-
1.发明申请PHASE-CHANGE-TYPE HEAT SPREADER, FLOW-PATH STRUCTURE, ELECTRONIC APPARATUS,AND METHOD OF PRODUCING A PHASE-CHANGE-TYPE HEAT SPREADER 审中-公开相变型热交换器，流路结构，电子设备以及生产相变型热交换器的方法公开(公告)号：US20100326632A1
公开(公告)日：2010-12-30
申请号：US12733567
申请日：2008-08-08
CPC分类号： H01L23/427 , F28D15/0233 , F28D15/046 , F28F3/086 , H01L2924/0002 , Y10T29/4935 , H01L2924/00
摘要： [Object] To provide a phase-change-type heat spreader, a flow-path structure, an electronic apparatus including the phase-change-type heat spreader, a flow-path structure used therein, and the like that are capable of improving a thermal efficiency by a phase change and lowering a thermal resistance.[Solving Means] Capillary boards (401 to 404) in which a plurality of openings (408) penetrating the capillary boards are formed on a wall surface constituting grooves (405) in a longitudinal direction of the grooves (405), are laminated while each being rotated 90 degrees to be deviated within an X-Y plane so that the grooves (405) of those layers extend in mutually-orthogonal directions, and the plurality of openings (408) function as a part of a vapor-phase flow path through which a vapor refrigerant evaporated by heat received by a heat-receiving plate circulates.
摘要翻译： 本发明提供一种相变型散热器，流路结构，包括相变型散热器的电子设备，其中使用的流路结构等，其能够改善 通过相变的热效率和降低热阻。 [解决方案]在构成槽（405）的沿槽（405）的长度方向的壁面上形成贯穿毛细管的多个开口（408）的毛细管板（401〜404） 旋转90度以在XY平面内偏离，使得那些层的凹槽（405）在相互正交的方向上延伸，并且多个开口（408）用作气相流动路径的一部分，通过该气相流路 由受热板接受的热量蒸发的蒸气制冷剂循环。
-
2.发明申请公开(公告)号：US20110253345A1
公开(公告)日：2011-10-20
申请号：US13141121
申请日：2009-12-11
申请人： Hiroyuki Ryoson , Takashi Yajima , Kazunao Oniki , Hiroto Kasai , Koji Hirata , Mitsuo Hashimoto
发明人： Hiroyuki Ryoson , Takashi Yajima , Kazunao Oniki , Hiroto Kasai , Koji Hirata , Mitsuo Hashimoto
IPC分类号： F28D15/04
CPC分类号： F28D15/046 , B23K20/02 , B23K20/16 , B23K2101/14 , F28D15/0233 , F28D15/0283 , H01L2924/0002 , Y10T29/49393 , H01L2924/00
摘要： [Object] To provide a low-cost production method for a heat transportation device with which efficient production with a small number of steps is possible.[Solving Means] A capillary member (5) having a larger thickness than a frame member (2) is mounted on an inner surface (11) of a lower plate member (1). Subsequently, the frame member (2) is mounted on the inner surface (11) of the lower plate member (1), and an upper plate member (3) is mounted on the capillary member (5). Due to a difference between the thickness of the capillary member (5) and the thickness of the frame member (2), a squashing amount (G) is provided between the frame member (2) and the upper plate member (3). Then, the lower plate member (1) and the upper plate member (3) are diffusion-bonded with the frame member (2). At this time, the capillary member (5) is compressed by an amount corresponding to the squashing amount (G). Since the capillary member (5) has elasticity, a pressure (P) is partially absorbed, and a pressure (P′) smaller than the pressure (P) is applied to the lower plate member (1) from the capillary member (5). By the pressure (P′), the inner surface (11) of the lower plate member (1) and the capillary member (5) are diffusion-bonded.
