公开(公告)号：US11073934B2

公开(公告)日：2021-07-27

申请号：US16752420

申请日：2020-01-24

Applicant: Apple Inc.

Inventor： Xiaonan Wen ,  James E. Pedder

IPC: G06F3/041 ,  G06F3/01 ,  G06F3/044

Abstract: An electronic device includes an electrostatic conductive layer for providing haptic feedback at an input surface of the electronic device. The electrostatic conductive layer is included in a cover assembly positioned over a display. The cover assembly includes a cover sheet, a touch sensor, and the electrostatic conductive layer. The electrostatic conductive layer is driven by an electric field, which electric field is produced by the touch sensor. When the electrostatic conductive layer is activated, it may provide frictional or other tactile feedback at the input surface.

公开(公告)号：US11056041B2

公开(公告)日：2021-07-06

申请号：US16688750

申请日：2019-11-19

Applicant: Apple Inc.

Inventor： Kapil V. Sakariya ,  Tore Nauta ,  Hopil Bae ,  Henry C. Jen ,  James E. Pedder ,  Sunggu Kang ,  Shingo Hatanaka ,  Xiang Lu ,  Mahdi Farrokh Baroughi ,  Hasan Akyol ,  Saif Choudhary ,  Ion Bita

IPC: G09G3/20 ,  G09G3/32

Abstract: Display panel redundancy schemes and methods of operation are described. In an embodiment, and display panel includes an array of drivers (e.g. microdrivers), each of which including multiple portions to independently receive control and pixel bits. In an embodiment, each driver portion is to control a group of redundant emission elements.

公开(公告)号：US20210041705A1

公开(公告)日：2021-02-11

申请号：US17082736

申请日：2020-10-28

Applicant: Apple Inc.

Inventor： James E. Pedder ,  Igor Stamenov ,  Cheng Chen ,  Enkhamgalan Dorjgotov ,  Graham B. Myhre ,  Victoria C. Chan ,  Xiaonan Wen ,  Peng Lv ,  Yuan Li ,  Yu Horie ,  Siddharth S. Hazra

IPC: G02B27/01 ,  G02B3/12

Abstract: A lens module in a head-mounted device may include a fluid-filled chamber, a semi-rigid lens element that at least partially defines the fluid-filled chamber, and at least one actuator configured to selectively bend the semi-rigid lens element. The semi-rigid lens element may become rigid along a first axis when the lens element is curved along a second axis perpendicular to the first axis. Six actuators that are evenly distributed around the periphery of the semi-rigid lens element may be used to control the curvature of the semi-rigid lens element. The semi-rigid lens element may initially be planar or non-planar. For example, the semi-rigid lens element may initially have a spherically convex surface and a spherically concave surface. A tunable spherical lens may be incorporated into the lens module to offset a parasitic spherical lens power from the semi-rigid lens element.

公开(公告)号：US10852553B2

公开(公告)日：2020-12-01

申请号：US16520200

申请日：2019-07-23

Applicant: Apple Inc.

Inventor： James E. Pedder ,  Igor Stamenov ,  Cheng Chen ,  Enkhamgalan Dorjgotov ,  Graham B. Myhre ,  Victoria C. Chan ,  Xiaonan Wen ,  Peng Lv ,  Yuan Li ,  Yu Horie ,  Siddharth S. Hazra

IPC: G02B27/01 ,  G02B3/12 ,  G02B3/00

Abstract: A lens module in a head-mounted device may include a fluid-filled chamber, a semi-rigid lens element that at least partially defines the fluid-filled chamber, and at least one actuator configured to selectively bend the semi-rigid lens element. The semi-rigid lens element may become rigid along a first axis when the lens element is curved along a second axis perpendicular to the first axis. Six actuators that are evenly distributed around the periphery of the semi-rigid lens element may be used to control the curvature of the semi-rigid lens element. The semi-rigid lens element may initially be planar or non-planar. For example, the semi-rigid lens element may initially have a spherically convex surface and a spherically concave surface. A tunable spherical lens may be incorporated into the lens module to offset a parasitic spherical lens power from the semi-rigid lens element.

公开(公告)号：US10585482B2

公开(公告)日：2020-03-10

申请号：US15717714

申请日：2017-09-27

Applicant: Apple Inc.

Inventor： Xiaonan Wen ,  James E. Pedder

IPC: G06F3/01 ,  G06F3/041 ,  G06F3/044

Abstract: An electronic device is disclosed which includes a conductive layer for providing haptic feedback at an input surface of the electronic device. The conductive layer includes conductive particles within an organic compound, such as an epoxy. When the conductive layer is activated it may provide frictional or other tactile feedback at the input surface.

公开(公告)号：US10546796B2

公开(公告)日：2020-01-28

申请号：US16077185

申请日：2017-02-10

Applicant: Apple Inc.

Inventor： Hsin-Hua Hu ,  Jaein Choi ,  James E. Pedder ,  Ion Bita ,  Hairong Tang ,  Chin Wei Hsu ,  Sandeep Chalasani ,  Chih-Lei Chen ,  Sunggu Kang ,  Shinya Ono ,  Jung Yen Huang ,  Lun Tsai

IPC: H01L23/48 ,  H01L23/31 ,  H01L23/00 ,  H01L25/075 ,  H01L25/16

Abstract: Micro LED and microdriver chip integration schemes are described. In an embodiment a microdriver chip includes a plurality of trenches formed in a bottom surface of the microdriver chip, with each trench surrounding a conductive stud extending below a bottom surface of the microdriver chip body. Integration schemes are additionally described for providing electrical connection to conductive terminal contacts and micro LEDs bonded to a display substrate and adjacent to a microdriver chip.

