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公开(公告)号：US20210200366A1
公开(公告)日：2021-07-01
申请号：US17138090
申请日：2020-12-30
发明人： Seung Lyong BOK , Jong In BAEK , Young Seok SEO , Sun Mi YU , Jong Hyun LEE , Jin Oh KWAG
IPC分类号： G06F3/041 , G06K9/00 , G06F3/044 , G06F3/046 , H01L31/12 , H01L27/12 , H01L31/105 , H01L27/32 , H01L51/52
摘要： A display device includes a thin-film transistor layer disposed on a substrate and including thin-film transistors; and an emission material layer disposed on the thin-film transistor layer. The emission material layer includes light-emitting elements each including a first light-emitting electrode, an emissive layer and a second light-emitting electrode, light-receiving elements each including a first light-receiving electrode, a light-receiving semiconductor layer and a second light-receiving electrode, and a first bank disposed on the first light-emitting electrode and defining an emission area of each of the light-emitting elements. The light-receiving elements are disposed on the first bank.
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公开(公告)号：US20210177809A1
公开(公告)日：2021-06-17
申请号：US17169907
申请日：2021-02-08
IPC分类号： A61K31/426 , A61K31/454 , A61K31/496 , A61K31/675 , A61K31/7105 , A61K45/06 , H01L31/12 , A61K31/215 , A61K31/351 , A61K9/00 , A61K9/20
摘要： This invention is directed to methods for treating and preventing influenza infection by inhibiting influenza virus HA maturation processes employing compounds of formula I. It is also directed to combinations for treating and preventing influenza infection comprising compounds of formula I and other agents.
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公开(公告)号：US11038077B2
公开(公告)日：2021-06-15
申请号：US16291637
申请日：2019-03-04
申请人： XINTEC INC.
发明人： Yen-Shih Ho , Po-Han Lee , Chien-Min Lin , Yi-Rong Ho
IPC分类号： H01L31/12 , H01L31/02 , H01L31/0203 , H01L31/0216 , H01L31/18 , H01L31/028
摘要： A chip package includes a chip, a sidewall structure that has a first light-shielding layer, a second light-shielding layer, and a cover. The chip has a light emitter and a light receiver that are located on a top surface of the chip. The sidewall structure is located on the top surface of the chip and has two aperture areas. The light emitter and the light receiver are respectively located in the two aperture areas. The sidewall structure surrounds the light emitter and the light receiver, and at least one surface of the sidewall structure has the first light-shielding layer. The second light-shielding layer is located between the chip and the sidewall structure. The cover is located on a surface of the sidewall structure facing away from the chip, and at least covers the light receiver and the sidewall structure that surrounds the light receiver.
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公开(公告)号：US11035563B2
公开(公告)日：2021-06-15
申请号：US16535370
申请日：2019-08-08
发明人： Hsin-Wei Tsai , I-Ju Chen , Hou-Yen Tsao , Shu-Hua Yang , Yu-Hung Su
IPC分类号： F21V23/06 , H01L31/12 , F21V25/02 , H01S5/042 , G01S17/08 , G01S17/89 , H01S5/02216 , H01L23/00 , H01L25/075 , H01L25/16 , H01L33/48 , H01L33/54 , F21Y115/30 , H01L33/62 , F21Y115/10
摘要： A light source device includes a substrate, an upper electrode layer and a lower electrode layer respectively disposed on two opposite surfaces of the substrate, a plurality of first conductive posts and second conductive posts embedded in the substrate and having the same number, a light emitter, a surrounding frame surrounding the light emitter, and a light permeable member disposed on the surrounding frame and covering the light emitter. The first conductive posts connect a first upper electrode pad of the upper electrode layer and a first lower electrode pad of the lower electrode layer. The second conductive posts connect a second upper electrode pad of the upper electrode layer and a second lower electrode pad of the lower electrode layer. The light emitter is mounted on the first upper electrode pad and is electrically connected to the second upper electrode pad.
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公开(公告)号：US11023026B2
公开(公告)日：2021-06-01
申请号：US16196508
申请日：2018-11-20
发明人： Kinya Matsuda
IPC分类号： G06F1/28 , H02S20/30 , H02J7/00 , H02S10/40 , H01L35/32 , G06F1/26 , H02S40/38 , G06F1/16 , G06F1/18 , H01L31/12 , H01L31/153 , H01L31/042
摘要： An integrated circuit includes: a first current detection circuit configured to, when a first enable signal is in an activated state, detect a current flowing between a first node and a second node, and generate an output signal, and when the first enable signal is in a deactivated state, stop a current detection operation; a first voltage detection circuit, which operates intermittently or operates continuously, that is configured to detect a voltage at the first node, and generate an output signal; and a control circuit that is configured to generate the first enable signal and supply the first enable signal to the first current detection circuit, and is configured to fetch the output signal of the first voltage detection circuit in a period other than the period in which the first enable signal transitions from a deactivated state to an activated state.
