公开(公告)号：US4446191A

公开(公告)日：1984-05-01

申请号：US314393

申请日：1981-10-23

申请人： Yasuo Miyadera ,  Atsushi Fujioka ,  Tetsuo Kumazawa ,  Doi Hiroaki

发明人： Yasuo Miyadera ,  Atsushi Fujioka ,  Tetsuo Kumazawa ,  Doi Hiroaki

IPC分类号： B29C70/08 ,  B32B5/26 ,  C08J5/04 ,  C08J5/24 ,  H05K1/03 ,  B32B5/08

CPC分类号： H05K1/0366 ,  B29C70/08 ,  B32B5/26 ,  C08J5/047 ,  C08J5/24 ,  H05K2201/0278 ,  H05K2201/029 ,  Y10T428/31678 ,  Y10T442/3138 ,  Y10T442/3431 ,  Y10T442/608 ,  Y10T442/656

摘要： A laminate produced by molding under heat and pressure a plurality of prepregs obtained by impregnating a resin into a composite fabric, either woven or nonwoven, comprising aromatic polyamide fibers and glass fibers has a low linear expansion coefficient and excellent interlaminar strength.

摘要翻译： 通过在加热和压力下成型，通过将树脂浸渍到包含芳族聚酰胺纤维和玻璃纤维的织造或非织造织物的复合织物中而获得的多个预浸料产生的层压板具有低线膨胀系数和优异的层间强度。

公开(公告)号：US4528223A

公开(公告)日：1985-07-09

申请号：US315057

申请日：1981-10-26

申请人： Tetsuo Kumazawa ,  Hiroaki Doi ,  Yasuo Miyadera ,  Atsushi Fujioka ,  Tadashi Nagai

发明人： Tetsuo Kumazawa ,  Hiroaki Doi ,  Yasuo Miyadera ,  Atsushi Fujioka ,  Tadashi Nagai

IPC分类号： D04B1/14 ,  D02G3/04 ,  D02G3/18 ,  D02G3/44 ,  D03D15/12 ,  D04B1/16 ,  D07B1/02 ,  D03D15/00

CPC分类号： D02G3/447 ,  D02G3/047 ,  D10B2101/06 ,  Y10S428/902 ,  Y10T428/1314 ,  Y10T428/2929 ,  Y10T428/2964 ,  Y10T428/2969 ,  Y10T428/298 ,  Y10T442/438 ,  Y10T442/604 ,  Y10T442/608

摘要： Composite fibrous products such as composite cloth, composite strings, composite knitted goods, etc., produced by using combination yarns obtained by twisting one or more aromatic polyamide continuous filament yarns and one or more continuous glass yarns have high rigidity and excellent reinforcing effects.

摘要翻译： 通过使用通过加捻一种或多种芳族聚酰胺连续长丝纱线和一种或多种连续玻璃纱线而获得的组合纱线制成的复合纤维制品，例如复合布，复合线，复合针织物等具有高刚性和优异的增强效果。

公开(公告)号：US4510008A

公开(公告)日：1985-04-09

申请号：US433099

申请日：1982-10-06

申请人： Ikuo Hoshi ,  Masami Arai ,  Kiyoshi Yokochi ,  Yasuo Miyadera ,  Atsushi Fujioka ,  Takehisa Nakagawa

发明人： Ikuo Hoshi ,  Masami Arai ,  Kiyoshi Yokochi ,  Yasuo Miyadera ,  Atsushi Fujioka ,  Takehisa Nakagawa

IPC分类号： H05K3/38 ,  B29C31/04 ,  B29C43/20 ,  B29C70/06 ,  B29C70/08 ,  B29C70/46 ,  B29K105/08 ,  B29K105/22 ,  B29L31/34 ,  B32B15/14 ,  B32B37/00 ,  H05K1/03 ,  H05K3/02 ,  B32B15/08

CPC分类号： H05K3/022 ,  B29C31/04 ,  B29C70/088 ,  B29C70/467 ,  B32B15/14 ,  B29K2105/0094 ,  B29K2105/0809 ,  B29K2105/0854 ,  B29K2705/10 ,  B29K2711/12 ,  B29L2031/3425 ,  H05K1/0366 ,  H05K2203/068 ,  H05K2203/1545 ,  Y10T156/1084

摘要： Copper-clad laminates for printed wiring boards with almost no warpage can be produced continuously without using a solvent by continuously running a continuous, fibrous substrate, supplying partially and intermittently a solventless thermosetting resin mixture to the running substrate, laminating a copper foil at least one surface of the running substrate, pressure molding with heating the copper foil laminated substrate in a mold comprising a pair of flat plates at least one of which has projecting portions tapered to the center of the flat plate at the periphery thereof, taking off and cutting the molded laminate.

