摘要:
Provided is a method of producing a semiconductor package including at least two rows of leads in which the leads of each row separately connecting a semiconductor chip to an external substrate. The method includes: forming a lead frame, the lead frame including a die pad and a plurality of leads arranged about the die pad; attaching an adhesive tape to a surface of the lead frame covering at least substantially the die pad and the plurality of leads; removing portions of the leads and the adhesive tape disposed in a dividing region and thereby separating at least some of the plurality of leads to form multiple rows of leads; and mounting a semiconductor chip on the die pad, electrically connecting the semiconductor chip with the lead frame, and molding the lead frame and the semiconductor chip to provide a semiconductor package. The adhesive tape attached at undesirable locations of the lead frame is preferably removed after provision of the semiconductor package.
摘要:
Compact cosmetic case with airtight sealed structure, which has a simple construction and enhances its airtight sealed effect to prevent a leakage of cosmetics, such as powder, thus improving quality, increasing productivity and reducing the production costs. The compact cosmetic case includes a body, an inner casing to contain the powder, an inner lid hinged the inner casing and having a powder puff seat, and an outer lid hinged to the body and having a locking part. A groove is formed around an upper surface of the inner casing, with liquid rubber filling the groove to form a rubber seal. A locking hole is formed on the inner casing, while a locking lever having a locking projection is formed on the inner lid to be locked to the locking hole.
摘要:
A hydrodynamic fluid film bearing for supporting a rotation shaft of a turbo or rotary apparatus includes a sleeve having a circular inner opening for receiving a rotation shaft therein, at least one metallic foil member of arc shape having one end fixed to the inner surface of the sleeve and arranged along the inner opening of the sleeve, and at least one elastic member disposed at the sleeve between the sleeve and the foil member. A bearing housing for receiving a bearing of a rotary apparatus is further provided, in which the bearing housing includes a circular opening for receiving the bearing therein, and the circular inner opening of the bearing housing includes grooves for cooling air passage formed at regular interval in the axial direction on the inner surface of the bearing housing. The bearing received in the bearing housing is preferably a hydrodynamic fluid film bearing.
摘要:
An ultrasonic transducer device for a humidifier, the humidifier having a vaporizing chamber for producing water vapor or mist, the ultrasonic transducer device comprises: a transducer holder having a central opening formed in a longitudinal direction of the transducer holder and a flange portion disposed at a periphery of the transducer holder, the transducer formed of synthetic resin or plastic materials; an ultrasonic transducer disposed at the central opening of the transducer holder; a support member formed of metal and having an upper planar section and a side section extending vertically from the upper planar section, the upper planar section defining an opening therein for coupling with the flange portion of the transducer holder; and a heat discharge plate having heat discharging fins and coupled with the support member, the heat discharge plate coupled with a circuit board for discharging heat in the circuit board.
摘要:
A method of manufacturing a substrate for a circuit board includes forming a groove having a predetermined shape and pattern in at least one surface of a substrate formed of an insulating material, filling the groove with a conductive material, and forming a circuit pattern by hardening the conductive material filling the groove. The groove is preferably formed by impression with a die containing a pattern corresponding to the shape and pattern of the groove. A substrate and a smart label formed of the substrate are also disclosed.
摘要:
A zoom lens system includes a zoom base to which an image pickup device can be coupled, a driving source for generating rotational force in accordance with a control signal of a control unit disposed in the electronic facility, plural power transmission gears disposed on the zoom base to reduce the rotational force of the driving source, a first lens cam disposed on the zoom base and rotated by the rotational force of the power transmission gears, plural first lens shafts coupled on the zoom base in a direction of an optical axis and located in the first lens cam, a first lens barrel having a first lens, the first lens barrel being disposed in the first lens cam and slidably coupled to the first lens shaft in the direction of the optical axis so as to move in the direction of the optical axis in accordance with rotation of the first lens cam, a power transmission member coupled to the first lens cam in the direction of the optical axis, an outer second lens cam disposed on an outer circumference of the first lens cam and fixed on the zoom base, an inner second lens cam disposed in the outer lens cam and rotating and moving linearly by the power transmission member, plural second lens shafts coupled to the zoom base in the direction of the optical axis and located in the inner second lens cam, and a second lens barrel having a second lens and being disposed in the inner second lens cam and slidably coupled to the second lens shaft to linearly move in the direction of the optical axis in accordance with rotation of the inner second lens cam.
摘要:
Provided is a method for fabricating a semiconductor package with a lead frame and the semiconductor package provided thereof. The method includes supplying a lead frame with a plurality of molding regions for molding a plurality of semiconductor packages, and attaching tape to at least one surface of the lead frame to prevent a molten molding material from contacting the lead frame on that surface. The tape comprises a plurality of vacant regions corresponding to the boundary of each molding region. This method distributes the tension and expansion stress of the tape caused by a heating roller when laminating the tape on the lead frame, thereby preventing bending of the strip.
摘要:
A polymer for forming an organic anti-reflective coating layer between an etching layer and a photoresist layer to absorb an exposure light in a photolithography process and a composition comprising the same are disclosed. The polymer for forming an organic anti-reflective coating layer has repeating units represented by wherein, R is a substituted or non-substituted alky group of C1 to C5.
摘要:
A polymer for forming an organic anti-reflective coating layer between an etching layer and a photoresist layer to absorb an exposure light in a photolithography process and a composition comprising the same are disclosed. The polymer for forming an organic anti-reflective coating layer has repeating units represented by wherein, R is a substituted or non-substituted alky group of C1 to C5.
摘要:
Provided is a computer. The computer includes: a plurality of parts including heat-generating components that generate heat during operation; a case in which the parts are installed; and one or more heat-dissipating plates separated from the case by a predetermined distance and facing the case; wherein the heat-generating components include a central processing unit and a power supply, and the central processing unit and the power supply are each thermally connected to the heat-dissipating plates so that heat generated by the central processing unit and the power supply can be dissipated to the outside of the case via the heat-dissipating plates. Accordingly, the heat-generating components installed in the case can be noiselessly and efficiently cooled without using cooling fans.