公开(公告)号：US06510471B1

公开(公告)日：2003-01-21

申请号：US09392838

申请日：1999-09-09

Applicant: Manuel Joseph Alvarez, II ,  Kenneth Douglas Klapproth ,  David Mui

Inventor： Manuel Joseph Alvarez, II ,  Kenneth Douglas Klapproth ,  David Mui

IPC: G06F1300

CPC classification number: G06F9/542

Abstract: A method of transferring data between devices in a computer system. In a preferred embodiment, a requesting device broadcasts a request for data to other devices in the computer system. The computer system identifies, from a plurality of responding devices within the computer system, a target device that contains the data. In response to a determination that the target device does not support higher-performance transactions, the computer system disables higher-performance transactions and transfers the data to the requesting device via a lower-performance transaction process.

Abstract translation: 一种在计算机系统中的设备之间传送数据的方法。 在优选实施例中，请求设备向计算机系统中的其他设备广播对数据的请求。 计算机系统从计算机系统内的多个响应设备识别包含数据的目标设备。 响应于确定目标设备不支持更高性能的事务，计算机系统禁用更高性能的事务，并通过较低性能的事务处理将数据传送到请求设备。

公开(公告)号：US09159593B2

公开(公告)日：2015-10-13

申请号：US12485733

申请日：2009-06-16

Applicant: Mark Naoshi Kawaguchi ,  David Mui ,  Mark Wilcoxson

Inventor： Mark Naoshi Kawaguchi ,  David Mui ,  Mark Wilcoxson

IPC: B08B3/10 ,  H01L21/67 ,  H01L21/02 ,  B08B7/00 ,  C11D11/00 ,  C11D17/04

CPC classification number: H01L21/67051 ,  B08B3/10 ,  B08B7/0014 ,  C11D11/0047 ,  C11D11/0058 ,  C11D17/049 ,  H01L21/02052 ,  H01L21/02057

Abstract: Apparatus and methods for removing particle contaminants from a solid surface includes providing a layer of a viscoelastic material on the solid surface. The viscoelastic material is applied as a thin film and exhibits substantial liquid-like characteristics. The viscoelastic material at least partially binds with the particle contaminants. A high velocity liquid is applied to the viscoelastic material, such that the viscoelastic material exhibits solid-like behavior. The viscoelastic material is thus dislodged from the solid surface along with the particle contaminants, thereby cleaning the solid surface of the particle contaminants.

Abstract translation: 从固体表面去除颗粒污染物的装置和方法包括在固体表面上提供一层粘弹性材料。 粘弹性材料被用作薄膜并显示出显着的液体样特征。 粘弹性材料至少部分地与颗粒污染物结合。 将高速液体施加到粘弹性材料上，使得粘弹性材料表现出类固体状态。 因此粘弹性材料与颗粒污染物一起从固体表面脱落，从而清洁颗粒污染物的固体表面。

公开(公告)号：US09069563B2

公开(公告)日：2015-06-30

申请号：US13235174

申请日：2011-09-16

Applicant: Brian R. Konigsburg ,  David S. Levitan ,  Brian R. Mestan ,  David Mui

Inventor： Brian R. Konigsburg ,  David S. Levitan ,  Brian R. Mestan ,  David Mui

IPC: G06F9/312 ,  G06F9/38

CPC classification number: G06F9/3834 ,  G06F9/3838

Abstract: A technique for reducing store-hit-loads in an out-of-order processor includes storing a store address of a store instruction associated with a store-hit-load (SHL) pipeline flush in an SHL entry. In response to detecting another SHL pipeline flush for the store address, a current count associated with the SHL entry is updated. In response to the current count associated with the SHL entry reaching a first terminal count, a dependency for the store instruction is created such that execution of a younger load instruction with a load address that overlaps the store address stalls until the store instruction executes.

