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31.
公开(公告)号:US20240160821A1
公开(公告)日:2024-05-16
申请号:US18480077
申请日:2023-10-03
Applicant: RENESAS ELECTRONICS CORPORATION
Inventor: Yuji HISAMATSU
IPC: G06F30/3308 , G06F30/323
CPC classification number: G06F30/3308 , G06F30/323
Abstract: Simulation of a semiconductor integrated circuit is appropriately performed. An information processing apparatus is provided, the information processing apparatus including: a first calculator calculating a processing time of each of a plurality of circuit components, based on a first abstraction level model corresponding to each of the circuit components included in a semiconductor integrated circuit; and a second calculator simulating processing of the semiconductor integrated circuit, based on the processing time of each of the circuit components calculated by the first calculator and a second abstraction level model having a higher level of abstraction than a level of the first abstraction level model.
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公开(公告)号:US11907629B2
公开(公告)日:2024-02-20
申请号:US17552819
申请日:2021-12-16
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Soonwoo Choi , Jung Woon Lee , Junyoung Jeong
IPC: G06F30/33 , G06F30/323 , G06F30/333
CPC classification number: G06F30/33 , G06F30/323 , G06F30/333
Abstract: A computing system configured to verify design of an integrated circuit (IC) includes a memory and a processor. The memory is configured to store computer executable instructions. The processor is configured to generate a first coverage model for at least two high-level parameters from the Institute of Electrical and Electronics Engineers (IEEE) 802.11 standard or hardware description language (HDL) code by executing the computer executable instructions, generate a second coverage model for low-level internal signals from the HDL code by executing the computer executable instructions, and generate a plurality of test packets for a regression test by using at least one of the first coverage model or the second coverage model by executing the computer executable instructions.
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33.
公开(公告)号:US20240028802A1
公开(公告)日:2024-01-25
申请号:US17964085
申请日:2022-10-12
Applicant: NEC Laboratories Europe GmbH
Inventor: Nicolas Weber
IPC: G06F30/323 , G06F30/327
CPC classification number: G06F30/323 , G06F30/327
Abstract: A method is provided for transforming a high-level language representation of a tensor computation graph into a low level language. The method includes assigning, for each input edge of each node in the tensor computation graph, a tensor shape, assigning, for each dimension of the input and output of each layer of the tensor computation graph, a loop primitive, and generating, from the tensor computation graph and the assigned loop primitives, an initial loop structure. The method further includes positioning the layers of the tensor computation graph within a nested loop structure to provide a final loop structure, collapsing loops in the final loop structure, and mapping the collapsed loops to hardware components configured to execute the collapsed loops.
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公开(公告)号:US11803681B1
公开(公告)日:2023-10-31
申请号:US17209006
申请日:2021-03-22
Applicant: XILINX, INC.
Inventor: Zachary Blair , Alireza Kaviani
IPC: G06F30/323 , H01L25/065 , H01L27/02 , G06F30/3947
CPC classification number: G06F30/323 , G06F30/3947 , H01L25/0655 , H01L27/0207
Abstract: The embodiments herein rely on cross reticle wires (also referred to as cross die wires) to provide communication channels between programmable dies already formed on a wafer. Using cross reticle wires to facilitate x-die communication can be three to four orders of magnitude faster than using general purpose I/O. With a wafer containing cross reticle wires, various device geometries can be generated at dicing time by cutting across different reticle boundaries. This allows up to full wafer-size devices, or several smaller sub-wafer devices to be derived from one wafer. Although the programmable dies can contain defects, these defects can be identified and avoided when generating a bitstream for configuring programmable features in the programmable dies.
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35.
公开(公告)号:US11797742B1
公开(公告)日:2023-10-24
申请号:US17559901
申请日:2021-12-22
Applicant: Synopsys, Inc.
Inventor: Diganchal Chakraborty , Jiri Prevratil , Harsh Chilwal , Shreedhar Ramachandra , Prasenjit Biswas
IPC: G06F30/38 , G06F30/398 , G06F30/323 , G06F30/3308 , G06F119/06
CPC classification number: G06F30/38 , G06F30/323 , G06F30/3308 , G06F30/398 , G06F2119/06
Abstract: A method includes: receiving a representation of a mixed-signal integrated circuit design including an analog circuit portion and a digital circuit portion including a plurality of descriptions of a power supply, the descriptions including a power supply network description and a register transfer level (RTL) hardware description language (HDL) description; determining a mismatch between the power supply network description and the HDL description of the power supply; generating a value converter to convert a voltage value associated with the power supply between the power supply network description and the HDL description; and converting, by a processor, between the power supply network description and the HDL description during runtime using the value converter to synchronize the power supply network description and the HDL description of the power supply responsive to the mismatch.