摘要翻译： 通过连续运行连续的纤维基材，可以连续地制造几乎没有翘曲的印刷线路板的覆铜层压板，部分地和间歇地将无溶剂的热固性树脂混合物供给到运行的基板上，将铜箔层叠至少一个 将加热铜箔层压基板的模具加压成型，该模具包括一对平板，其中至少一个平板在其周边处具有渐缩到平板中心的突出部分，从而切割和切割 模压层压板。

公开(公告)号：US4707316A

公开(公告)日：1987-11-17

申请号：US850122

申请日：1986-04-10

申请人： Atsushi Fujioka ,  Yasuo Miyadera ,  Tomio Fukuda

发明人： Atsushi Fujioka ,  Yasuo Miyadera ,  Tomio Fukuda

IPC分类号： B32B27/34 ,  C08G73/12 ,  C08J5/24 ,  H05K1/03 ,  B32B31/12

CPC分类号： C08J5/24 ,  B32B27/34 ,  C08G73/121 ,  C08J2379/08 ,  H05K1/0346 ,  Y10T428/2947 ,  Y10T428/2949

摘要： A polyamino-bis-maleimide prepolymer solution obtained by the reaction of 1 mol of N,N'-4,4'-diphenyl methane-bis-maleimide with 0.25 to 0.4 mol of 4,4'-diaminodiphenyl methane in an alkyleneglycol monoalkyl ether as a solvent at elevated temperatures. This solution can be impregnated with a substrate to form a prepreg. The prepreg can be laminated to form heat resistant laminate.

公开(公告)号：US4598115A

公开(公告)日：1986-07-01

申请号：US650905

申请日：1984-09-13

申请人： Atsushi Fujioka ,  Yasuo Miyadera ,  Tomio Fukuda

发明人： Atsushi Fujioka ,  Yasuo Miyadera ,  Tomio Fukuda

IPC分类号： B32B27/34 ,  C08G73/12 ,  C08J5/24 ,  H05K1/03 ,  C08K5/06

CPC分类号： C08J5/24 ,  B32B27/34 ,  C08G73/121 ,  C08J2379/08 ,  H05K1/0346 ,  Y10T428/2947 ,  Y10T428/2949

摘要： A polyamino-bis-maleimide prepolymer solution obtained by the reaction of 1 mole of N,N'-4,4'-diphenyl methane-bis-maleimide with 0.25 to 0.4 mol of 4,4'-diaminodiphenyl methane in an alkyleneglycol monoalkyl ether as a solvent at elevated temperatures. This solution can be impregnated with a substrate to form a prepreg. The prepreg can be laminated to form heat resistant laminate.

摘要翻译： 通过1摩尔N，N'-4,4'-二苯基甲烷 - 双马来酰亚胺与0.25〜0.4摩尔4,4'-二氨基二苯基甲烷在亚烷基二醇单烷基醚中反应而得到的聚氨基 - 双马来酰亚胺预聚物溶液 作为溶剂在升高的温度。 该溶液可以用基材浸渍以形成预浸料。 可以将预浸料层压以形成耐热层压板。

