公开(公告)号：US09145941B2

公开(公告)日：2015-09-29

申请号：US13989923

申请日：2011-11-24

Applicant: Takashi Yajima ,  Kenichiro Morino

Inventor： Takashi Yajima ,  Kenichiro Morino

IPC: F16F1/04 ,  B21D22/14 ,  B21D41/04 ,  B21F35/00 ,  B21D11/06

CPC classification number: F16F1/042 ,  B21D11/06 ,  B21D22/14 ,  B21D41/045 ,  B21F35/00 ,  Y10T29/49609

Abstract: In an end sealing step, an end is sealed by which the core material of the end of a spring member is gathered by machining. For example, a squeezing roller is moved in an axial direction as necessary, while the end of the spring member is pressed to the inside in a radial direction by the squeezing roller. As a result, the end of the spring member is sealed and therefore, it is not necessary to use another member such as a lid member. For example, the end sealing step can be immediately carried out after an inner surface processing step. In a coil forming step after the end sealing step, formation of clearance can be prevented at the end even if the end of the spring member is gripped and the spring member is wound around the rod.

Abstract translation: 在端部密封步骤中，密封端部，通过该端部通过机械加工来聚集弹簧构件的端部的芯材。 例如，挤压辊根据需要沿轴向移动，同时弹簧构件的端部通过挤压辊在径向方向上被按压到内部。 结果，弹簧构件的端部被密封，因此不需要使用诸如盖构件的其他构件。 例如，可以在内表面处理步骤之后立即进行端部密封步骤。 在端密封步骤之后的线圈形成步骤中，即使弹簧构件的端部被夹持并且弹簧构件缠绕在杆上，也可以最终形成间隙。

公开(公告)号：US08460483B2

公开(公告)日：2013-06-11

申请号：US13052522

申请日：2011-03-21

Applicant: Takashi Yajima ,  Hideki Okada ,  Katsuyuki Nishioka ,  Takeshi Furuse

Inventor： Takashi Yajima ,  Hideki Okada ,  Katsuyuki Nishioka ,  Takeshi Furuse

IPC: C21D9/02 ,  C21D8/02

CPC classification number: C21D9/02

Abstract: A method for heat treatment of a coiled spring includes cold forming a coiled spring, annealing the coiled spring after the cold forming, thereby removing of residual stress generated in the cold forming, in which the annealing is performed by electric resistance heating.

Abstract translation: 螺旋弹簧的热处理方法包括：冷成形螺旋弹簧，在冷成型后对螺旋弹簧进行退火，从而消除在冷加工中产生的残余应力，其中通过电阻加热进行退火。

公开(公告)号：US20130099435A1

公开(公告)日：2013-04-25

申请号：US13807100

申请日：2011-06-23

Applicant: Takayuki Matsuoto ,  Kazuhisa Michibata ,  Satoshi Ieiri ,  Takashi Yajima

Inventor： Takayuki Matsuoto ,  Kazuhisa Michibata ,  Satoshi Ieiri ,  Takashi Yajima

IPC: F16F1/06

CPC classification number: F16F1/06 ,  F16F1/047 ,  F16F1/123

Abstract: A coil spring has an effective section that functions as a spring when a load in a coil axis direction has been applied, end turn sections that are formed on both ends of the effective section, and rising sections that are formed between the effective section and the end turn sections, wherein the rising sections are formed in such a way that, when θ1 represents the pitch angle of the rising sections and θ2 represents the pitch angle of the effective section, pitch angle θ1> pitch angle θ2 holds true in at least one of the rising sections.

Abstract translation: 螺旋弹簧具有作为弹簧的有效部，当施加线圈轴方向上的负载时，形成在有效部的两端的端部转弯部以及形成在有效部和 其中上升部分形成为当θ1表示上升部分的俯仰角，θ2表示有效部分的俯仰角时，俯仰角θ1>俯仰角θ2在至少一个 的上升部分。

公开(公告)号：US20100008043A1

公开(公告)日：2010-01-14

申请号：US12496944

申请日：2009-07-02

Applicant: Takashi Yajima ,  Hiroyuki Ryoson ,  Kazuo Goto

Inventor： Takashi Yajima ,  Hiroyuki Ryoson ,  Kazuo Goto

IPC: H05K7/20 ,  F28D15/02 ,  F28D15/00 ,  B23K26/00 ,  F16J15/02

CPC classification number: F16J15/0881 ,  F28D15/0233 ,  F28D15/0283 ,  F28D15/046 ,  G06F1/203 ,  G06F2200/201 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A heat-transporting device includes a casing, a working fluid, a first substrate, a second substrate, and a third substrate. The casing includes a first side and a second side opposed to the first side. The working fluid is sealed inside the casing and transports heat by a phase change. The first substrate includes an inlet through which the working fluid is injected and constitutes the first side of the casing. The second substrate is disposed opposite to the first substrate and constitutes the second side of the casing. The third substrate includes a contact portion that is brought into contact with the inlet so that the inlet is sealed when the inlet is pressed, the third substrate being interposed between the first substrate and the second substrate.

