Abstract:
An exemplary manufacturing method of an inter-metal dielectric of a semiconductor device according to an embodiment of the present invention includes forming a first silicon-rich oxide (SRO) layer on a silicon substrate provided with or otherwise having a copper line layer therein, forming a plasma enhanced fluorosilicate glass (PEFSG) layer on the first SRO layer, plasma-treating the PEFSG layer, and forming a second SRO layer on the plasma-treated PEFSG layer. According to the present invention, the thickness of the second SRO layer of the inter-metal dielectric can be reduced. Consequently, process cost can be reduced, and the total thickness of the inter-metal dielectric can be reduced so as to lower the dielectric constant thereof, reduce the aspect ratio of any via holes that are subsequently formed in the inter-metal dielectric, and potentially increase the yield as a result of the reduced via hole aspect ratio.
Abstract:
Methods for improving an adhesive force between thin films of a semiconductor device. In one example embodiment, a method for improving an adhesive force between an HDP-CVD (High Density Plasma-Chemical Vapor Deposition) thin film and a nitride film includes forming a HDP-CVD thin film according to an HDP-CVD method in order to exert a compressive stress against a lower structure, and forming a nitride film on the HDP-CVD thin film that exerts a tensile stress that substantially cancels out the compressive stress.
Abstract:
Lowering the temperature at which an oxide layer is formed produces a passivation layer with improved adhesion characteristics and crack resistance. The method of forming the passivation layer includes first forming an intermetal dielectric layer over a lower metal layer of a semiconductor device. A via is formed in the intermetal dielectric layer. A metal line is formed on the via. A passivation layer is formed over the substrate including the metal line, the passivation layer being formed at a temperature of 300˜350° C. by a high density plasma chemical vapor deposition process.
Abstract:
Disclosed is a semiconductor device and a method of manufacturing a semiconductor device. A semiconductor device may include an insulating layer and a metal interconnection. An insulating layer may include a first layer including fluorine and a second layer including SRO (silicon rich oxide) having a dangling bond. A metal interconnection may be formed over the insulating layer.
Abstract:
Provided are a tape feeder for use in chip mounters that can reduce a chip feeding duration and prevent chips from being turned over or assuming wrong postures to feed the chips stably, and a chip mounting method. The tape feeder includes a second link having one end linked to a link shaft through which a first link and a pivot lever are combined and the other end in which a slot curved at a predetermined inclination is formed. The velocity at which a carrier tape is fed changes according to the inclination of the curve of the slot with respect to the moving direction of the first link, the curve contacting the contact unit upon the movement of the first link in a direction helping to rotate a ratchet gear.
Abstract:
A method and apparatus for removing false contours in a pulse number modulation (PNM) digital display device having a plasma display panel (PDP). The method involves a) comparing the input data with the comparison data and calculating a plurality of possible output data in consideration of an index error between the input data and error-diffused input data so that the false contours can be removed, the error-diffused input data being obtained by diffusing a quantization error that has occurred in pixels adjacent to the input data in the current frame; b) detecting an index error between the input data and the error-diffused input data; and c) selecting one from among the plurality of possible output data obtained in step a) in consideration of the index error detected in step b).
Abstract:
A method and apparatus are provided for separating a top print paper from a stack of print papers using print paper buckling. The print paper separating method and apparatus include a transporting element for transporting the print paper by contacting the top of the stack of print papers. A plurality of elastic fibers are provided to induce buckling of the print paper using an elastic force. The elastic fibers may be provided with an electrical ground.
Abstract:
An apparatus and a method for compensating phase errors in a wireless BSS. The invention compensates I/Q signal imbalances and phase errors occurring in base station systems each having a direct conversion transmitter according to the respective systems as well as continuously monitor and compensate the degree of the I/Q signal imbalances through its own feedback path in order to overcome phase distortion and I/Q signal imbalance occurring at RF terminals of the respective wireless base station systems each having a direct conversion transmitter, thereby ensuring phase linearity to the base station systems using the direct conversion transmitter while improving its performance.
Abstract:
A side openable can is disclosed. The side openable can has a bottom sealed end, a sidewall and a top sealed end. An opening means for producing an opening at the upper portion of the sidewall, is provided on the upper portion of the sidewall. In another embodiment, the opening means may have a tear flap formed integrally in the upper portion of the sidewall of the can and defined by a tear line. A tear lever is fixed to the outside surface of the tear flap and used for tearing the tear flap away from the can. A spout holder has a holding rim and a support rib. The spout holder is attached interiorly to the sidewall of the can with a front surface of the holding rim interiorly bonded to the sidewall of the can around the tear flap, the holding rim having an insertion slit along its inside edge. The support rib has a depression. In addition, a drinking spout has an insertion flange and an elastic expansion part. The insertion flange is formed along the side edge of the elastic expansion part and is inserted into and fixed by the holding rim of the spout holder. The elastic expansion part is elastically expanded upon tearing away of the tear flap.
Abstract:
Disclosed is a method of fabricating a microlens. The method includes forming a self assembly monolayer having a strong hydrophobicity on a substrate; forming a plurality of ink droplets on the self assembly monolayer by jetting a transparent ink using an inkjet apparatus, the transparent ink including a first solvent having a first boiling point, a second solvent having a second boiling point lower than the first boiling point and a silicon oxide (SiOx) solid material dispersed in the first and second solvents; and drying the plurality of ink droplets.