公开(公告)号：US20170136603A1

公开(公告)日：2017-05-18

申请号：US15352647

申请日：2016-11-16

Applicant: Applied Materials, Inc.

Inventor： Sivapackia GANAPATHIAPPAN ,  Boyi FU ,  Ashwin CHOCKALINGAM ,  Daniel REDFIELD ,  Rajeev BAJAJ ,  Mahendra C. ORILALL ,  Hou T. NG ,  Jason G. FUNG ,  Mayu YAMAMURA

IPC: B24B37/24 ,  B29C35/08 ,  C09G1/16 ,  B33Y80/00 ,  B24B37/26 ,  C09D4/00 ,  B29C67/00 ,  B33Y10/00

CPC classification number: B24B37/24 ,  B24B37/22 ,  B24B37/26 ,  B24D3/28 ,  B24D11/001 ,  B24D11/04 ,  B24D2203/00 ,  B29C35/0805 ,  B29C64/112 ,  B29C2035/0827 ,  B29K2033/04 ,  B29K2995/0077 ,  B29K2995/0092 ,  B33Y10/00 ,  B33Y70/00 ,  B33Y80/00 ,  C09D4/00 ,  C09G1/16

Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, addition polymer precursor compounds, catalysts, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one polymer precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions. Embodiments of the disclosure further provide a polishing pad with polymeric layers that may be interpenetrating polymer networks.

公开(公告)号：US20170100817A1

公开(公告)日：2017-04-13

申请号：US15296015

申请日：2016-10-17

Applicant: Applied Materials, Inc.

Inventor： Sivapackia GANAPATHIAPPAN ,  Boyi FU ,  Ashwin CHOCKALINGAM ,  Daniel REDFIELD ,  Rajeev BAJAJ ,  Mahendra C. ORILALL ,  Hou T. NG ,  Jason G. FUNG ,  Mayu YAMAMURA

IPC: B24B37/22 ,  B24B37/24 ,  B24B37/26

CPC classification number: B24B37/24 ,  B24B37/22 ,  B24B37/26 ,  B24D3/28 ,  B24D11/001 ,  B24D11/04 ,  B24D2203/00 ,  B29C35/0805 ,  B29C64/112 ,  B29C2035/0827 ,  B29K2033/04 ,  B29K2995/0077 ,  B29K2995/0092 ,  B33Y10/00 ,  B33Y70/00 ,  B33Y80/00 ,  C09D4/00 ,  C09G1/16

Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, addition polymer precursor compounds, catalysts, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one polymer precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions. Embodiments of the disclosure further provide a polishing pad with polymeric layers that may be interpenetrating polymer networks.

公开(公告)号：US20160107290A1

公开(公告)日：2016-04-21

申请号：US14695299

申请日：2015-04-24

Applicant: Applied Materials, Inc.

Inventor： Rajeev BAJAJ ,  Kasiraman KRISHNAN ,  Mahendra C. ORILALL ,  Daniel REDFIELD ,  Fred C. REDEKER ,  Nag B. PATIBANDLA ,  Gregory E. MENK ,  Jason G. FUNG ,  Russell Edward PERRY ,  Robert E. DAVENPORT

IPC: B24B37/26 ,  B24B37/22 ,  B24D18/00 ,  B24B37/20

CPC classification number: B24B37/26 ,  B24B37/205 ,  B24B37/22 ,  B24B37/24 ,  B24D18/0045 ,  B29C64/112 ,  B33Y80/00

Abstract: Embodiments of the disclosure generally provide polishing pads includes a composite pad body and methods for forming the polishing pads. One embodiment provides a polishing pad including a composite pad body. The composite pad body includes one or more first features formed from a first material or a first composition of materials, and one or more second features formed from a second material or a second composition of materials, wherein the one or more first features and the one or more second features are formed by depositing a plurality of layers comprising the first material or first composition of materials and second material or second composition of materials.