Abstract translation: 热输送装置包括壳体，工作流体，第一基板，第二基板和第三基板。 壳体包括与第一侧相对的第一侧和第二侧。 工作流体被密封在壳体内并通过相变传递热量。 第一基板包括入口，工作流体通过该入口构成壳体的第一侧。 第二基板与第一基板相对设置并构成壳体的第二侧。 第三基板包括与入口接触的接触部分，使得当入口被按压时入口被密封，第三基板插入在第一基板和第二基板之间。

公开(公告)号：US20090323285A1

公开(公告)日：2009-12-31

申请号：US12489701

申请日：2009-06-23

Applicant: Hiroyuki RYOSON ,  Takashi YAJIMA ,  Mitsuo HASHIMOTO ,  Toshiro OOTA ,  Tatsuhiko SHIGEMOTO ,  Kazuo GOTO

Inventor： Hiroyuki RYOSON ,  Takashi YAJIMA ,  Mitsuo HASHIMOTO ,  Toshiro OOTA ,  Tatsuhiko SHIGEMOTO ,  Kazuo GOTO

IPC: H05K7/20 ,  F28D15/02

CPC classification number: F28D15/046 ,  F28D15/0233 ,  G06F1/203 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A heat transport device includes an airtight container, a working fluid contained in the airtight container, and a plurality of plate-like members including a first plate-like member and a second plate-like member adjacent to the first plate-like member, the plate-like members each having a first hole having a first opening area and a second hole having a second opening area smaller than the first opening area, the plate-like members being layered in the airtight container so that the first hole of the first plate-like member and the first hole of the second plate-like member are communicated with each other, to retain the working fluid in a liquid phase by applying a capillary force to the working fluid, and so that an opening of the second hole is located within an opening of the first hole, to transfer the working fluid vaporized into a gas phase in the layered direction.

Abstract translation: 热输送装置包括气密容器，容纳在气密容器中的工作流体，以及包括与第一板状构件相邻的第一板状构件和第二板状构件的多个板状构件， 板状构件具有第一孔和第二孔，第一孔具有第一开口面积，第二孔具有比第一开口面积小的第二开口面积，板状构件层压在密封容器中，使得第一板的第一孔 第二板状构件的第一孔彼此连通，通过向工作流体施加毛细作用力将工作流体保持在液相中，并且使得第二孔的开口位于 在第一孔的开口内，将被蒸发的工作流体沿分层方向转移到气相中。

公开(公告)号：US07500660B2

公开(公告)日：2009-03-10

申请号：US10569787

申请日：2004-08-20

Applicant: Teruhisa Hanamura ,  Hidetaka Narishima ,  Takashi Yajima

Inventor： Teruhisa Hanamura ,  Hidetaka Narishima ,  Takashi Yajima

IPC: F16F1/14

CPC classification number: B60G21/055 ,  B60G2206/427 ,  B60G2206/724 ,  B60G2206/81 ,  B60G2206/8103 ,  B60G2206/81035 ,  B60G2206/811

Abstract: To provide a vehicle stabilizer for high stress in which fatigue life of a bending portion can be prolonged and which can exhibit excellent durability. A configuration of a bending portion 16, to which a maximum stress is applied and which is the most fragile part, of a vehicle stabilizer for high stress 10 is formed in a state which satisfies conditions: 0