公开(公告)号：US4526838A

公开(公告)日：1985-07-02

申请号：US529554

申请日：1983-09-06

申请人： Atsushi Fujioka ,  Yasuo Miyadera ,  Tomio Fukuda

发明人： Atsushi Fujioka ,  Yasuo Miyadera ,  Tomio Fukuda

IPC分类号： C08G73/00 ,  B32B15/08 ,  C08G73/12 ,  H05K1/03 ,  C08G73/10

CPC分类号： B32B15/08 ,  C08G73/126 ,  H05K1/0346 ,  Y10T428/31681 ,  Y10T428/31721

摘要： A curable polyamino-bis-imide resin, obtained by the thermal reaction of:(A) a bis-imide represented by the general formula I: ##STR1## wherein R.sub.1 stands for a divalent organic group having a carbon-carbon double bond and R.sub.2 for a divalent aromatic organic group having 1 to 3 benzene rings, with(B) a diamine represented by the general formula II: ##STR2## wherein X stands for one member selected from the group consisting of O, S, SO.sub.2, CH.sub.2, CO, COO, C(CH.sub.3).sub.2, CF.sub.2 and C(CF.sub.3).sub.2, providing that the three X's may be identical or not identical to one another and the hydrogen atoms attached to the benzene rings may be substituted by an inactive alkyl group, perfluoroalkyl group or halogen atom, a solution thereof, cross-linked resins therefrom and laminated boards therefrom.

摘要翻译： 通过以下热反应获得的可固化聚氨基 - 双酰亚胺树脂：（A）由通式I表示的双酰亚胺：其中R1表示具有碳 - 碳双键的二价有机基团 键，R2表示具有1-3个苯环的二价芳族有机基团，（B）由通式II表示的二胺：其中X表示选自O，S ，SO 2，CH 2，CO，COO，C（CH 3）2，CF 2和C（CF 3）2，条件是三个X可以彼此相同或不相同，并且与苯环连接的氢原子可以被 无活性烷基，全氟烷基或卤原子，其溶液，与其交联的树脂和层压板。

公开(公告)号：US07771559B2

公开(公告)日：2010-08-10

申请号：US11494709

申请日：2006-07-28

申请人： Isao Tsukagoshi ,  Yasushi Gotou ,  Masami Yusa ,  Yasuo Miyadera

发明人： Isao Tsukagoshi ,  Yasushi Gotou ,  Masami Yusa ,  Yasuo Miyadera

IPC分类号： C09J5/00

CPC分类号： H05K3/323 ,  B32B7/12 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/83851 ,  H05K3/305 ,  H05K3/321 ,  H05K3/325 ,  H05K2201/0329 ,  H05K2201/10977 ,  H05K2203/0278 ,  H05K2203/1189 ,  Y10T428/12569 ,  Y10T428/2852 ,  Y10T428/287 ,  Y10T428/2891

摘要： The present invention relates to a method for connecting electrodes comprising: interposing the polyphthalide represented by the formula (I): wherein R represents a divalent aromatic hydrocarbon group or a divalent heteroring-containing aromatic group, R1 represents an alkyl group, a fluorinated alkyl group, an alkoxy group or a halogen atom, where the number of R1 is 0 to 4, X represents O or N—R3, provided that R3 represents one of the following groups, Y represents SO2 or Co and n represents a number of repeating units in the polymer, as a pressure-sensitive conductive polymer at least partially between electrodes opposed to each other; and applying a pressure to fix the both electrodes, a surface-treated wiring board comprising polyphthalide represented by the formula (I) formed on at least part of the surface of the electrode part, an adhesive film comprising an adhesive and polyphthalide represented by the formula (I), and an electrode-connected structure using the same.

摘要翻译： 本发明涉及一种电极连接方法，其特征在于，包括：插入由式（I）表示的多苯酞：其中R表示二价芳族烃基或含二价杂芳基的芳族基团，R 1表示烷基，氟化烷基 R 1为0〜4的烷氧基或卤素原子，X表示O或N-R 3，条件是R 3表示以下基团之中，Y表示SO 2或Co，n表示重复单元数 在聚合物中，作为至少部分地彼此相对的电极之间的压敏导电聚合物; 并且施加压力以固定两个电极，包括形成在电极部分的至少一部分表面上的由式（I）表示的多苯酞的表面处理的布线板，包含由式（I）表示的粘合剂和多苯酞的粘合剂膜 （I），以及使用其的电极连接结构。