Abstract translation: 用于减少无序处理器中的存储命中负载的技术包括存储与存储命中加载（SHL）管线冲洗相关联的存储指令的存储地址在SHL条目中。 响应于检测存储地址的另一个SHL管道flush，更新与SHL条目相关联的当前计数。 响应于与SHL条目相关联的当前计数到达第一终端计数，创建存储指令的依赖关系，使得具有与存储地址重叠的加载地址的较年轻加载指令的执行停止，直到存储指令执行。

公开(公告)号：US08943299B2

公开(公告)日：2015-01-27

申请号：US12817609

申请日：2010-06-17

Applicant: Kattamuri Ekanadham ,  Brian R. Konigsburg ,  David S. Levitan ,  Jose E. Moreira ,  David Mui ,  Il Park

Inventor： Kattamuri Ekanadham ,  Brian R. Konigsburg ,  David S. Levitan ,  Jose E. Moreira ,  David Mui ,  Il Park

IPC: G06F9/30

CPC classification number: G06F9/30 ,  G06F9/30134 ,  G06F9/30163 ,  G06F9/3861

Abstract: A pointer is for pointing to a next-to-read location within a stack of information. For pushing information onto the stack: a value is saved of the pointer, which points to a first location within the stack as being the next-to-read location; the pointer is updated so that it points to a second location within the stack as being the next-to-read location; and the information is written for storage at the second location. For popping the information from the stack: in response to the pointer, the information is read from the second location as the next-to-read location; and the pointer is restored to equal the saved value so that it points to the first location as being the next-to-read location.

Abstract translation: 一个指针用于指向一堆信息中的下一个读取位置。 将信息推送到堆栈中：保存指针的值，该指针指向堆栈内的第一个位置作为下一个读取位置; 指针被更新，使得它指向堆栈内的第二位置作为下一个读取位置; 并且将信息写入第二位置处的存储。 为了从堆栈弹出信息：响应于指针，从第二位置读取信息作为下一个读取位置; 并且指针被恢复为等于保存的值，使得其指向作为下一个读取位置的第一位置。

公开(公告)号：US08585825B2

公开(公告)日：2013-11-19

申请号：US12262094

申请日：2008-10-30

Applicant: Grant Peng ,  David Mui ,  Shih-Chung Kon

Inventor： Grant Peng ,  David Mui ,  Shih-Chung Kon

IPC: B08B3/00 ,  B08B5/04

CPC classification number: H01L21/67051

Abstract: A method for cleaning a substrate is provided that includes applying a liquid medium to a surface of the substrate such that the liquid medium substantially covers a portion of the substrate that is being cleaned. One or more transducers are used to generate acoustic energy. The generated acoustic energy is applied to the substrate and the liquid medium meniscus such that the applied acoustic energy to the liquid medium prevents cavitation within the liquid medium. The acoustic energy applied to the substrate provides maximum acoustic wave displacement to acoustic waves introduced into the liquid medium. The acoustic energy introduced into the substrate and the liquid medium enables dislodging of the particle contaminant from the surface of the substrate. The dislodged particle contaminants become entrapped within the liquid medium and are carried away from the surface of the substrate by the liquid medium.

Abstract translation: 提供一种用于清洁衬底的方法，其包括将液体介质施加到衬底的表面，使得液体介质基本上覆盖正被清洁的衬底的一部分。 使用一个或多个换能器来产生声能。 产生的声能被施加到衬底和液体介质弯液面，使得向液体介质施加的声能防止液体介质内的气蚀。 施加到衬底的声能提供了引入到液体介质中的声波的最大声波位移。 引入到基底和液体介质中的声能使得能够从基底表面移除颗粒污染物。 脱落的颗粒污染物被捕获在液体介质中，并通过液体介质从基板的表面带走。

公开(公告)号：US20130073833A1

公开(公告)日：2013-03-21

申请号：US13235174

申请日：2011-09-16

Applicant: Brian R. Konigsburg ,  David S. Levitan ,  Brian R. Mestan ,  David Mui

Inventor： Brian R. Konigsburg ,  David S. Levitan ,  Brian R. Mestan ,  David Mui

IPC: G06F9/38 ,  G06F9/312

CPC classification number: G06F9/3834 ,  G06F9/3838

Abstract: A technique for reducing store-hit-loads in an out-of-order processor includes storing a store address of a store instruction associated with a store-hit-load (SHL) pipeline flush in an SHL entry. In response to detecting another SHL pipeline flush for the store address, a current count associated with the SHL entry is updated. In response to the current count associated with the SHL entry reaching a first terminal count, a dependency for the store instruction is created such that execution of a younger load instruction with a load address that overlaps the store address stalls until the store instruction executes.