Abstract translation: 本发明提供一种能够延长弯曲部的疲劳寿命并能够表现出优异的耐久性的高应力的车辆用稳定装置。 在满足条件：0

公开(公告)号：USD549077S1

公开(公告)日：2007-08-21

申请号：US29258281

申请日：2006-04-20

Applicant: Takashi Yajima ,  Katsunori Hirose

Designer： Takashi Yajima ,  Katsunori Hirose

公开(公告)号：US5777358A

公开(公告)日：1998-07-07

申请号：US535857

申请日：1995-09-28

Applicant: Takashi Yajima

Inventor： Takashi Yajima

IPC: H01L21/02 ,  H01L21/8242 ,  H01L27/105 ,  H01L27/108 ,  H01L29/92 ,  H01L29/76 ,  H01L29/94 ,  H01L31/119

CPC classification number: H01L27/10808 ,  H01L28/40 ,  H01L27/105

Abstract: A novel structure of a semiconductor memory device on a silicon substrate comprising: a first area on which stacked capacitor memory cells comprising top and bottom electrodes sandwiching a dielectric film are formed; a second area including at least a contact hole in which at least a wiring layer is formed; and a plurality of inter-layer insulators extending over both the first and second areas, wherein: the a plurality of inter-layer insulators have two different total thickness between the first and second areas so that the total thickness on the first area is larger than that on the second area to thereby sufficiently reduce an aspect ratio of the at least a contact hole on the second area for allowing the wiring layer in the contact hole to have a good step coverage as well as allowing a top inter-layer insulator to have a gentle slope with a good step coverage at a boundary between the first and second areas.

Abstract translation: 一种在硅衬底上的半导体存储器件的新颖结构，包括：第一区域，其上形成层叠电容器存储单元的顶部和底部电极夹着电介质膜; 至少包括至少形成有布线层的接触孔的第二区域; 以及在所述第一和第二区域上延伸的多个层间绝缘体，其中：所述多个层间绝缘体在所述第一和第二区域之间具有两个不同的总厚度，使得所述第一区域上的总厚度大于 在第二区域，从而充分地减小第二区域上的至少接触孔的纵横比，以允许接触孔中的布线层具有良好的台阶覆盖以及允许顶层绝缘体具有 一个平缓的斜坡，在第一和第二区域之间的边界处具有良好的台阶覆盖。

公开(公告)号：US20130292890A1

公开(公告)日：2013-11-07

申请号：US13989923

申请日：2011-11-24

Applicant: Takashi Yajima ,  Kenichiro Morino

Inventor： Takashi Yajima ,  Kenichiro Morino

IPC: F16F1/04

CPC classification number: F16F1/042 ,  B21D11/06 ,  B21D22/14 ,  B21D41/045 ,  B21F35/00 ,  Y10T29/49609

Abstract: In an end sealing step, an end is sealed by which the core material of the end of a spring member is gathered by machining. For example, a squeezing roller is moved in an axial direction as necessary, while the end of the spring member is pressed to the inside in a radial direction by the squeezing roller. As a result, the end of the spring member is sealed and therefore, it is not necessary to use another member such as a lid member. For example, the end sealing step can be immediately carried out after an inner surface processing step. In a coil forming step after the end sealing step, formation of clearance can be prevented at the end even if the end of the spring member is gripped and the spring member is wound around the rod.

Abstract translation: 在端部密封步骤中，密封端部，通过该端部通过机械加工来聚集弹簧构件的端部的芯材。 例如，挤压辊根据需要沿轴向移动，同时弹簧构件的端部通过挤压辊在径向方向上被按压到内部。 结果，弹簧构件的端部被密封，因此不需要使用诸如盖构件的其他构件。 例如，可以在内表面处理步骤之后立即进行端部密封步骤。 在端密封步骤之后的线圈形成步骤中，即使弹簧构件的端部被夹持并且弹簧构件缠绕在杆上，也可以最终形成间隙。

公开(公告)号：US20110182035A1

公开(公告)日：2011-07-28

申请号：US12939847

申请日：2010-11-04

Applicant: Takashi Yajima

Inventor： Takashi Yajima

IPC: H05K7/20

CPC classification number: H05K7/20963 ,  H01L23/40 ,  H01L23/433 ,  H01L23/60 ,  H01L2924/0002 ,  H01L2924/15311 ,  H01L2924/00

Abstract: An electronic apparatus includes: a semiconductor device including an electrically conductive portion to be grounded, the semiconductor device being configured to be mounted on a circuit board; a heat sink configured to radiate heat generated by the semiconductor device; a fastener configured to fasten the heat sink to the circuit board; and a first spring member wound around the fastener to electrically connect the heat sink to the electrically conductive portion.

Abstract translation: 电子设备包括：半导体器件，包括待接地的导电部分，所述半导体器件被配置为安装在电路板上; 散热器，被配置为辐射由所述半导体器件产生的热量; 紧固件，其被配置为将所述散热器紧固到所述电路板; 以及围绕所述紧固件缠绕的第一弹簧构件，以将所述散热器电连接到所述导电部分。