公开(公告)号：US07528488B2

公开(公告)日：2009-05-05

申请号：US11494708

申请日：2006-07-28

申请人： Isao Tsukagoshi ,  Yasushi Gotou ,  Masami Yusa ,  Yasuo Miyadera

发明人： Isao Tsukagoshi ,  Yasushi Gotou ,  Masami Yusa ,  Yasuo Miyadera

IPC分类号： H01L23/52

CPC分类号： H05K3/323 ,  B32B7/12 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/83851 ,  H05K3/305 ,  H05K3/321 ,  H05K3/325 ,  H05K2201/0329 ,  H05K2201/10977 ,  H05K2203/0278 ,  H05K2203/1189 ,  Y10T428/12569 ,  Y10T428/2852 ,  Y10T428/287 ,  Y10T428/2891

摘要： The present invention relates to a method for connecting electrodes comprising: interposing the polyphthalide represented by the formula (I): wherein R represents a divalent aromatic hydrocarbon group or a divalent heteroring-containing aromatic group, R1 represents an alkyl group, a fluorinated alkyl group, an alkoxy group or a halogen atom, where the number of R1 is 0 to 4, X represents O or N—R3, provided that R3 represents one of the following groups, Y represents SO2 or Co and n represents a number of repeating units in the polymer, as a pressure-sensitive conductive polymer at least partially between electrodes opposed to each other; and applying a pressure to fix the both electrodes, a surface-treated wiring board comprising polyphthalide represented by the formula (I) formed on at least part of the surface of the electrode part, an adhesive film comprising an adhesive and polyphthalide represented by the formula (I), and an electrode-connected structure using the same.

摘要翻译： 本发明涉及一种电极连接方法，其特征在于，包括：插入由式（I）表示的多苯酞：其中R表示二价芳族烃基或含二价杂芳基的芳族基团，R 1表示烷基，氟化烷基 R 1为0〜4的烷氧基或卤素原子，X表示O或N-R 3，条件是R 3表示以下基团之中，Y表示SO 2或Co，n表示重复单元数 在聚合物中，作为至少部分地彼此相对的电极之间的压敏导电聚合物; 并且施加压力以固定两个电极，包括形成在电极部分的至少一部分表面上的由式（I）表示的多苯酞的表面处理的布线板，包含由式（I）表示的粘合剂和多苯酞的粘合剂膜 （I），以及使用其的电极连接结构。

公开(公告)号：US07387914B2

公开(公告)日：2008-06-17

申请号：US11379921

申请日：2006-04-24

申请人： Shinji Takeda ,  Takashi Masuko ,  Masami Yusa ,  Tooru Kikuchi ,  Yasuo Miyadera ,  Iwao Maekawa ,  Mitsuo Yamasaki ,  Akira Kageyama ,  Aizou Kaneda

发明人： Shinji Takeda ,  Takashi Masuko ,  Masami Yusa ,  Tooru Kikuchi ,  Yasuo Miyadera ,  Iwao Maekawa ,  Mitsuo Yamasaki ,  Akira Kageyama ,  Aizou Kaneda

IPC分类号： H01L21/48 ,  H01L21/50

CPC分类号： H01L24/27 ,  H01L23/49513 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/743 ,  H01L24/83 ,  H01L24/97 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83101 ,  H01L2224/83192 ,  H01L2224/83805 ,  H01L2224/8385 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12044 ,  H01L2924/181 ,  Y10T428/28 ,  H01L2924/00 ,  H01L2924/01014 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/85399

摘要： A semiconductor chip is attached to a lead frame with a filmy organic die-bonding material having a water absorption of 1.5% by volume or less; having a saturation moisture absorption of 1.0% by volume or less, having a residual volatile component in an amount not more than 3.0% by weight, having a modulus of elasticity of 10 MPa or less at a temperature of 250° C. The semiconductor device thus obtained can be free from occurrence of reflow cracks during reflow soldering for the packaging of semiconductor devices.