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公开(公告)号:US11775715B2
公开(公告)日:2023-10-03
申请号:US17116637
申请日:2020-12-09
Inventor: Kyuseung Han , Sukho Lee , Jae-Jin Lee
IPC: G06F30/331 , G06F30/32 , G06F30/327 , G06F30/323 , G06F13/12
CPC classification number: G06F30/331 , G06F13/12 , G06F30/32 , G06F30/323 , G06F30/327 , G06F2213/0038 , G06F2213/3808
Abstract: Disclosed is a method of operating a system-on-chip automatic design device. The system-on-chip automatic design device includes a first synthesizer and a second synthesizer. The method includes generating a first code, based on information of a first signal and information of a second signal that are used in a first IP (Intellectual Property) block, classifying a first signal code corresponding to the first signal and a second signal code corresponding to the second signal from the first code, synthesizing, through the first synthesizer, a first communication architecture configured to transmit the first signal, based on the classified first signal code, and synthesizing, through the second synthesizer, a second communication architecture configured to transmit the second signal based on the classified second signal code.
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37.
公开(公告)号:US20230267250A1
公开(公告)日:2023-08-24
申请号:US17653880
申请日:2022-03-08
Inventor: Rui Ma , Mouhacine Benosman , Weidong Cao
IPC: G06F30/323 , G06N3/08 , G06N3/04
CPC classification number: G06F30/323 , G06N3/08 , G06N3/0454
Abstract: A computer-implemented method is provided for generating device parameters of circuits using a pretrained reinforcement learning (RL) agent composed of a graph neural network (GNN) and a fully connected neural network (FCNN). The method is performed by steps including acquiring inputs with respect to a set of desired specifications or one desired specification of a circuit, device parameters, a fixed topology of the circuit and providing the inputs to the RL agent. The desired circuit description includes a graph modeling the topology of the circuit and device parameters of the circuit, and the desired specifications include gain, bandwidth, phase margin, power consumption, output power and power efficiency. The pretrained RL agent performs steps including transmitting an action selected from a set of actions to an environment module, updating the device parameters of the circuit according to the selected action using a data processor of the environment module, obtaining a current specification of the circuit by simulating a netlist of the circuit, acquiring a reward from the environment module, and generating the updated device parameters of the circuit.
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公开(公告)号:US11709984B2
公开(公告)日:2023-07-25
申请号:US17541886
申请日:2021-12-03
Applicant: Synopsys, Inc.
Inventor: Guillaume Jean Baptiste Desplechain
IPC: G06F30/3323 , G06F30/327 , G06F30/323 , G06F119/02
CPC classification number: G06F30/3323 , G06F30/323 , G06F30/327 , G06F2119/02
Abstract: A compilation system accesses a compilation operations that can be used by a compiler to compile a design under test (DUT). The compilation system can determine a sequence of the compilation operations for the compiler to perform the compilation. The compilation system can detect a failure at a first compilation operation of the sequence of operations during the compilation of the DUT, and the compilation of the DUT can be paused after the failure is detected. The compilation system can determine a second compilation operation of the accessed compilation operations based on one or more netlist parameters of the DUT's netlist. The compilation system then modifies the sequence of compilation operations based on the second compilation operation and resumes the compilation of the DUT at the second compilation operation using the modified sequence of compilation operations.
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公开(公告)号:US20230222274A1
公开(公告)日:2023-07-13
申请号:US18124259
申请日:2023-03-21
Applicant: Intel Corporation
Inventor: David Kehlet , Nij Dorairaj
IPC: G06F30/323
CPC classification number: G06F30/323
Abstract: A computer system is provided for protecting a circuit design for an application specific integrated circuit. The computer system includes a logic circuit replacement tool for identifying a module of logic circuitry for replacement in at least a portion of the circuit design. The logic circuit replacement tool generates a transformed circuit design for the application specific integrated circuit by replacing the logic circuitry in the module with a configurable circuit that performs a logic function of the logic circuitry when a bitstream stored in storage circuits in the configurable circuit configures the configurable circuit. The transformed circuit design includes the configurable circuit in the module.
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公开(公告)号:US11675950B2
公开(公告)日:2023-06-13
申请号:US17235790
申请日:2021-04-20
Inventor: Hsien Yu Tseng , Wei-Ming Chen
IPC: G06F30/392 , G06F119/08 , G06F30/323 , G06F30/398
CPC classification number: G06F30/392 , G06F30/323 , G06F30/398 , G06F2119/08
Abstract: The present disclosure provides a method and an apparatus for testing a semiconductor device. The method includes providing an active area in an integrated circuit design layout; grouping the active area into a first region and a second region; calculating a first self-heating temperature of the first region of the active area; calculating a second self-heating temperature of the second region of the active area; and determining an Electromigration (EM) evaluation based on the first self-heating temperature and the second self-heating temperature.
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