公开(公告)号：US20040009650A1

公开(公告)日：2004-01-15

申请号：US10607600

申请日：2003-06-27

Inventor： Ki-Kwon Jeong ,  Dong-Kuk Kim

IPC: H01L021/00 ,  H01L021/64

CPC classification number: H01L21/67132 ,  H01L21/6835 ,  H01L21/6836 ,  H01L21/78 ,  H01L2221/68327 ,  H01L2221/68395 ,  Y10T29/41 ,  Y10T29/49121 ,  Y10T29/5313 ,  Y10T29/53187 ,  Y10T29/53261

Abstract: A dicing tape attaching unit that can attach both a pre-cut dicing tape and a general dicing tape to a wafer in a semiconductor package assembling process, and an in-line system used in a semiconductor package process including the dicing tape attaching unit are provided. The dicing tape attaching unit supplies one of the pre-cut dicing tape and the general dicing tape and attaches it to a wafer according to the direction of rotation of a tape loader. Accordingly, without an additional pre-cut dicing tape attaching unit, either of the pre-cut dicing tape and the general dicing tape can be attached to the back side of the wafer by one and the same unit.

Abstract translation: 在半导体封装组装工序中，可以将预切割的切割带和一般的切割带与晶片连接的切割胶带安装单元，以及在包括切割胶带安装部的半导体封装工序中使用的在线系统 。 切割胶带安装单元提供预切割切割带和一般切割带中的一个，并根据带式装载机的旋转方向将其附接到晶片。 因此，没有附加的预切割切割胶带安装单元，预切割的切割带和一般的切割带之一可以通过同一单元附接到晶片的背面。

公开(公告)号：US20030180972A1

公开(公告)日：2003-09-25

申请号：US10100184

申请日：2002-03-19

Inventor： Amir Al-Bayati ,  Babak Adibi ,  Majeed Foad ,  Sasson Somekh

IPC: H01L021/00 ,  G01R031/26 ,  H01L021/66 ,  H01L021/64

CPC classification number: H01L21/67253 ,  H01L22/20 ,  Y10T29/41

Abstract: Methods, systems, and mediums of controlling a semiconductor manufacturing process are described. The method comprises the steps of measuring at least one critical dimension of at least one device being fabricated on at least one of the plurality of wafers, determining at least one process parameter value on the at least one measured dimension, and controlling at least one semiconductor manufacturing tool to process the at least one of the plurality of wafers based on the at least one parameter value. A variation in the at least one critical dimension causes undesirable variations in performance of the at least one device, and at least one process condition is directed to controlling the processing performed on the plurality of wafers. The at least one manufacturing tool includes at least one of an implanter tool and an annealing tool.

Abstract translation: 描述了控制半导体制造工艺的方法，系统和介质。 该方法包括以下步骤：测量在至少一个晶片上制造的至少一个器件的至少一个临界尺寸，确定至少一个测量尺寸上的至少一个工艺参数值，以及控制至少一个半导体 基于所述至少一个参数值来处理所述多个晶片中的所述至少一个的制造工具。 所述至少一个关键尺寸的变化导致所述至少一个装置的性能的不期望的变化，并且至少一个处理条件涉及控制在所述多个晶片上执行的处理。 所述至少一个制造工具包括注入机工具和退火工具中的至少一个。

公开(公告)号：US20030167612A1

公开(公告)日：2003-09-11

申请号：US10391494

申请日：2003-03-17

Applicant: APPLIED MATERIALS, INC.

Inventor： Joseph Arthur Kraus ,  James David Strassner

IPC: H01L021/64 ,  H01L021/31 ,  H01L021/00 ,  H01L021/469

CPC classification number: H01L21/67167 ,  H01L21/67017 ,  H01L21/67109 ,  H01L21/67115 ,  H01L21/67161 ,  H01L21/67184 ,  H01L21/6719 ,  H01L21/67196 ,  H01L21/67201 ,  H01L21/67253 ,  H01L21/67745 ,  Y10T29/413

Abstract: A method and apparatus for transferring a substrate between a first environment having a first pressure and a second environment having a vacuum pressure is provided. In one embodiment, the apparatus comprises a chamber body having a first port disposed in a first wall and a second port disposed in a second wall that seals the chamber from the first and second environments. A cooling plate, a first substrate holder and a second substrate holder are disposed within the chamber body. The cooling plate is disposed at the bottom of the chamber body. The first port and the second port are sequentially opened and the pressure within the load lock regulated to allow substrate to pass through the load lock. A window is disposed in the top of the chamber body that allows a metrology device to view the chamber volume.

