Abstract:
An improved photomultiplier tube comprises an evacuated envelope having a faceplate extending across one end thereof. A photoemissive cathode is disposed on the interior surface of the faceplate. A support electrode having a centrally located aperture therethrough is spaced from the faceplate. An electron multiplier assembly is attached to the support electrode. A focusing assembly is disposed about the centrally located aperture in the support electrode on a side of the support electrode opposite the electron multiplier assembly. The focusing electrode assembly comprises an insulating member having a generally tubular body with an interior surface and an exterior surface and having a proximal end and a distal end. A top-cap, having a substantially U-shaped cross-section including a flat central base and two mutually parallel projections at the ends of the base, is attached to the distal end of the insulating member. The parallel projections are directed toward the support electrode and extend along at least a portion of the interior and exterior surfaces of the insulating member. At least one antimony evaporator for forming the photocathode is disposed adjacent to the focusing assembly. One of the projections at the end of the top-cap shields the exterior surface of the insulating member from antimony deposition and thus prevents electrical shorting of the focusing assembly to the support electrode. The other projection shields the interior of the insulating member from impingement by photoelectrons from the photocathode and thereby prevents electrical charging of the insulating member. A focus potential is applied to the top-cap of the focusing electrode assembly to focus the photoelectrons into the electron multiplier assembly.
Abstract:
A channel electron multiplier is described having a tubular wall coated w a secondary-electron emitting material and including an electric field for accelerating the electrons, the electric field comprising a plurality of low-resistive conductive rings each alternating with a high-resistive insulating ring. The thickness of the low-resistive rings is many times larger than that of the high-resistive rings, being in the order of tens of microns for the low-resistive rings and at least one order of magnitude lower for the high-resistive rings; and the diameter of the channel tubular walls is also many times larger than the thickness of the high-resistive rings. Both single-channel and multiple-channel electron multipliers are described. A very important advantage, particularly in making multiple-channel multipliers, is the simplicity of the procedure that may be used in constructing such multipliers. Other operational advantages are described.
Abstract:
A multichannel electron multiplier has a plurality of multiplying stages. Each stage is formed from a flat plate of secondary electron emissive material slit into a plurality of fingers. Alternate fingers are twisted out of the plane of the plate at right angles thereto. The twisted fingers in successive stages are staggered to provide a plurality of zigzag electron multiplying channels. The source of electrons to be multiplied in a photo-electron emissive cathode and light is focused or collimated onto the photocathode at positions corresponding to the multiplying channels. In a second embodiment, the faceplate of a multiplier tube is a fibre optics plate and light is directed onto it by fibre optics light guides to positions corresponding to the multiplying channels. A focusing electrode is disposed between the photocathode and the first multiplying stage and serves to focus electrons onto the twisted fingers. The non-twisted fingers also help to focus electrons onto the twisted fingers in successive multiplying stages along the multiplying channels.
Abstract:
An apparatus for precisely locating the components at the input and output of an electron multiplier which includes mounting plates having precisely located holes for securing a plurality of arms in a predetermined arrangement. Mounted on the arms of the compoents which are fixed in their proper position when the apparatus is assembled.
Abstract:
The Microstructure Photomultiplier Assembly (MPA) enables the effective conversion of light signals (received at the front of the assembly) into readily-detectable electrical signals. The MPA comprises a photocathode, followed by an electron-multiplying plate(s) made from an insulating substrate which does not emit sufficient contaminants to poison the photocathode. Each plate is coated with a conductive layer. The front face of each plate is further coated with a layer of secondary electron-emissive material which, when struck by an incoming electron, can produce secondary electrons. Each plate is perforated with channels. The channels are designed to promote the efficient transfer and acceleration of electrons through the channels, under an applied voltage differential across the plate(s). An anode (pixelated or non-pixelated) at the end of the last plate collects the electrons and generates an electrical signal. The MPA is contained within a vacuum enclosure.
Abstract:
A microchannel plate (1) having an array of channels (5),includes a substrate (2) and, deposited on the substrate, a hydrogenated amorphous silicon film (3) having a thickness ranging between 50 μm and 200 μm, preferably between 80 μm and 120 μm, the film including the array of channels (5). Preferably, the substrate (2) is an integrated circuit having an internal electronic readout circuit and pixilated collection electrodes (8), and the film (3) is integrated on the substrate (2). The channels (5) may be formed by a Deep Reactive Ion Etching (DRIE) process.
Abstract:
An electron multiplier can be fabricated by depositing an electron emissive material on a reticulated substrate, and forming the reticulated substrate into the electron multiplier.
Abstract:
An electron multiplier can be fabricated by depositing an electron emissive material on a reticulated substrate, and forming the reticulated substrate into the electron multiplier.
Abstract:
Methods for manufacturing a gas electron multiplier. One method comprises a step of preparing a blank sheet comprised of an insulating sheet with first and second metal layers on its surface, a first metal layer hole forming step in which the first metal layer is patterned by means of photolithography, such as to form holes through the first metal layer, an insulating sheet hole forming step, in which the holes formed in the first metal layer are extended through the insulating layer by etching from the first surface side only, and a second metal layer hole forming step, in which the holes are extended through the second metal layer. Alternatively, the second metal layer hole forming step is performed by electrochemical etching, such that the first metal layer remains unaffected during etching of the second metal layer. In another embodiment, in the second metal layer hole forming step, the first and second metal layers are etched from the outside, thereby reducing the initial thicknesses of the first and second metal layers and the second metal layer is simultaneously etched through the holes in the first metal layer and the insulating sheet, said etching being maintained until the holes extend through the second metal layer, wherein said initial average thickness of the first and second metal layers is between 6.5 μm and 25 μm, preferably between 7.5 μm and 12 μm.
Abstract:
In the electron multiplier assembly 27, a dynode unit 10 is constructed from a plurality of dynodes 9 laminated one on another. Each dynode 9 is formed with multichannels 12 which are separated from one another by channel-separating portions 14. A focusing electrode plate 16 is formed with multichannels 18 which are separated from one another by channel-separating electrodes 20 which are located in correspondence with the channel-separating portions 14 of the first stage dynode 9a. A plurality of anodes 7 are provided for receiving electrons multiplied at the dynode unit 10 in their corresponding channels 18. Each channel-separating electrode 20 is formed with an opening 21, at a position confronting the channel-separating portion 14 of the first stage dynode 9a, for transmitting electrons therethrough.