公开(公告)号：USD1025982S1

公开(公告)日：2024-05-07

申请号：US29763156

申请日：2020-12-21

申请人： Charter Communications Operating, LLC

设计人： Ethan Miller ,  Ian Ruppert ,  Dave Rodrian ,  Gary Koerper ,  Ryan Dulaney

摘要： FIG. 1 is a front right perspective view of a media distribution hub enclosure showing our new design.
FIG. 2 is a front view of the media distribution hub enclosure thereof.
FIG. 3 is a back view of the media distribution hub enclosure thereof.
FIG. 4 is a left side view of the media distribution hub enclosure thereof.
FIG. 5 is a right side view of the media distribution hub enclosure thereof.
FIG. 6 is a top view of the media distribution hub enclosure thereof; and,
FIG. 7 is a bottom view of the media distribution hub enclosure thereof.
The broken lines shown in FIGS. 1-7 represent portions of the media distribution hub enclosure that form no part of the claimed design.

公开(公告)号：US11976670B2

公开(公告)日：2024-05-07

申请号：US17659387

申请日：2022-04-15

申请人： BLOOM ENERGY CORPORATION

发明人： Shuo Li

IPC分类号： F04D17/16 ,  F04D25/06 ,  F04D29/28 ,  F04D29/42 ,  F04D29/58 ,  H01M8/04014

CPC分类号： F04D29/5806 ,  F04D17/16 ,  F04D25/06 ,  F04D29/281 ,  F04D29/4226 ,  F04D29/5853 ,  H01M8/04014

摘要： A centrifugal blower includes a motor located in a motor housing, an impeller, and a volute. The volute directly contacts the motor housing such that the volute is configured to actively cool the motor during operation.

公开(公告)号：US11974266B2

公开(公告)日：2024-04-30

申请号：US17467067

申请日：2021-09-03

申请人： QUALCOMM Incorporated

发明人： Hamed Pezeshki ,  Tao Luo ,  Arumugam Chendamarai Kannan

IPC分类号： H04W72/12 ,  H04B7/06 ,  H04W72/044

CPC分类号： H04W72/12 ,  H04B7/0617 ,  H04W72/046

摘要： Embodiments include systems and methods for managing millimeter wave (mmWave) communications with wireless devices capable of mmWave digital beamforming. Various embodiments may enable multiplexing of synchronization signal blocks (SSBs) and data and/or control blocks for wireless devices with digital beamforming capabilities. Various embodiments may include sending an indication to a base station that the wireless device is capable of mmWave digital beamforming. Various embodiments may include receiving a radio resource control (RRC) message from the base station scheduling an SSB in a mmWave frequency range for the wireless device with the SSB frequency-division multiplexed in a same timeslot with one or both of a data transport block or a system information block (SIB) for the wireless device.

公开(公告)号：US11973617B2

公开(公告)日：2024-04-30

申请号：US17512972

申请日：2021-10-28

申请人： Charter Communications Operating, LLC

发明人： Jody Lee Beck ,  Willard Andrew Gray

IPC分类号： H04L12/66 ,  H04L9/08 ,  H04L9/32 ,  H04L61/4511

CPC分类号： H04L12/66 ,  H04L9/0825 ,  H04L9/3247 ,  H04L61/4511

摘要： Systems, methods, and devices of the various embodiments may enable distributed prefix signing by including a signature in a transitive Border Gateway Protocol (BGP) attribute of a new prefix announcement, and sending the new prefix announcement to peer components. The peer components may query an address and routing parameter area (ARPA) record to obtain nameserver information for an entity associated with the received prefix announcement in response to determining that the received prefix announcement includes a transitive BGP attribute that includes the signature, retrieve a public key from a Domain Name System (DNS) text record, and determine whether the signature included in the transitive BGP attribute of the received prefix announcement is valid based on the public key retrieved from the DNS text record.

公开(公告)号：US11970387B2

公开(公告)日：2024-04-30

申请号：US17699245

申请日：2022-03-21

申请人： Taiwan Semiconductor Manufacturing Company Limited

发明人： Chun-wen Cheng ,  Chi-Hang Chin ,  Kuei-Sung Chang

IPC分类号： B81B3/00 ,  B81C1/00

CPC分类号： B81B3/001 ,  B81C1/00968 ,  B81C2201/013

摘要： A micro-electro mechanical system (MEMS) device includes a MEMS substrate, at least one movable element laterally confined within a matrix layer that overlies the MEMS substrate, and a cap substrate bonded to the matrix layer through bonding material portions. A first movable element selected from the at least one movable element is located inside a first chamber that is laterally bounded by the matrix layer and vertically bounded by a first capping surface that overlies the first movable element. The first capping surface includes an array of downward-protruding bumps including respective portions of a dielectric material layer. Each of the downward-protruding bumps has a vertical cross-sectional profile of an inverted hillock. The MEMS device can include, for example, an accelerometer.