公开(公告)号：US20030022398A1

公开(公告)日：2003-01-30

申请号：US09912682

申请日：2001-07-24

Inventor： Hung-Jen Weng ,  Enk Klaus

IPC: H01L021/66 ,  G01R031/26 ,  H01L021/00 ,  H01L021/64

CPC classification number: H01L21/67276 ,  G05B19/41865 ,  G05B19/4187 ,  G05B2219/32201 ,  Y02P90/205 ,  Y02P90/22 ,  Y10T29/41

Abstract: A method is disclosed to determine and assess chamber inconsistency in a multi-chambered tool, especially a multi-chambered tool involved in mass production processes. Wafers produced by the tool are grouped in lots measured to obtain loss yield groups. The invention sorts yield losses to obtain a corresponding monotonic sequence. The invention then averages the monotonic sequences. If the resulting mean monotonic sequence fits with a predetermined aberration, the tool is determined to suffer from chamber inconsistency.

Abstract translation: 公开了一种用于确定和评估多室工具中的室不一致性的方法，特别是涉及批量生产过程的多室工具。 由工具生产的晶片按测量分组，以获得损失产量组。 本发明分选产量损失以获得相应的单调序列。 然后，本发明对单调序列进行平均。 如果所得到的平均单调序列与预定的像差相匹配，则确定该工具遭受室不一致。

公开(公告)号：US20030005885A1

公开(公告)日：2003-01-09

申请号：US10155455

申请日：2002-05-24

Inventor： David T. Mueller ,  Edward C. Diekmann

IPC: H01L021/00 ,  H01L021/64 ,  C23C016/00

CPC classification number: H01L21/67236 ,  B65G49/0459 ,  H01L21/67706 ,  H01L21/67727 ,  H01L21/67733 ,  H01L21/6776 ,  Y10T29/41

Abstract: A conveyor system for parts coupled to a loadbar assembly is disclosed. The conveyor system includes a walking beam conveyor and a push bar conveyor. The loadbar assembly and walking beam conveyor are configured to allow transfer of parts coupled to loadbar assemblies along a path through upward and downward and forward and reverse movements of the walking beam conveyor. The push bar conveyor and the loadbar assembly are configured to urge parts coupled to the loadbar assemblies through the push bar conveyor by an incremental distance substantially equal to the length of a segment bar of the loadbar assembly.

Abstract translation: 公开了一种用于连接到负载杆组件的部件的传送系统。 输送系统包括步进式输送机和推杆输送机。 负载杆组件和步进梁输送机构造成允许通过步进梁输送机的向上和向下以及向前和向后的运动沿着路径转移耦合到负载杆组件的部件。 推杆式输送机和负载杆组件构造成推动通过推杆输送机联接到负载杆组件的部件，该增量距离基本上等于负载杆组件的分段杆的长度。

公开(公告)号：US20020192927A1

公开(公告)日：2002-12-19

申请号：US10186741

申请日：2002-07-02

Applicant: FUJITSU LIMITED

Inventor： Yutaka Yamada

IPC: H01L021/00 ,  H01L021/64 ,  H01L021/301 ,  H01L021/46 ,  H01L021/78

CPC classification number: H01L21/6835 ,  H01L21/6836 ,  H01L21/78 ,  H01L2221/68322 ,  H01L2221/68327 ,  H01L2221/6834 ,  Y10T29/41 ,  Y10T83/02

Abstract: A semiconductor device production method and a semiconductor device production apparatus are provided. The semiconductor device production method includes the steps of: sticking a wafer to a stretch tape stretchable by a physical process; dicing the wafer into individual semiconductor chips; stretching the stretch tape by performing the physical process on the stretch tape after the dicing: and grinding the rear surface of the wafer stuck to the stretch tape after the tape stretching.

Abstract translation: 提供半导体器件制造方法和半导体器件制造装置。 半导体器件制造方法包括以下步骤：将晶片粘贴到通过物理工艺可拉伸的拉伸带; 将晶片切割成单独的半导体芯片; 通过在切割之后对拉伸带进行物理处理来拉伸拉伸带，并且在带拉伸之后研磨粘贴到拉伸带上的晶片的后表面。

公开(公告)号：US20020081754A1

公开(公告)日：2002-06-27

申请号：US10026551

申请日：2001-12-27

Applicant: Mitsubishi Denki Kabushiki Kaisha

Inventor： Tomohiro Hosokawa ,  Satoshi Shimizu

IPC: H01L021/66 ,  G01R031/26 ,  H01L021/00 ,  H01L021/64

CPC classification number: H01L21/67253 ,  H01L21/67155 ,  H01L22/20 ,  Y10T29/41

Abstract: A manufacturing method of a semiconductor device to perform processing, including pre-processing and post-processing, on a semiconductor substrate, a characteristic of the processed semiconductor substrate is inspected, whether the semiconductor substrate complies with a predetermined standard is judged, and a semiconductor substrate not complying with the standard is re-processed so that the semiconductor substrate complies with the standard.