Abstract translation: 本公开的实施例通常提供抛光垫，其包括复合衬垫本体和用于形成抛光垫的方法。 一个实施例提供了一种包括复合衬垫本体的抛光垫。 复合衬垫本体包括由第一材料或第一组合材料形成的一个或多个第一特征以及由第二材料或第二材料组合物形成的一个或多个第二特征，其中所述一个或多个第一特征和一个 或更多的第二特征通过沉积多个层而形成，所述多个层包括第一材料或第一材料组合物和第二材料或第二材料组合物。

公开(公告)号：US20160107288A1

公开(公告)日：2016-04-21

申请号：US14885955

申请日：2015-10-16

Applicant: Applied Materials, Inc.

Inventor： Mahendra Christopher ORILALL ,  Timothy MICHAELSON ,  Kasiraman KRISHNAN ,  Rajeev BAJAJ ,  Nag B. PATIBANDLA ,  Daniel REDFIELD ,  Fred C. REDEKER ,  Gregory E. MENK

IPC: B24B37/24 ,  B24B37/26 ,  B24D18/00 ,  B24B37/22

CPC classification number: B24B37/24 ,  B24B37/22 ,  B24B37/26 ,  B24D18/0045 ,  B33Y10/00 ,  B33Y80/00

Abstract: A method of fabricating a polishing layer of a polishing pad includes successively depositing a plurality of layers with a 3D printer, each layer of the plurality of polishing layers deposited by ejecting a base material from a first nozzle and an additive material from a second nozzle and solidifying the base and additive material to form a solidified pad material.

Abstract translation: 制造抛光垫的抛光层的方法包括用3D打印机连续沉积多个层，通过从第一喷嘴喷射基材并从第二喷嘴排出添加剂材料沉积多个抛光层的每一层，以及 固化基材和添加剂材料以形成固化的垫材料。

公开(公告)号：US20240123568A1

公开(公告)日：2024-04-18

申请号：US18212285

申请日：2023-06-21

Applicant: Applied Materials, Inc.

Inventor： Sivapackia GANAPATHIAPPAN ,  Boyi FU ,  Ashwin CHOCKALINGAM ,  Daniel REDFIELD ,  Rajeev BAJAJ ,  Mahendra C. ORILALL ,  Hou T. NG ,  Jason G. FUNG ,  Mayu YAMAMURA

IPC: B24B37/24 ,  B24B37/22 ,  B24B37/26 ,  B24D3/28 ,  B24D11/00 ,  B24D11/04 ,  B29C35/08 ,  B29C64/112 ,  B33Y10/00 ,  B33Y70/00 ,  B33Y80/00 ,  C09D4/00 ,  C09G1/16

CPC classification number: B24B37/24 ,  B24B37/22 ,  B24B37/26 ,  B24D3/28 ,  B24D11/001 ,  B24D11/04 ,  B29C35/0805 ,  B29C64/112 ,  B33Y10/00 ,  B33Y70/00 ,  B33Y80/00 ,  C09D4/00 ,  C09G1/16 ,  B33Y70/10

Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and methods of manufacturing the same. According to one or more embodiments, a method for forming or otherwise preparing a polishing article by sequentially forming a plurality of polymer layers is provided and includes: (a) dispensing a plurality of droplets of a polymer precursor composition onto a surface of a previously formed at least partially cured polymer layer, where the polymer precursor composition contains a first precursor component containing an epoxide group and a photoinitiator component which generates a photoacid when exposed to UV light, (b) at least partially curing the plurality of droplets to form an at least partially cured polymer layer, and (c) repeating (a) and (b).

公开(公告)号：US20230063929A1

公开(公告)日：2023-03-02

申请号：US17982470

申请日：2022-11-07

Applicant: Applied Materials, Inc.

Inventor： Rajeev BAJAJ ,  Mei CHANG ,  Deenesh PADHI

IPC: C23C16/30 ,  C23C16/44

Abstract: Embodiments described herein relate to layered structures having a top surface which is hydrophobic for reducing the wetting of water or ice on the layered structure without requiring reapplication. In one or more embodiments, a layered structure is provided and includes a coating containing silicon, oxygen, and carbon disposed over a substrate and an interface disposed between the substrate and the coating. The substrate is at least partially transparent to visible light, a concentration of carbon in the coating is greater at a top surface of the coating than the interface, and the top surface of the coating is disposed on the opposite side of the coating than the interface.

