Abstract:
A rotary valve (1) includes a valve body (2) formed with a chamber communication passage (24) for flowing a main fluid and a vent communication passage (25) for discharging the main fluid and a cylindrical valve member (3) rotatably held in the valve body (2) and formed with a main passage (31) for flowing the main fluid. The cylindrical valve member (3) is rotated to switch the connection of the main passage (31) between the chamber communication passage (24) and the vent communication passage (25). The rotary switching valve (1) further includes a purge gas passage for passing purge gas in a clearance (11) between the valve body (2) and the cylindrical valve member (3), the purge gas being supplied to the clearance (11) to prevent the main fluid from leaking out of the main passage (31).
Abstract:
[Object] To provide a phase-change-type heat spreader, a flow-path structure, an electronic apparatus including the phase-change-type heat spreader, a flow-path structure used therein, and the like that are capable of improving a thermal efficiency by a phase change and lowering a thermal resistance.[Solving Means] Capillary boards (401 to 404) in which a plurality of openings (408) penetrating the capillary boards are formed on a wall surface constituting grooves (405) in a longitudinal direction of the grooves (405), are laminated while each being rotated 90 degrees to be deviated within an X-Y plane so that the grooves (405) of those layers extend in mutually-orthogonal directions, and the plurality of openings (408) function as a part of a vapor-phase flow path through which a vapor refrigerant evaporated by heat received by a heat-receiving plate circulates.
Abstract:
A rotary valve (1) includes a valve body (2) formed with a chamber communication passage (24) for flowing a main fluid and a vent communication passage (25) for discharging the main fluid and a cylindrical valve member (3) rotatably held in the valve body (2) and formed with a main passage (31) for flowing the main fluid. The cylindrical valve member (3) is rotated to switch the connection of the main passage (31) between the chamber communication passage (24) and the vent communication passage (25). The rotary switching valve (1) further includes a purge gas passage for passing purge gas in a clearance (11) between the valve body (2) and the cylindrical valve member (3), the purge gas being supplied to the clearance (11) to prevent the main fluid from leaking out of the main passage (31).
Abstract:
A heat-transport device, which is suitable for reduction in volume and thickness, includes a wick that generates capillary action to reflux working fluid and a line in which a liquid- or vapor-phase working fluid flows, wherein the surface of at least one of the wick and the line are subjected to coating treatment by ion implantation, thermal oxidation, or steam oxidation to prevent the generation of gas, particularly hydrogen.
Abstract:
A heat-transporting device includes a working fluid, a vessel, a vapor-phase flow path, a liquid-phase flow path, and an intermediate layer. The working fluid transports heat using a phase change. The vessel seals in the working fluid. The vapor-phase flow path causes the working fluid in a vapor phase to circulate inside the vessel. The liquid-phase flow path includes a first mesh member having a first mesh number and causes the working fluid in a liquid phase to circulate inside the vessel. The intermediate layer includes a second mesh member and is interposed between the liquid-phase flow path and the vapor-phase flow path, the second mesh member being laminated on the first mesh member and having a second mesh number smaller than the first mesh number.
Abstract:
A heat-transporting device includes a working fluid, a vessel, a vapor-phase flow path, and a liquid-phase flow path. The working fluid transports heat using a phase change. The vessel seals in the working fluid. The vapor-phase flow path includes a first mesh member and causes the working fluid in a vapor phase to circulate inside the vessel, the first mesh member including a through-hole larger than a mesh thereof. The liquid-phase flow path causes the working fluid in a liquid phase to circulate inside the vessel.
Abstract:
According to an aspect of the present invention, there is provided an electronic device including: a substrate board; a semiconductor device mounted on the substrate board; a heat sink configured to radiate heat from the semiconductor device; a first conductive portion provided on the substrate board; and a second conductive portion provided on the substrate board, the second conductive portion separated from the first conductive portion by a discharge gap, wherein: the heat sink is electrically connected to the first conductive portion; and the second conductive portion is grounded.
Abstract:
To provide a low-cost air-operated valve, an air-operated valve comprises a piston, a cylinder in which the piston is allowed to slide by operation air, and a valve section to be driven by sliding movement of the piston. The cylinder includes an outer member having a hollow portion and an inner member loaded in the hollow portion of the outer member to define a piston chamber in which the piston is allowed to slide.
Abstract:
A heat-transport device, which is suitable for reduction in volume and thickness, includes a wick that generates capillary action to reflux working fluid and a line in which a liquid- or vapor-phase working fluid flows, wherein the surface of at least one of the wick and the line are subjected to coating treatment by ion implantation, thermal oxidation, or steam oxidation to prevent the generation of gas, particularly hydrogen.
Abstract:
The present invention provides a cooling device having improved cooling performance and providing higher flexibility, an electronic apparatus and an acoustic apparatus employing the cooling device, and a method for producing the cooling device. The cooling device is provided with an evaporator that is capable of cooling an object to be cooled, and a condenser that is capable of releasing to the outside heat that has been absorbed during the cooling by the evaporator. A vapor-phase conduit and a liquid-phase conduit, both of which are made of fluorocarbon resin and through which an operating medium flows, are disposed between and coupled to the evaporator and the condenser, thereby circulating the operating medium.