公开(公告)号：US11435458B2

公开(公告)日：2022-09-06

申请号：US16459293

申请日：2019-07-01

Applicant: BFLY Operations, Inc.

Inventor： Jonathan M. Rothberg ,  Tyler S. Ralston ,  Nevada J. Sanchez ,  Andrew J. Casper

IPC: G01S7/00 ,  G01S7/52 ,  B06B1/06 ,  G10K11/34 ,  H03K5/13 ,  B06B1/02 ,  H03K5/00

Abstract: Aspects of the technology described herein relate to ultrasound device circuitry as may form part of a single substrate ultrasound device having integrated ultrasonic transducers. The ultrasound device circuitry may facilitate the generation of ultrasound waveforms in a manner that is power- and data-efficient.

公开(公告)号：US20220179058A1

公开(公告)日：2022-06-09

申请号：US17682937

申请日：2022-02-28

Applicant: BFLY Operations, Inc.

Inventor： Kailiang Chen ,  Tyler S. Ralston ,  Keith G. Fife

IPC: G01S7/52 ,  G01S15/89 ,  G01S7/521

Abstract: Circuitry for ultrasound devices is described. A multilevel pulser is described, which can provide bipolar pulses of multiple levels. The multilevel pulser includes a pulsing circuit and pulser and feedback circuit. Symmetric switches are also described. The symmetric switches can be positioned as inputs to ultrasound receiving circuitry to block signals from the receiving circuitry.

公开(公告)号：US11324484B2

公开(公告)日：2022-05-10

申请号：US16011715

申请日：2018-06-19

Applicant: BFLY Operations, Inc.

Inventor： Amandeep Singh ,  Kailiang Chen ,  Tyler S. Ralston

IPC: B06B1/06 ,  A61B8/08 ,  A61B8/00 ,  H03F3/50 ,  H03F3/45

Abstract: An ultrasound circuit comprising a multi-stage trans-impedance amplifier (TIA) is described. The TIA is coupled to an ultrasonic transducer to amplify an electrical signal generated by the ultrasonic transducer in response to receiving an ultrasound signal. The TIA may include multiple stages, at least two of which operate with different supply voltages. The TIA may be followed by further processing circuitry configured to filter, amplify, and digitize the signal produced by the TIA.

公开(公告)号：US20220099815A1

公开(公告)日：2022-03-31

申请号：US17492212

申请日：2021-10-01

Applicant: BFLY Operations, Inc.

Inventor： Kailiang Chen ,  Tyler S. Ralston

IPC: G01S7/524 ,  A61B8/00 ,  G01S7/52 ,  G01S7/521 ,  H03K19/0175

Abstract: Apparatus and methods are provided directed to a device, including at least one ultrasonic transducer, a multi-level pulser coupled to the at least one ultrasonic transducer; the multi-level pulser including a plurality of input terminals configured to receive respective input voltages, an output terminal configured to provide an output voltage, and a signal path between a first input terminal and the output terminal including a first transistor having a first conductivity type coupled to a first diode and, in parallel, a second transistor having a second conductivity type coupled to a second diode.

公开(公告)号：US11215703B2

公开(公告)日：2022-01-04

申请号：US16109437

申请日：2018-08-22

Applicant: BFLY Operations, Inc.

Inventor： Kailiang Chen ,  Tyler S. Ralston

IPC: G01S7/52 ,  G01N29/44 ,  G01N29/06 ,  G01N29/11 ,  H03H7/25

Abstract: An ultrasound device, including a profile generator, an encoder configured to receive a profile signal from the profile generator, and an attenuator configured to receive a signal representing an output of an ultrasound sensor and coupled to the encoder to receive a control signal from the encoder, the attenuator including a plurality of attenuator stages, the attenuator configured to produce an output signal that is an attenuated version of the input signal.

公开(公告)号：US12130391B2

公开(公告)日：2024-10-29

申请号：US18503416

申请日：2023-11-07

Applicant: BFLY OPERATIONS, INC.

Inventor： Nevada J. Sanchez ,  Liewei Bao ,  Tyler S. Ralston

IPC: G01S7/52 ,  A61B8/00 ,  A61B8/08 ,  G01S15/89

CPC classification number: G01S7/52025 ,  A61B8/4477 ,  A61B8/4494 ,  G01S7/52034 ,  G01S7/5208 ,  A61B8/4236 ,  A61B8/4472 ,  A61B8/5207 ,  G01S15/8915 ,  G01S15/8925

Abstract: Aspects of the technology described herein related to controlling, using control circuitry, modulation circuitry to modulate and delay first ultrasound data generated by first ultrasound transducers positioned at a first azimuthal position of an ultrasound transducer array of an ultrasound device and second ultrasound data generated by second ultrasound transducers positioned at a second azimuthal position of the ultrasound transducer array of the ultrasound device, such that the first ultrasound data is delayed by a first delay amount and the second ultrasound data is delayed by a second delay amount that is different from the first delay amount. The first and second ultrasound data received from the modulation circuitry may be filtered and summed. The ultrasound transducer array, the control circuitry, the modulation circuitry, the filtering circuitry, and the summing circuitry may be integrated onto a semiconductor chip or one or more semiconductor chips packaged together.