公开(公告)号：US20200230781A1

公开(公告)日：2020-07-23

申请号：US16291647

申请日：2019-03-04

Applicant: Applied Materials, Inc.

Inventor： Ashwin CHOCKALINGAM ,  Jason G. FUNG ,  Sivapackia GANAPATHIAPPAN ,  Rajeev BAJAJ ,  Daniel REDFIELD

IPC: B24B37/26 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y50/02 ,  B33Y80/00 ,  B29C64/112 ,  B29C64/393 ,  B33Y70/00

Abstract: Embodiments of the present disclosure generally relate to polishing pads, and methods for manufacturing polishing pads, which may be used in a chemical mechanical polishing (CMP) process in the manufacture of semiconductor devices. The polishing pads described herein feature a continuous polymer phase of polishing pad material comprising one or more first material domains and a plurality of second material domains. The one or more first material domains are formed of a polymerized reaction product of a first pre-polymer composition, the plurality of second material domains are formed of a polymerized reaction product of a second pre-polymer composition, the second pre-polymer composition is different from the first pre-polymer composition, and interfacial regions between the one or more first material domains and the plurality of second material are formed of a co-polymerized reaction product of the first pre-polymer composition and the second pre-polymer composition.

公开(公告)号：US20200001433A1

公开(公告)日：2020-01-02

申请号：US16541641

申请日：2019-08-15

Applicant: Applied Materials, Inc.

Inventor： Rajeev BAJAJ ,  Daniel REDFIELD ,  Mahendra C. ORILALL ,  Boyi FU ,  Ashwin CHOCKALINGAM ,  Ashavani KUMAR ,  Fred C. REDEKER ,  Nag B. PATIBANDLA

IPC: B24D18/00 ,  B24D3/28

Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one resin precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions.

公开(公告)号：US20190299537A1

公开(公告)日：2019-10-03

申请号：US16289213

申请日：2019-02-28

Applicant: Applied Materials, Inc.

Inventor： William H. MCCLINTOCK ,  Rajeev BAJAJ ,  Jason G. FUNG ,  Daniel REDFIELD

IPC: B29C64/393 ,  G06F9/30 ,  G01B9/02

Abstract: Embodiments disclosed herein provide methods of forming bond pad redistribution layers (RDLs) in a fan-out wafer level packaging (FOWLP) scheme using an additive manufacturing process. In one embodiment, a method of forming a redistribution layer includes positioning a carrier substrate on a manufacturing support of an additive manufacturing system, the carrier substrate including a plurality of singulated devices, detecting one or more fiducial features corresponding to each of the plurality of singulated devices, determining actual positions of each of the plurality of singulated devices relative to one or more components of the additive manufacturing system, generating printing instructions for forming a patterned dielectric layer based on the actual positions of each of the plurality of singulated devices, and forming the patterned dielectric layer using the printing instructions.

公开(公告)号：US20190224809A1

公开(公告)日：2019-07-25

申请号：US16373121

申请日：2019-04-02

Applicant: Applied Materials, Inc.

Inventor： Sivapackia GANAPATHIAPPAN ,  Nag B. PATIBANDLA ,  Rajeev BAJAJ ,  Daniel REDFIELD ,  Fred C. REDEKER ,  Mahendra C. ORILALL ,  Boyi FU ,  Mayu YAMAMURA ,  Ashwin CHOCKALINGAM

IPC: B24B37/22 ,  B24B37/26 ,  B33Y10/00 ,  B24B37/24

Abstract: Implementations disclosed herein generally relate to polishing articles and methods for manufacturing polishing articles used in polishing processes. More specifically, implementations disclosed herein relate to porous polishing pads produced by processes that yield improved polishing pad properties and performance, including tunable performance. Additive manufacturing processes, such as three-dimensional printing processes provides the ability to make porous polishing pads with unique properties and attributes.