摘要翻译： 本发明提供一种低成本的用于具有少量步骤的有效生产的热运输装置的生产方法。 [解决方案]具有比框架构件（2）更大的厚度的毛细管构件（5）安装在下板构件（1）的内表面（11）上。 随后，将框架构件（2）安装在下板构件（1）的内表面（11）上，并将上板构件（3）安装在毛细管构件（5）上。 由于毛细构件（5）的厚度和框架构件（2）的厚度之间的差异，在框架构件（2）和上板构件（3）之间设置有挤压量（G）。 然后，下板构件（1）和上板构件（3）与框架构件（2）扩散接合。 此时，毛细管构件（5）被压缩相当于挤压量（G）的量。 由于毛细管构件（5）具有弹性，部分地吸收压力（P），并且从毛细管构件（5）向下板构件（1）施加小于压力（P）的压力（P'）， 。 通过压力（P'），下板构件（1）的内表面（11）和毛细管构件（5）是扩散粘合的。
-
公开(公告)号：US20070227704A1
公开(公告)日：2007-10-04
申请号：US11685561
申请日：2007-03-13
申请人： Hiroyuki Nagai , Hiroyuki Ryoson
发明人： Hiroyuki Nagai , Hiroyuki Ryoson
IPC分类号： H05K7/20
CPC分类号： F28D15/06 , F28D15/0233 , F28D15/046 , F28F3/048 , H01L23/427 , H01L2924/0002 , H01L2924/12044 , H01L2924/00
摘要： A plate-type heat transport device and electronic instrument are provided. The plate-type heat transport device includes a heat absorbing plane absorbing heat because of the evaporation of a working fluid, a heat emission plane opposing the heat absorbing plane and emitting heat because of the condensation of the working fluid, and a flow path two-dimensionally arranged between the heat absorbing plane and the heat emission plane to align with the heat absorbing plane and the heat emission plane, the flow path allowing the working fluid to flow therethrough for changing the phase of the working fluid, and the flow path being capable of two-dimensionally diffusing the working fluid by generating a capillary force in the condensed working fluid.
摘要翻译： 提供板式热输送装置和电子仪器。 板式热传输装置包括由于工作流体的蒸发而吸收热量的吸热平面，与吸热面相对的发热面，由于工作流体的冷凝而发热， 三维排列在吸热面和发热面之间，以与吸热面和发热面对准，流路允许工作流体流过其中，以改变工作流体的相位，流路能够 通过在冷凝的工作流体中产生毛细管力二维扩散工作流体。
-
4.发明授权公开(公告)号：US08391007B2
公开(公告)日：2013-03-05
申请号：US12536996
申请日：2009-08-06
CPC分类号： H05K7/208 , F28D15/0233 , F28F2245/02 , F28F2245/04 , H01L2924/0002 , Y10T29/4935 , H01L2924/00
摘要： According to an embodiment, there is provided a heat spreader including an evaporation portion, a first condenser portion, a working fluid, and a first flow path. The evaporation portion is arranged in a first position. The first condenser portion is arranged in a second position, the second position being arranged apart from and higher than the first position. The working fluid evaporates from a liquid phase to a gas phase in the evaporation portion, and condenses from the gas phase to the liquid phase in the first condenser portion. The first flow path is made of a nanomaterial, has hydrophobicity on a surface, and causes the working fluid condensed to the liquid phase in the first condenser portion to flow to the evaporation portion by a gravitational force.
摘要翻译： 根据一个实施例，提供了一种散热器，其包括蒸发部分，第一冷凝器部分，工作流体和第一流动路径。 蒸发部分布置在第一位置。 第一冷凝器部分布置在第二位置，第二位置被布置成与第一位置分开并高于第一位置。 工作流体在蒸发部分中从液相蒸发到气相，并在第一冷凝器部分中从气相冷凝成液相。 第一流路由纳米材料制成，在表面上具有疏水性，并使第一冷凝器部分中冷凝到液相的工作流体通过重力流向蒸发部分。
-
5.发明申请HEAT TRANSPORT DEVICE, ELECTRONIC APPARATUS, AND HEAT TRANSPORT DEVICE MANUFACTURING METHOD 审中-公开热交换装置，电子装置和热输送装置的制造方法公开(公告)号：US20100254088A1
公开(公告)日：2010-10-07
申请号：US12730593
申请日：2010-03-24
CPC分类号： H05K7/203 , F28D15/02 , F28D15/046 , F28F23/00 , G06F1/20 , G06F2200/201 , Y10T29/4935
摘要： According to an embodiment of the present invention, there is provided a heat transport device including a working fluid, an evaporation portion, a condenser portion, a flow path portion, and an area. The working fluid includes pure water and an organic compound bearing a hydroxyl group. The evaporation portion causes the working fluid to evaporate from a liquid phase to a vapor phase. The condenser portion communicates with the evaporation portion, and causes the working fluid to condense from the vapor phase to the liquid phase. The flow path portion causes the working fluid condensed in the condenser portion to the liquid phase to flow to the evaporation portion. The area is made of a carbon material and provided on at least one of the evaporation portion, the condenser portion, and the flow path portion.
