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公开(公告)号：US5098999A
公开(公告)日：1992-03-24
申请号：US569018
申请日：1990-08-17
申请人： Yasuo Yamamoto , Yasuo Miyadera
发明人： Yasuo Yamamoto , Yasuo Miyadera
IPC分类号： C07C271/22 , C07D253/08
CPC分类号： C07D253/08 , C07C271/22 , C07C2103/18
摘要： 3,4-Dihydroxyphenylalanine wherein the amino group is protected with a 9-fluorenylmethyloxycarbonyl group, or a derivative thereof can be produced by reacting 3,4-dihydroxyphenylalanine with a boron compound or phosphorus compound to stabilize the hydroxyl groups, followed by introduction of a 9-fluorenylmethyloxycarbonyl group thereinto.
摘要翻译： 其中氨基被9-芴基甲氧基羰基保护的3,4-二羟基苯丙氨酸或其衍生物可以通过使3,4-二羟基苯丙氨酸与硼化合物或磷化合物反应来稳定羟基，然后引入 9-芴基甲氧基羰基。
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公开(公告)号：US4510008A
公开(公告)日：1985-04-09
申请号：US433099
申请日：1982-10-06
申请人： Ikuo Hoshi , Masami Arai , Kiyoshi Yokochi , Yasuo Miyadera , Atsushi Fujioka , Takehisa Nakagawa
发明人： Ikuo Hoshi , Masami Arai , Kiyoshi Yokochi , Yasuo Miyadera , Atsushi Fujioka , Takehisa Nakagawa
IPC分类号： H05K3/38 , B29C31/04 , B29C43/20 , B29C70/06 , B29C70/08 , B29C70/46 , B29K105/08 , B29K105/22 , B29L31/34 , B32B15/14 , B32B37/00 , H05K1/03 , H05K3/02 , B32B15/08
CPC分类号： H05K3/022 , B29C31/04 , B29C70/088 , B29C70/467 , B32B15/14 , B29K2105/0094 , B29K2105/0809 , B29K2105/0854 , B29K2705/10 , B29K2711/12 , B29L2031/3425 , H05K1/0366 , H05K2203/068 , H05K2203/1545 , Y10T156/1084
摘要： Copper-clad laminates for printed wiring boards with almost no warpage can be produced continuously without using a solvent by continuously running a continuous, fibrous substrate, supplying partially and intermittently a solventless thermosetting resin mixture to the running substrate, laminating a copper foil at least one surface of the running substrate, pressure molding with heating the copper foil laminated substrate in a mold comprising a pair of flat plates at least one of which has projecting portions tapered to the center of the flat plate at the periphery thereof, taking off and cutting the molded laminate.
摘要翻译： 通过连续运行连续的纤维基材，可以连续地制造几乎没有翘曲的印刷线路板的覆铜层压板，部分地和间歇地将无溶剂的热固性树脂混合物供给到运行的基板上，将铜箔层叠至少一个 将加热铜箔层压基板的模具加压成型，该模具包括一对平板，其中至少一个平板在其周边处具有渐缩到平板中心的突出部分，从而切割和切割 模压层压板。
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公开(公告)号：US4447596A
公开(公告)日：1984-05-08
申请号：US307199
申请日：1981-09-30
申请人： Daisuke Makino , Yasuo Miyadera
发明人： Daisuke Makino , Yasuo Miyadera
IPC分类号： C08G73/06 , C08G73/00 , C08G73/10 , H01L21/027 , H01L21/312
CPC分类号： C08G73/1028 , H01L21/312
摘要： An improved method of preparing polyamide acid for processing of semiconductors from a diamine and a tetracarboxylic acid dianhydride optionally with a diaminocarbonamide, is provided (1) by reacting the components at below 40.degree. C. until the reduced viscosity reaches above 0.5 dl/g. at 30.degree. C. and then, (2) by adjusting the reduced viscosity to more than 0.3 dl/g, at 30.degree. C. and the solution viscosity to 500-3,000 cps at 25.degree. C. by heating at 50-100.degree. C. By applying the polyamide acid obtained by the method to semiconductor apparatus, they get sufficient heat-resistance without pin holes, and their reliability may be greatly improved.
摘要翻译： （1）通过在低于40℃下使组分反应直至比浓粘度达到0.5dl / g以上为止提供了一种由二胺和四羧酸二酸酐任选地与二氨基碳酰胺一起制备用于半导体加工的聚酰胺酸的改进方法。 然后，（2）通过在30℃下将比浓粘度调节至大于0.3dl / g，并将溶液粘度在25℃加热至50-100℃时在25℃下为500-3,000cps 通过将通过该方法获得的聚酰胺酸应用于半导体装置，它们获得足够的耐热性而没有针孔，并且其可靠性可以大大提高。
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公开(公告)号：US4446191A
公开(公告)日：1984-05-01
申请号：US314393
申请日：1981-10-23
申请人： Yasuo Miyadera , Atsushi Fujioka , Tetsuo Kumazawa , Doi Hiroaki
发明人： Yasuo Miyadera , Atsushi Fujioka , Tetsuo Kumazawa , Doi Hiroaki
CPC分类号： H05K1/0366 , B29C70/08 , B32B5/26 , C08J5/047 , C08J5/24 , H05K2201/0278 , H05K2201/029 , Y10T428/31678 , Y10T442/3138 , Y10T442/3431 , Y10T442/608 , Y10T442/656
摘要： A laminate produced by molding under heat and pressure a plurality of prepregs obtained by impregnating a resin into a composite fabric, either woven or nonwoven, comprising aromatic polyamide fibers and glass fibers has a low linear expansion coefficient and excellent interlaminar strength.
摘要翻译： 通过在加热和压力下成型，通过将树脂浸渍到包含芳族聚酰胺纤维和玻璃纤维的织造或非织造织物的复合织物中而获得的多个预浸料产生的层压板具有低线膨胀系数和优异的层间强度。
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