Abstract translation: 检查在半导体基板上进行包括预处理和后处理的处理的半导体器件的制造方法，判断半导体衬底是否符合预定标准，并且半导体 不符合标准的衬底被重新处理，使得半导体衬底符合标准。

公开(公告)号：US20040248430A1

公开(公告)日：2004-12-09

申请号：US10457893

申请日：2003-06-09

Inventor： Rennie Barber ,  Mark Mayeda

IPC: B24B049/00 ,  H01L021/324 ,  H01L021/64 ,  H01L021/477 ,  H01L021/00 ,  B24B051/00 ,  H01L021/26 ,  C23C016/00 ,  H01L021/42

CPC classification number: H01L35/00 ,  H01L21/324 ,  H01L21/67109

Abstract: A device for transferring an object between manufacturing steps includes a transfer surface for receiving an object having an initial temperature from a first manufacturing step, for transporting the object from the first manufacturing step to another manufacturing step, and for transferring the object having a final temperature from the transfer surface to the other manufacturing step; and at least one Peltier unit coupled to the transfer surface for effecting a temperature change of the object from the initial temperature to the final temperature at a controlled rate.

Abstract translation: 用于在制造步骤之间传送物体的装置包括：传送表面，用于接收具有来自第一制造步骤的初始温度的物体，用于将物体从第一制造步骤传送到另一制造步骤，以及用于将具有最终温度的物体 从转印表面到另一个制造步骤; 以及耦合到所述转移表面的至少一个珀耳帖单元，用于以受控的速率实现所述物体从初始温度到最终温度的温度变化。

公开(公告)号：US20040034976A1

公开(公告)日：2004-02-26

申请号：US10433333

申请日：2003-06-02

Inventor： Hitoshi Wakizako ,  Kazunari Shiraishi ,  Yukito Sagasaki ,  Ken-ichi Motonaga ,  Kazunori Hino ,  Hiroki Sanemasa

IPC: H01L021/00 ,  H01L021/64

CPC classification number: H01L21/67265 ,  B25J9/042 ,  B25J18/04 ,  B25J19/023 ,  B65G49/067 ,  B65G2249/02 ,  Y10S414/135 ,  Y10S414/136 ,  Y10S414/137 ,  Y10S414/138 ,  Y10S414/14

Abstract: A transfer robot (5) for thin substrate capable of efficiently detecting the stored state of thin substrates and an inspection method for thin substrate capable of accurately detecting the stored state of thin substrates; the robot (5), comprising an inspection camera (1) for detecting the stored state of the thin substrates (3) in a storage cassette (2), wherein the plurality of thin substrates (3) stored in the storage cassette (2) are carried out from the storage cassette (2) by the robot.

Abstract translation: 一种能够有效地检测薄基板的存储状态的薄基板传送机器人（5）和能够精确地检测薄基板的存储状态的薄基板检查方法。 所述机器人（5）包括用于检测存储盒（2）中的薄基板（3）的存储状态的检查照相机（1），其中存储在所述存储盒（2）中的所述多个薄基板（3） 通过机器人从存储盒（2）进行。

公开(公告)号：US20030211640A1

公开(公告)日：2003-11-13

申请号：US10431612

申请日：2003-05-08

Applicant: NEC Electronics Corporation

Inventor： Junji Orimoto

IPC: H01L021/00 ,  H01L021/66 ,  G01R031/26 ,  H01L021/64

CPC classification number: H01L21/67253 ,  G05B19/41865 ,  G05B2219/32019 ,  G05B2219/32097 ,  G05B2219/45031 ,  Y02P90/14 ,  Y02P90/20

Abstract: A system is provided for maintaining plural different process flows for manufacturing different kinds of semiconductor device respectively on a semiconductor production line. The plural different process flows are registered in an automatic process control system. The system includes a function unit for setting an automatic process control in the automatic process control system based on an automatic process control information for each of the plural different process. The automatic control information for each of the plural different process flows further includes a process flow name, and process names respectively unique to the single process flow.

Abstract translation: 提供了一种用于在半导体生产线上分别制造用于制造不同种类的半导体器件的多个不同工艺流程的系统。 多个不同的处理流程被登记在自动过程控制系统中。 该系统包括用于基于用于多个不同处理中的每一个的自动处理控制信息在自动处理控制系统中设置自动处理控制的功能单元。 多个不同处理流程中的每一个的自动控制信息还包括分别对于单个处理流程唯一的处理流程名称和处理名称。