摘要翻译： 根据本发明的实施例，提供了一种包括工作流体，蒸发部分，冷凝器部分，流路部分和区域的热传输装置。 工作流体包括纯水和带有羟基的有机化合物。 蒸发部分使工作流体从液相蒸发成气相。 冷凝器部与蒸发部连通，使工作流体从气相冷凝成液相。 流路部使冷凝部冷凝的液相流向蒸发部。 该区域由碳材料制成并且设置在蒸发部分，冷凝器部分和流动路径部分中的至少一个上。
-
6.发明申请HEAT-TRANSPORTING DEVICE, ELECTRONIC APPARATUS, SEALING APPARATUS, SEALING METHOD, AND METHOD OF PRODUCING A HEAT-TRANSPORTING DEVICE 审中-公开热交换装置，电子设备，密封装置，密封方法和制造热交换装置的方法公开(公告)号：US20100008043A1
公开(公告)日：2010-01-14
申请号：US12496944
申请日：2009-07-02
申请人： Takashi Yajima , Hiroyuki Ryoson , Kazuo Goto
发明人： Takashi Yajima , Hiroyuki Ryoson , Kazuo Goto
CPC分类号： F16J15/0881 , F28D15/0233 , F28D15/0283 , F28D15/046 , G06F1/203 , G06F2200/201 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A heat-transporting device includes a casing, a working fluid, a first substrate, a second substrate, and a third substrate. The casing includes a first side and a second side opposed to the first side. The working fluid is sealed inside the casing and transports heat by a phase change. The first substrate includes an inlet through which the working fluid is injected and constitutes the first side of the casing. The second substrate is disposed opposite to the first substrate and constitutes the second side of the casing. The third substrate includes a contact portion that is brought into contact with the inlet so that the inlet is sealed when the inlet is pressed, the third substrate being interposed between the first substrate and the second substrate.
摘要翻译： 热输送装置包括壳体，工作流体，第一基板，第二基板和第三基板。 壳体包括与第一侧相对的第一侧和第二侧。 工作流体被密封在壳体内并通过相变传递热量。 第一基板包括入口，工作流体通过该入口构成壳体的第一侧。 第二基板与第一基板相对设置并构成壳体的第二侧。 第三基板包括与入口接触的接触部分，使得当入口被按压时入口被密封，第三基板插入在第一基板和第二基板之间。
-
7.发明申请HEAT TRANSPORT DEVICE, ELECTRONIC APPARATUS, AND HEAT TRANSPORT MANUFACTURING METHOD 审中-公开热输送装置，电子装置和热运输制造方法公开(公告)号：US20100252237A1
公开(公告)日：2010-10-07
申请号：US12729713
申请日：2010-03-23
IPC分类号： F28D15/00
CPC分类号： F28D15/046 , H01L23/427 , H01L2924/0002 , H05K7/2029 , H05K7/20481 , H01L2924/00
摘要： A heat transport device includes a working fluid, an evaporation portion, a condenser portion, a flow path portion, a concave portion, and a protrusion portion. The evaporation portion causes the working fluid to evaporate from a liquid phase to a vapor phase. The condenser portion communicates with the evaporation portion, and causes the working fluid to condense from the vapor phase to the liquid phase. The flow path portion causes the working fluid condensed in the condenser portion to the liquid phase to flow to the evaporation portion. The concave portion is provided on at least one of the evaporation portion and the flow path portion, in which the liquid-phase working fluid flows. The protrusion portion is made of nanomaterial protruding from an inner wall side surface of the concave portion such that the protrusion portion partially covers an opening surface of the concave portion.
摘要翻译： 热传输装置包括工作流体，蒸发部，冷凝器部，流路部，凹部和突出部。 蒸发部分使工作流体从液相蒸发成气相。 冷凝器部与蒸发部连通，使工作流体从气相冷凝成液相。 流路部使冷凝部冷凝的液相流向蒸发部。 凹部设置在液相工作流体流过的蒸发部和流路部中的至少一个上。 突出部分由从凹部的内壁侧表面突出的纳米材料制成，使得突出部分部分地覆盖凹部的开口表面。
-
8.发明申请公开(公告)号：US20100053899A1
公开(公告)日：2010-03-04
申请号：US12552794
申请日：2009-09-02
CPC分类号： F28D15/046 , H01L23/373 , H01L23/427 , H01L2924/0002 , Y10T29/4935 , H01L2924/00
摘要： According to an embodiment, there is provided a heat spreader including a condenser portion formed of a nanomaterial. The heat spreader further includes a first plate member, a second plate member, and a support portion. The first plate member includes a first surface, the first surface including a first area provided with the condenser portion. The second plate member includes a second surface and is arranged such that the second surface faces the first surface. The support portion protrudes from the first area of the first plate member to the second plate member, and has an end portion that is free from the nanomaterial and is in contact with the second surface of the second plate member.
