Abstract:
The present disclosure relates to a reconstituted wafer- and/or panel-level package comprising a glass substrate having a plurality of cavities. Each cavity is configured to hold a single IC chip. The reconstituted wafer- and/or panel-level package can be used in a fan-out wafer or panel level packaging process. The glass substrate can include at least two layers having different photosensitivities with one layer being sufficiently photosensitive to be capable of being photomachined to form the cavities.
Abstract:
The present disclosure relates to a reconstituted wafer- and/or panel-level package comprising a glass substrate having a plurality of cavities. Each cavity is configured to hold a single IC chip. The reconstituted wafer- and/or panel-level package can be used in a fan-out wafer or panel level packaging process. The glass substrate can include at least two layers having different photosensitivities with one layer being sufficiently photosensitive to be capable of being photomachined to form the cavities.
Abstract:
A method of manufacturing a laminated glass article having a first clad layer, a second clad layer, and a core layer between the first clad layer and the second clad layer, by exposing an edge of the core layer. An etchant can be applied to the edge of the laminated glass article to form the recess. The recess can then be filled.
Abstract:
Laminated articles comprised of glass core and clad layers, more specifically, to compressively stressed laminated articles comprising a glass core sandwiched between first and second clad layers, the clad layers being formed from photosensitive glass.
Abstract:
Disclosed herein are sealed devices comprising a first substrate, a second substrate, an inorganic film between the first and second substrates, and at least one bond between the first and second substrates. The inorganic film can comprise about 10-80 mol % B2O3, about 5-60 mol % Bi2O3, and about 0-70 mol % ZnO. Methods for sealing devices using such an inorganic film are also disclosed herein, as well as display and electronic components comprising such sealed devices.
Abstract:
A method includes forming a glass article. The glass article includes a core and a clad adjacent to the core. The core includes a first glass composition. The clad includes a second glass composition different than the first glass composition. A degradation rate of the second glass composition in a reagent is greater than a degradation rate of the first glass composition in the reagent.
Abstract:
A method includes forming a glass article. The glass article includes a core and a clad adjacent to the core. The core includes a first glass composition. The clad includes a second glass composition different than the first glass composition. A degradation rate of the second glass composition in a reagent is greater than a degradation rate of the first glass composition in the reagent.
Abstract:
A microwave susceptor article having an advantageous microwave heating rate property and cooling rate property, including: a substrate; a metallic-containing layer on at least one major surface of the substrate; and optionally a protective coating on or associated with the metallic layer, as defined herein. Also disclosed are a method of making the article and a method of using the article.
Abstract:
A method of forming a sealed device comprising providing a first substrate having a first surface, providing a second substrate adjacent the first substrate, and forming a weld between an interface of the first substrate and the adjacent second substrate, wherein the weld is characterized by ((σtensile stress location)/(σinterface laser weld)) 10 MPa or >1 MPa where σtensile stress location is the stress present in the first substrate and σinterface laser weld is the stress present at the interface. This method may be used to manufacture a variety of different sealed packages.
Abstract:
A method of manufacturing a laminated glass article having a first clad layer, a second clad layer, and a core layer between the first clad layer and the second clad layer, by exposing an edge of the core layer. An etchant can be applied to the edge of the laminated glass article to form the recess. The recess can then be filled.