24B051/00

CPC classification number: B24B29/02 ,  B24B9/16 ,  B24B49/16

Abstract: An apparatus for maintaining constant force engagement between a finishing tool and a workpiece. The apparatus includes a motor supported on a rotatable base. A tool holder coupled to the motor supports a finishing tool at as point offset from a rotational axis of the base. The apparatus further includes an actuator configured to rotate the base, whereby the finishing tool is caused to engage the workpiece with a constant and known force.

Abstract translation: 一种用于在精加工工具和工件之间保持恒定力接合的装置。 该装置包括支撑在可旋转底座上的马达。 联接到马达的工具保持器以与基座的旋转轴线偏离的点支撑精加工工具。 该装置还包括致动器，该致动器被配置为使基座旋转，由此精加工工具以恒定且已知的力与工件接合。

公开(公告)号：US20040072500A1

公开(公告)日：2004-04-15

申请号：US10666891

申请日：2003-09-17

Inventor： Manoocher Birang ,  Shijian Li

IPC: B24B049/00 ,  B24B051/00

CPC classification number: B24B37/005 ,  B24B49/006 ,  B24B49/16

Abstract: A chemical mechanical polishing apparatus has a polishing surface, a carrier head to press a substrate against the polishing surface with a controllable pressure, a motor to generate relative motion between the polishing surface and the carrier head at a velocity, and a controller. The controller is configured to vary at least one of the pressure and velocity in response to a signal that depends on the friction between the substrate and the polishing surface to maintain a constant torque, frictional force, or coefficient of friction.

Abstract translation: 化学机械抛光装置具有抛光面，以可控制的压力将衬底压靠抛光表面的载体头，以一定速度在抛光表面和载体头之间产生相对运动的电动机和控制器。 控制器被配置为响应于取决于基板和抛光表面之间的摩擦的信号来改变压力和速度中的至少一个，以保持恒定的扭矩，摩擦力或摩擦系数。