Abstract translation: 用于减少无序处理器中的存储命中负载的技术包括存储与存储命中加载（SHL）管线冲洗相关联的存储指令的存储地址在SHL条目中。 响应于检测存储地址的另一个SHL管道flush，更新与SHL条目相关联的当前计数。 响应于与SHL条目相关联的当前计数到达第一终端计数，创建存储指令的依赖关系，使得具有与存储地址重叠的加载地址的较年轻加载指令的执行停止，直到存储指令执行。

公开(公告)号：US20120132235A1

公开(公告)日：2012-05-31

申请号：US13351114

申请日：2012-01-16

Applicant: Ji Zhu ,  Arjun Mendiratta ,  David Mui

Inventor： Ji Zhu ,  Arjun Mendiratta ,  David Mui

IPC: B08B3/08 ,  B08B5/04 ,  B08B3/02

CPC classification number: B08B3/02 ,  C11D3/2079 ,  C11D3/222 ,  C11D3/37 ,  C11D3/3707 ,  C11D3/3723 ,  C11D3/3753 ,  C11D3/3765 ,  C11D3/3773 ,  C11D3/378 ,  C11D3/43 ,  C11D7/265 ,  C11D7/268 ,  C11D7/5004 ,  C11D11/0047 ,  C11D17/0013 ,  C11D17/003 ,  Y10S134/902

Abstract: An apparatus is provided that includes a substrate support assembly for holding the semiconductor substrate and a dispense head for applying a cleaning material to clean the contaminants from the substrate surface. The dispense head extends across a length of the semiconductor substrate and is positioned proximate to the substrate surface at a distance of between about 0.1 mm and about 4.5 mm. The proximate position enables application of a force to the cleaning material as it is applied to the substrate surface as a film, and the cleaning material provided through the dispense head contains a cleaning liquid, a plurality of solid components, and polymers of a polymeric compound, each of the plurality of solid components and polymers being greater than zero and less than 3% of the cleaning material, the plurality of solid components and the polymers are dispersed for application through the dispense head.

Abstract translation: 提供了一种装置，其包括用于保持半导体基板的基板支撑组件和用于施加清洁材料以从基板表面清洁污染物的分配头。 分配头延伸穿过半导体衬底的长度，并且以约0.1mm至约4.5mm的距离定位在衬底表面附近。 靠近的位置使得当作为薄膜施加到基材表面时能够对清洁材料施加力，并且通过分配头提供的清洁材料含有清洁液体，多种固体组分和聚合物的聚合物 多个固体组分和聚合物中的每一个都大于零且小于清洁材料的3％，多个固体组分和聚合物通过分散头分散以供施用。

公开(公告)号：US20120132229A1

公开(公告)日：2012-05-31

申请号：US13351217

申请日：2012-01-16

Applicant: Ji Zhu ,  Arjun Mendiratta ,  David Mui

Inventor： Ji Zhu ,  Arjun Mendiratta ,  David Mui

IPC: B08B3/08

CPC classification number: B08B3/02 ,  C11D3/2079 ,  C11D3/222 ,  C11D3/37 ,  C11D3/3707 ,  C11D3/3723 ,  C11D3/3753 ,  C11D3/3765 ,  C11D3/3773 ,  C11D3/378 ,  C11D3/43 ,  C11D7/265 ,  C11D7/268 ,  C11D7/5004 ,  C11D11/0047 ,  C11D17/0013 ,  C11D17/003 ,  Y10S134/902

Abstract: A method is provided for receiving the wafer on a support, the support being configured for movement along a direction. While moving the wafer, dispensing a cleaning material to clean contaminants from the surface of the wafer, the dispensing applied as a film over a diameter length of the wafer. The cleaning material contains a cleaning liquid, a plurality of solid components, and polymers of a polymeric compound. Each of the plurality of solid components and polymers being greater than zero and less than 3% of the cleaning material, and wherein the polymers become soluble in the cleaning liquid and the solubilized polymers having long polymer chains that capture and entrap solid components and contaminants in the cleaning liquid. Then, rinsing the film off of the wafer with a rinsing meniscus. The rinsing meniscus applied along the diameter length of the wafer and the film is rinsed after the dispensing.