摘要翻译： 将半导体芯片与吸水率为1.5体积％以下的薄膜状有机芯片接合材料贴合在引线框架上; 具有1.0体积％以下的饱和吸湿性，在250℃的温度下具有不大于3.0重量％的残留挥发组分，弹性模量为10MPa以下。半导体装置 这样获得的半导体器件的封装的回流焊接期间不会发生回流裂纹。

公开(公告)号：US5997829A

公开(公告)日：1999-12-07

申请号：US973001

申请日：1997-11-26

申请人： Yoshika Sekine ,  Kenji Tonoki ,  Tatsuya Uchida ,  Yasuo Miyadera ,  Hiroyuki Kawada ,  Takayuki Senda

发明人： Yoshika Sekine ,  Kenji Tonoki ,  Tatsuya Uchida ,  Yasuo Miyadera ,  Hiroyuki Kawada ,  Takayuki Senda

IPC分类号： B01D53/04 ,  B01D53/86 ,  B01J20/28 ,  B01J31/06 ,  B01J35/06 ,  B01J23/00 ,  B01J34/07

CPC分类号： B01D53/02 ,  B01D53/86 ,  B01J20/28004 ,  B01J20/28028 ,  B01J20/28033 ,  B01J20/28045 ,  B01J31/06 ,  B01J35/06 ,  B01D2253/102 ,  B01D2253/104 ,  B01D2253/106 ,  B01D2253/108 ,  B01D2253/11 ,  B01D2253/112 ,  B01D2253/202 ,  B01D2253/304 ,  B01D2253/3425 ,  B01D2257/90 ,  B01J2231/70 ,  Y10S502/507

摘要： The present invention is directed to a sheet-form environment purifying material comprising particles of metal and/or metal oxide consisting essentially of at least one member being selected from the group consisting of manganese, copper, zinc, iron, vanadium, nickel, titanium, palladium, platinum, manganese oxide, copper oxide, zinc oxide, iron oxide, vanadium oxide, nickel oxide, titanium oxide, palladium oxide, and platinum oxide, adsorbent particles consisting essentially of at least one member selected from the group consisting of activated carbon, zeolite, silica gel, sepiolite, activated alumina and activated clay, thermoplastic resin particles being selected from ultrahigh-molecular weight polyethylene, polyethylene, polycarbonate, polyamide acrylonitrile-butadiene-styrene resins, polyimide, polyvinyl chloride, cellulose acetate, polysulfone, polystyrene phthalate and polypropylene, and an air-permeable sheet of fibrous. The metal and/or metal oxide particles and the adsorbent particles are respectively bound to the thermoplastic resin particles while retaining their inherent surface areas and performances without being covered by the thermoplastic resin layers, and the thermoplastic resin particles are joined to the fibrous substrate. The present invention is also directed to a process for making the environment purifying material which comprises the steps of mixing all the particles and heating the mixture at a temperature not lower than the melting point of the thermoplastic resin and not higher than the thermal decomposition temperature thereof. The environment purifying material of the present invention is useful as deodorizers and harmful gas removers.

摘要翻译： PCT No.PCT / JP96 / 01423 Sec。 371日期：1997年11月26日 102（e）日期1997年11月26日PCT提交1996年5月27日PCT公布。 第WO96 / 37288号公报 日期：1996年11月28日本发明涉及包含金属和/或金属氧化物颗粒的片状环境净化材料，其基本上由至少一种选自锰，铜，锌，铁，钒 ，镍，钛，钯，铂，氧化锰，氧化铜，氧化锌，氧化铁，氧化钒，氧化镍，氧化钛，氧化钯和氧化铂，吸附剂颗粒基本上由至少一种选自 由活性炭，沸石，硅胶，海泡石，活性氧化铝和活性白土组成的热塑性树脂颗粒，选自超高分子量聚乙烯，聚乙烯，聚碳酸酯，聚酰胺丙烯腈 - 丁二烯 - 苯乙烯树脂，聚酰亚胺，聚氯乙烯，醋酸纤维素， 聚砜，聚苯乙烯邻苯二甲酸酯和聚丙烯，以及纤维状透气性片。 金属和/或金属氧化物颗粒和吸附剂颗粒分别结合到热塑性树脂颗粒上，同时保持其固有的表面积和性能而不被热塑性树脂层覆盖，并且热塑性树脂颗粒与纤维基材接合。 本发明还涉及一种环境净化材料的制造方法，该方法包括以下步骤：将所有颗粒混合并在不低于热塑性树脂的熔点的温度下加热混合物，并且不高于其热分解温度 。 本发明的环境净化材料可用作除臭剂和有害气体去除剂。