公开(公告)号：US10423265B2

公开(公告)日：2019-09-24

申请号：US15607291

申请日：2017-05-26

Applicant: Apple Inc.

Inventor： Sinan Filiz ,  James E. Pedder ,  Charley T. Ogata ,  John Stephen Smith ,  Dhaval Chandrakant Patel ,  Shin John Choi ,  Brian Q. Huppi ,  Christopher J. Butler ,  Martin P. Grunthaner

IPC: G06F3/041 ,  G01L1/18 ,  G01L1/20 ,  G06F3/044 ,  G01L1/16 ,  G06F3/045 ,  G01L1/00

Abstract: An optical force sensor, which may be used as input to an electronic device. The optical force sensor may be configured to compensate for variations in temperature using two or more force-sensitive components that are formed from materials having different temperature- and strain-dependent responses.

公开(公告)号：US20190115274A1

公开(公告)日：2019-04-18

申请号：US16077185

申请日：2017-02-10

Applicant: Apple Inc.

Inventor： Hsin-Hua Hu ,  Jaein Choi ,  James E. Pedder ,  Ion Bita ,  Hairong Tang ,  Chin Wei Hsu ,  Sandeep Chalasani ,  Chih-Lei Chen ,  Sunggu Kang ,  Shinya Ono ,  Jung Yen Huang ,  Lun Tsai

IPC: H01L23/31 ,  H01L23/00 ,  H01L25/075 ,  H01L25/16

Abstract: Micro LED and microdriver chip integration schemes are described. In an embodiment a microdriver chip includes a plurality of trenches formed in a bottom surface of the microdriver chip, with each trench surrounding a conductive stud extending below a bottom surface of the microdriver chip body. Integration schemes are additionally described for providing electrical connection to conductive terminal contacts and micro LEDs bonded to a display substrate and adjacent to a microdriver chip.

公开(公告)号：US20170364158A1

公开(公告)日：2017-12-21

申请号：US15621930

申请日：2017-06-13

Applicant: Apple Inc.

Inventor： Xiaonan Wen ,  Wei Lin ,  James E. Pedder ,  Xiaofan Niu ,  Nathan K. Gupta ,  Po-Jui Chen ,  Robert W. Rumford ,  Pavan O. Gupta ,  Jui-Ming Yang

IPC: G06F3/01 ,  G06F3/02 ,  G06F3/0354 ,  G06F3/041

CPC classification number: G06F3/016 ,  G06F3/0202 ,  G06F3/03547 ,  G06F3/0412 ,  G06F2203/014 ,  H01L41/0986

Abstract: In some embodiments, a haptic actuator includes piezoelectric material and a pattern of voltage electrodes coupled to a surface of the piezoelectric material. The voltage electrodes are individually controllable to supply voltage to different portions of the piezoelectric material. Different sections of the piezoelectric material are operable to deflect, producing haptic output at those locations, in response to the application of the voltage. Differing voltages may be provided to one or more of the voltage electrodes to affect the location of the deflection, and thus the haptic output. In various embodiments, a haptic output system incorporates a sealed haptic element. The sealed haptic element includes a piezoelectric component that is coupled to one or more flexes and is sealed and/or enclosed by the flex(es) and an encapsulation or sealing material.

公开(公告)号：US09832868B1

公开(公告)日：2017-11-28

申请号：US15071041

申请日：2016-03-15

Applicant: Apple Inc.

Inventor： Derek W. Wright ,  James E. Pedder ,  Soyoung Kim ,  Stephen R. McClure ,  Elmar Gehlen ,  Sudirukkuge T. Jinasundera ,  Tingjun Xu ,  Michael Vosgueritchian ,  Xiaonan Wen ,  Wei Lin ,  Prithu Sharma

IPC: H05K1/09 ,  H05K1/03 ,  H05K1/11 ,  H05K3/00 ,  H05K3/40 ,  G06F3/041 ,  C25D7/12

CPC classification number: H05K1/0306 ,  C23C18/1653 ,  C25D7/00 ,  C25D7/123 ,  G06F3/041 ,  G06F2203/04103 ,  H05K1/09 ,  H05K1/115 ,  H05K1/147 ,  H05K3/002 ,  H05K3/0044 ,  H05K3/4038 ,  H05K3/4061 ,  H05K2201/0108 ,  H05K2201/10128 ,  H05K2203/107

Abstract: An electronic device may have layers of glass for forming components such as a display. A display cover glass layer may overlap an array of pixels. A touch sensor may be formed under the display cover glass layer. Conductive structures such as transparent conductive electrodes or other conductive layers of material may be formed on the outer surface of the display cover glass layer. The electrodes on the outer surface of the display cover glass layer may be coupled to metal contacts and other circuitry on the inner surface of the display cover glass layer using conductive vias. Vias may be provided with barrier layers, opaque coatings, tapers, and other structures and may be formed using techniques that enhance compatibility with chemical strengthening processes.