摘要翻译： 根据实施例，提供一种散热器，其包括由纳米材料形成的冷凝器部分。 散热器还包括第一板构件，第二板构件和支撑部。 第一板构件包括第一表面，第一表面包括设置有冷凝器部分的第一区域。 第二板构件包括第二表面，并且被布置成使得第二表面面向第一表面。 支撑部从第一板构件的第一区域突出到第二板构件，并且具有远离纳米材料并与第二板构件的第二表面接触的端部。
-
9.发明申请公开(公告)号：US20100033933A1
公开(公告)日：2010-02-11
申请号：US12536996
申请日：2009-08-06
CPC分类号： H05K7/208 , F28D15/0233 , F28F2245/02 , F28F2245/04 , H01L2924/0002 , Y10T29/4935 , H01L2924/00
摘要： According to an embodiment, there is provided a heat spreader including an evaporation portion, a first condenser portion, a working fluid, and a first flow path. The evaporation portion is arranged in a first position. The first condenser portion is arranged in a second position, the second position being the first position. The working fluid evaporates from a liquid phase to a gas phase in the evaporation portion, and condenses from the gas phase to the liquid phase in the first condenser portion. The first flow path is made of a nanomaterial, has hydrophobicity on a surface, and causes the working fluid condensed to the liquid phase in the first condenser portion to flow to the evaporation portion.
摘要翻译： 根据一个实施例，提供了一种散热器，其包括蒸发部分，第一冷凝器部分，工作流体和第一流动路径。 蒸发部分布置在第一位置。 第一冷凝器部分布置在第二位置，第二位置是第一位置。 工作流体在蒸发部分中从液相蒸发到气相，并在第一冷凝器部分中从气相冷凝成液相。 第一流路由纳米材料制成，在表面上具有疏水性，并且使在第一冷凝器部分中冷凝到液相的工作流体流向蒸发部分。
-
公开(公告)号：US20110005724A1
公开(公告)日：2011-01-13
申请号：US12867967
申请日：2009-12-11
申请人： Hiroto Kasai , Hiroyuki Ryoson , Takashi Yajima , Koji Hirata
发明人： Hiroto Kasai , Hiroyuki Ryoson , Takashi Yajima , Koji Hirata
CPC分类号： F28D15/0233 , B23K20/02 , B23K20/16 , F28D15/046 , H01L21/4882 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： [Object] To provide a heat transport device manufacturing method and a heat transport device that has a high hermeticity and is manufactured without increasing a load applied at a time of performing diffusion bonding.[Solving Means] A bonding surface (1a) of an upper member (1) that is subjected to diffusion bonding to a bonding surface (21) of a frame member (2) is formed into a convex shape, which can make a contact area of the bonding surface (1a) and the bonding surface (21) small. Therefore, a pressure (load per unit area) applied to the bonding surfaces (1a and 21) is increased, and thus the diffusion bonding of the bonding surfaces (1a and 21) is performed by a high pressure. Similarly, a bonding surface (3a) of a lower member (3) and a bonding surface (23) of the frame member (2) are also subjected to the diffusion bonding by a high pressure. As a result, a heat transport device (100) having a high hermeticity can be manufactured without increasing an entire load (F) applied at the time of the diffusion bonding.
摘要翻译： 本发明提供一种具有高气密性并且在不增加在进行扩散接合时施加的负荷的情况下制造的传热装置的制造方法和传热装置。 [解决方案]将与框架构件（2）的接合面（21）进行扩散接合的上部构件（1）的接合面（1a）形成为凸状，能够形成接触面积 的接合面（1a）和接合面（21）较小。 因此，施加到接合面（1a，21）的压力（单位面积的负荷）增加，因此，通过高压进行接合面（1a，21）的扩散接合。 类似地，下部构件（3）的接合表面（3a）和框架构件（2）的接合表面（23）也经受高压扩散接合。 结果，可以在不增加在扩散接合时施加的整体负载（F）的情况下制造具有高密封性的热传输装置（100）。
-
-
-
-
-
-
-
-
-
搜索结果
20 条记录 (耗时 0.019 秒)