公开(公告)号：US20240120891A1

公开(公告)日：2024-04-11

申请号：US18389875

申请日：2023-12-20

Applicant: BFLY OPERATIONS, INC.

Inventor： Kailiang Chen ,  Keith G. Fife ,  Nevada J. Sanchez ,  Andrew J. Casper ,  Tyler S. Ralston

IPC: H03F3/16 ,  A61B5/00 ,  A61B8/00 ,  G01S7/52 ,  H03F1/08 ,  H03F3/45

CPC classification number: H03F3/16 ,  A61B5/6801 ,  A61B8/4444 ,  G01S7/52025 ,  H03F1/086 ,  H03F3/45183 ,  A61B8/5207 ,  H03F2203/45726

Abstract: A variable current trans-impedance amplifier (TIA) for an ultrasound device is described. The TIA may be coupled to an ultrasonic transducer to amplify an output signal of the ultrasonic transducer representing an ultrasound signal received by the ultrasonic transducer. During acquisition of the ultrasound signal by the ultrasonic transducer, one or more current sources in the TIA may be varied.

公开(公告)号：US20240100565A1

公开(公告)日：2024-03-28

申请号：US18523949

申请日：2023-11-30

Applicant: BFLY OPERATIONS, INC.

Inventor： Jonathan M. Rothberg ,  Keith G. Fife ,  Tyler S. Ralston ,  Gregory L. Charvat ,  Nevada J. Sanchez

IPC: B06B1/02 ,  B81B3/00 ,  B81B7/00 ,  B81C1/00 ,  G10K9/12 ,  G10K11/18

CPC classification number: B06B1/02 ,  B06B1/0292 ,  B81B3/0021 ,  B81B7/0077 ,  B81C1/00158 ,  G10K9/12 ,  G10K11/18 ,  B81B2203/0127 ,  B81B2203/0315 ,  B81B2207/015 ,  B81C2201/013 ,  B81C2203/0118 ,  B81C2203/0735 ,  B81C2203/0771

Abstract: CMOS Ultrasonic Transducers and processes for making such devices are described. The processes may include forming cavities on a first wafer and bonding the first wafer to a second wafer. The second wafer may be processed to form a membrane for the cavities. Electrical access to the cavities may be provided.

公开(公告)号：US11768282B2

公开(公告)日：2023-09-26

申请号：US17682937

申请日：2022-02-28

Applicant: BFLY Operations, Inc.

Inventor： Kailiang Chen ,  Tyler S. Ralston ,  Keith G. Fife

IPC: G01S7/52 ,  G01S15/89 ,  A61B7/04 ,  G01S7/521

CPC classification number: G01S7/52022 ,  G01S7/521 ,  G01S7/5202 ,  G01S7/5205 ,  G01S7/5208 ,  G01S7/52017 ,  G01S7/52047 ,  G01S15/8915 ,  G01S15/8977 ,  A61B7/04

Abstract: Circuitry for ultrasound devices is described. A multilevel pulser is described, which can provide bipolar pulses of multiple levels. The multilevel pulser includes a pulsing circuit and pulser and feedback circuit. Symmetric switches are also described. The symmetric switches can be positioned as inputs to ultrasound receiving circuitry to block signals from the receiving circuitry.

公开(公告)号：US11733363B2

公开(公告)日：2023-08-22

申请号：US17460928

申请日：2021-08-30

Applicant: BFLY Operations, Inc.

Inventor： Tyler S. Ralston ,  Andrew J. Casper ,  Nevada J. Sanchez

IPC: G01S7/52 ,  A61B8/00 ,  H04B11/00 ,  H04L5/00 ,  H04L41/0803 ,  H04L69/324

CPC classification number: G01S7/5208 ,  A61B8/44 ,  A61B8/4411 ,  A61B8/4472 ,  A61B8/54 ,  A61B8/565 ,  G01S7/52082 ,  H04B11/00 ,  H04L5/0048 ,  H04L41/0803 ,  H04L69/324

Abstract: Programmable ultrasound probes and methods of operation are described. The ultrasound probe may include memory storing parameter data and may also include a parameter loader which loads the parameter data into programmable circuitry of the ultrasound probe. In some instances, the ultrasound probe may include circuitry grouped into modules which may be repeatable and which may be coupled together to allow data to be exchanged between the modules.