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公开(公告)号：US11011666B2
公开(公告)日：2021-05-18
申请号：US16541156
申请日：2019-08-15
发明人： Ping-Hui Yeh , Teng-Po Hsu , Yen-Chieh Chiu
IPC分类号： H01L31/12 , H01L31/11 , H01L31/18 , H01L31/0352 , H01L31/0304
摘要： An optoelectronic semiconductor structure includes a first n-type semiconductor layer, a first quantum well layer, a first p-type semiconductor layer, and a second n-type semiconductor layer. The first quantum well layer is disposed on the first n-type semiconductor layer. The first p-type semiconductor layer is disposed on the first quantum well layer. The second n-type semiconductor layer is disposed on the first p-type semiconductor layer. The second n-type semiconductor layer includes both an n-type dopant and a p-type dopant. The concentration of the n-type dopant in the second n-type semiconductor layer is greater than the concentration of the p-type dopant in the second n-type semiconductor layer. The first n-type semiconductor layer, the first quantum well layer, the first p-type semiconductor layer, and the second n-type semiconductor layer form a bipolar phototransistor structure. A manufacturing method of the optoelectronic semiconductor structure is also provided.
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公开(公告)号：US11009977B2
公开(公告)日：2021-05-18
申请号：US15904668
申请日：2018-02-26
发明人： In-Cheol Kim , Ji-Hong Park , Hyun-Ju Lee , Il-Ho Lee , Moon-Sung Choi , Seong-Mo Hwang , Ki-Hyuk Kim , Seung-Ho Nam
IPC分类号： G06F3/041 , H01L31/0232 , H01L31/12 , H01L27/146 , G06F3/044 , G02F1/1333 , G02F1/1362 , H01L27/02 , H01L27/12
摘要： A sensor substrate includes a base substrate, a black matrix pattern, a sensing electrode pattern, a driving electrode pattern, and at least one bridge line. The black matrix pattern is disposed on the base substrate and divides the base substrate into a light transmission area and a light blocking area. The sensing electrode pattern includes a plurality of first unit patterns arranged in association with a first direction. The driving electrode pattern includes a plurality of second unit patterns arranged in association with a second direction and disposed adjacent to the plurality of first unit patterns. The at least one bridge line is connected between at least two of the plurality of first unit patterns or between at least two of the plurality of second unit patterns.
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公开(公告)号：US20210133528A1
公开(公告)日：2021-05-06
申请号：US16947626
申请日：2020-08-10
申请人： Cornell University
摘要： The technology disclosed in this patent document can be used to construct devices with opto-electronic circuitry for sensing and identification applications, to provide untethered devices for deployment in living objects and other applications, and to provide fabrication techniques for making such devices for commercial production. As illustrated by specific examples disclosed herein, the disclosed technology can be implemented to provide fabrication methods, substrates, and devices that enable wireless, inorganic cell-scaled sensor and identification systems that are optically-powered and optically-readout.
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公开(公告)号：US20210126151A1
公开(公告)日：2021-04-29
申请号：US16605461
申请日：2018-04-25
申请人： KYOCERA Corporation
发明人： Naoki FUJIMOTO
IPC分类号： H01L31/12 , H01L31/0216
摘要： A light reception/emission element module comprises a substrate, a light emitting element disposed on the substrate, a first light receiving device disposed on the substrate apart from the light emitting element, and an upper wall located above the substrate. The upper wall comprises a facing surface facing the light emitting element and the first light receiving element. The light reception/emission element module of the disclosure further comprises a second light emitting element disposed on the substrate. The upper wall further comprises a first light passing portion located above the light emitting element, a second light passing portion located above the second light receiving element, and an intermediate portion located in a region between the first light passing portion and the second light passing portion. At least part of a lower surface of the intermediate portion comprises the facing surface.
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公开(公告)号：US10992252B2
公开(公告)日：2021-04-27
申请号：US16221736
申请日：2018-12-17
发明人： Michael Hack , Stephen R. Forrest
IPC分类号： H02S20/26 , H01L51/44 , G09G3/3208 , H01L31/048 , H02J7/35 , H01L51/52 , H01L27/32 , H01L31/12
摘要： Implementations of the disclosed subject matter provide a window, an energy and light producing device including at least one transparent photovoltaic device and at least one non-transparent Organic Light Emitting Device (OLED) in an optical path of the window. A controller may control the operation of the non-transparent OLED of the energy and light producing device. An energy storage device may be electrically coupled to the controller and the energy and light producing device to store energy generated by the transparent photovoltaic device and to power the non-transparent OLED. In some implementations, a LED or OLED may be mounted in the frame of the window and may be powered by the energy storage device.
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