公开(公告)号：US11966284B1

公开(公告)日：2024-04-23

申请号：US18484106

申请日：2023-10-10

申请人： MONTANA STATE UNIVERSITY ,  RESILIENT COMPUTING, LLC

发明人： Brock J. Lameres ,  Christopher Michel Major

IPC分类号： G06F11/07 ,  G06F11/16 ,  G06F11/30

CPC分类号： G06F11/0793 ,  G06F11/0721 ,  G06F11/16 ,  G06F11/3024

摘要： A fault-tolerant computer system includes a plurality of processors configured to simultaneously execute identical sets of processor-executable instructions, each of the plurality of processors containing a processor core including one or more registers and a local memory, an arbiter configured to read each of the registers of the plurality of processors, detect incorrect register values, and overwrite the registers containing the incorrect register values with corrected register values, and a memory scrubber configured to read each address of the local memories of the plurality of processors, detect incorrect memory values, and overwrite addresses containing the incorrect memory values with corrected memory values. In various embodiments, the computer system may be implemented using one or more field programmable gate arrays (FPGAs).

公开(公告)号：US11962041B2

公开(公告)日：2024-04-16

申请号：US17221147

申请日：2021-04-02

申请人： BLOOM ENERGY CORPORATION

发明人： Avinash Verma ,  Chockkalingam Karuppaiah ,  Harald Herchen ,  Cheng-Yu Lin ,  Martin Perry

IPC分类号： H01M50/522 ,  B22F3/24 ,  B22F10/28 ,  B22F10/50 ,  B22F10/62 ,  B33Y10/00 ,  B33Y40/20 ,  B33Y70/00 ,  B33Y80/00 ,  H01M8/0208

CPC分类号： H01M50/522 ,  B22F10/28 ,  B22F10/50 ,  B22F10/62 ,  B33Y40/20 ,  B33Y70/00 ,  B33Y80/00 ,  H01M8/0208 ,  B22F2003/242 ,  B22F2201/03 ,  B22F2201/11 ,  B22F2301/20 ,  B22F2301/35 ,  B22F2998/10 ,  B33Y10/00

摘要： A method of forming a fuel cell interconnect includes depositing a Cr alloy powder, sintering the Cr alloy powder, and repeating the depositing and the sintering to form the fuel cell interconnect. The Cr alloy powder may include a pre-alloyed powder containing from about 4 wt. % to about 6 wt. % Fe, and from about 94 wt. % to about 96 wt. % Cr.

公开(公告)号：US11956481B2

公开(公告)日：2024-04-09

申请号：US18126787

申请日：2023-03-27

申请人： CHARTER COMMUNICATIONS OPERATING, LLC

发明人： Jody Lee Beck

IPC分类号： H04N21/2183 ,  H04L9/08 ,  H04L65/612 ,  H04L67/02 ,  H04L67/568

CPC分类号： H04N21/2183 ,  H04L9/0822 ,  H04L65/612 ,  H04L67/568 ,  H04L67/02

摘要： Systems, methods, and devices of the various embodiments disclosed herein may provide a protocol and architecture for decentralization of content delivery. Various embodiments may provide a client based method for content delivery from content delivery networks (CDNs) via tiered caches of content hosted by Internet Service Providers (ISPs). In various embodiments, content delivery protocol (CDP) messages may enable clients to discover local cache network topologies and request content from a CDN based on a discovered local cache network topology. In various embodiments, security may be provided for the content delivery by the use of key encryption and/or file hashing.

公开(公告)号：US11955405B2

公开(公告)日：2024-04-09

申请号：US17577069

申请日：2022-01-17

申请人： Taiwan Semiconductor Manufacturing Company Limited

发明人： Jen Yu Wang ,  Chung-Jung Wu ,  Sheng-Tsung Hsiao ,  Tung-Liang Shao ,  Chih-Hang Tung ,  Chen-Hua Yu

IPC分类号： H01L23/373 ,  H01L23/473

CPC分类号： H01L23/3736 ,  H01L23/473

摘要： A semiconductor package includes a package substrate; semiconductor devices disposed on the package substrate; a package ring disposed on a perimeter of the package substrate surrounding the semiconductor devices; a cover including silicon bonded to the package ring and covering the semiconductor devices; and a thermal interface structure (TIS) thermally connecting the semiconductor devices to the cover.

公开(公告)号：US11949510B2

公开(公告)日：2024-04-02

申请号：US17929764

申请日：2022-09-06

申请人： QUALCOMM Incorporated

发明人： Sunitha Annam Vijayasingh Gnanaprakasam

IPC分类号： H04L1/00 ,  H04L12/40

CPC分类号： H04L1/0078 ,  H04L1/0041 ,  H04L1/0061 ,  H04L12/40013

摘要： Embodiments include methods performed by a copy engine of a computing device for generating a cyclic redundancy check (CRC) in a safety network, including copying a first dataset received from an interface bus to obtain a first dataset copy, copying a second dataset received from the interface bus to obtain a second dataset copy, generating, via a first stream-wise CRC engine in the hardware of the copy engine, a first CRC value for the first dataset copy and, in parallel, generating, via a second stream-wise CRC engine in the hardware of the copy engine, a second CRC value for the second dataset copy, transmitting, to a processor of the computing device, a first stream-wise CRC message including the first dataset copy and the first CRC value, and a second stream-wise CRC message including the second dataset copy and the second CRC value.