Abstract translation: 提供了一种用于在支撑件上接收晶片的方法，所述支撑件被配置为沿着方向移动。 在移动晶片时，分配清洁材料以清洁来自晶片表面的污染物，分配作为薄膜施加在晶片的直径长度上。 清洁材料包含清洁液体，多种固体组分和聚合物的聚合物。 多个固体组分和聚合物中的每一种都大于零且小于洗涤材料的3％，并且其中聚合物变得可溶于清洁液体，并且具有长的聚合物链的溶解聚合物捕获并捕获固体组分和污染物 清洗液。 然后，用冲洗弯液面从晶片上冲洗薄膜。 沿着晶片的直径长度施加的冲洗弯月面，并且在分配之后冲洗薄膜。

公开(公告)号：US20100313917A1

公开(公告)日：2010-12-16

申请号：US12485733

申请日：2009-06-16

Applicant: Mark Naoshi Kawaguchi ,  David Mui ,  Mark Wilcoxson

Inventor： Mark Naoshi Kawaguchi ,  David Mui ,  Mark Wilcoxson

IPC: B08B3/00 ,  C11D3/37

CPC classification number: H01L21/67051 ,  B08B3/10 ,  B08B7/0014 ,  C11D11/0047 ,  C11D11/0058 ,  C11D17/049 ,  H01L21/02052 ,  H01L21/02057

Abstract: Apparatus and methods for removing particle contaminants from a solid surface includes providing a layer of a viscoelastic material on the solid surface. The viscoelastic material is applied as a thin film and exhibits substantial liquid-like characteristics. The viscoelastic material at least partially binds with the particle contaminants. A high velocity liquid is applied to the viscoelastic material, such that the viscoelastic material exhibits solid-like behavior. The viscoelastic material is thus dislodged from the solid surface along with the particle contaminants, thereby cleaning the solid surface of the particle contaminants.

Abstract translation: 从固体表面去除颗粒污染物的装置和方法包括在固体表面上提供一层粘弹性材料。 粘弹性材料被用作薄膜并显示出显着的液体样特征。 粘弹性材料至少部分地与颗粒污染物结合。 将高速液体施加到粘弹性材料上，使得粘弹性材料表现出类固体状态。 因此粘弹性材料与颗粒污染物一起从固体表面脱落，从而清洁颗粒污染物的固体表面。

公开(公告)号：US20100258142A1

公开(公告)日：2010-10-14

申请号：US12423759

申请日：2009-04-14

Applicant: Mark Naoshi Kawaguchi ,  David Mui ,  Mark Wilcoxson

Inventor： Mark Naoshi Kawaguchi ,  David Mui ,  Mark Wilcoxson

IPC: B08B3/08 ,  B08B5/04 ,  C25F3/30

CPC classification number: B08B3/08 ,  B08B3/12 ,  B08B5/04 ,  H01L21/02052 ,  H01L21/02057 ,  H01L21/67051

Abstract: The embodiments provide apparatus and methods for removing particles from a substrate surface, especially from a surface of a patterned substrate (or wafer). The cleaning apparatus and methods have advantages in cleaning patterned substrates with fine features without substantially damaging the features on the substrate surface. The cleaning apparatus and methods involve using a viscoelastic cleaning material containing a polymeric compound with large molecular weight, such as greater than 10,000 g/mol. The viscoelastic cleaning material entraps at least a portion of the particles on the substrate surface. The application of a force on the viscoelastic cleaning material over a sufficiently short period time causes the material to exhibit solid-like properties that facilitate removal of the viscoelastic cleaning material along with the entrapped particles. A number of forces can be applied over a short period to access the solid-like nature of the viscoelastic cleaning material. Alternatively, when the temperature of the viscoelastic cleaning material is lowered, the visoelastic cleaning material also exhibits solid-like properties.

Abstract translation: 实施方案提供了用于从衬底表面，特别是从图案化衬底（或晶片）的表面去除颗粒的设备和方法。 清洁装置和方法在清洁具有精细特征的图案化基板而没有实质上损坏基板表面上的特征的优点。 清洁装置和方法涉及使用含有大分子量（例如大于10,000g / mol）的聚合化合物的粘弹性清洁材料。 粘弹性清洁材料截留在基底表面上的至少一部分颗粒。 在足够短的时间段内对粘弹性清洁材料施加力导致材料表现出类似固体的性质，其有助于去除粘弹性清洁材料以及夹带的颗粒。 可以在短时间内施加许多力以获得粘弹性清洁材料的固体样性质。 或者，当粘弹性清洁材料的温度降低时，粘弹性清洁材料也呈现固体状特性。