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62 条记录 (耗时 0.058 秒)

    Wireless input apparatus
    44.
    发明授权
    Wireless input apparatus 失效
    无线输入设备

    公开(公告)号：US08184452B2

    公开(公告)日：2012-05-22

    申请号：US12779019

    申请日：2010-05-12

    申请人： Tsung-Shih Lee ,  Wei-Hao Huang ,  Shu-Chen Lin

    发明人： Tsung-Shih Lee ,  Wei-Hao Huang ,  Shu-Chen Lin

    IPC分类号： H05K7/02 ,  H05K7/04

    CPC分类号： H05K5/0278

    摘要： A wireless input apparatus includes a shell having a recess at a top surface thereof. The recess has an opening at a rear wall thereof. A bottom of the recess is formed with two abreast sliding slots which extend perpendicular to the rear wall. A stopper is disposed across each sliding slot and spaced from a rear side of the sliding slot to form a stopping recess. Each of two opposite lateral walls of the recess has a guiding trough. A rear side of the guiding trough has a buckling notch at a lower portion thereof. A wireless transmitter has a main body and an insertion portion protruded from a rear end of the main body. The main body has two lumps at a bottom thereof corresponding to the stopping recesses, and a pair of sliding pieces protruded outwards from two opposite sides thereof corresponding to the buckling notches.

    摘要翻译： 无线输入装置包括在其顶表面具有凹部的外壳。 凹部在其后壁处具有开口。 凹部的底部形成有两个平行的滑动槽，其垂直于后壁延伸。 止动件设置在每个滑动槽上并且与滑动槽的后侧间隔开以形成止动凹槽。 凹槽的两个相对的侧壁中的每一个具有导向槽。 引导槽的后侧在其下部具有弯曲的切口。 无线发射机具有主体和从主体的后端突出的插入部分。 主体在其底部具有对应于止动凹部的两个块体，以及从对应于弯曲凹口的两个相对侧向外突出的一对滑动件。

    Manufacturing method of housing of electronic device
    45.
    发明申请
    Manufacturing method of housing of electronic device 有权
    电子设备外壳的制造方法

    公开(公告)号：US20120061879A1

    公开(公告)日：2012-03-15

    申请号：US13064111

    申请日：2011-03-07

    申请人： Shu-Chen Lin

    发明人： Shu-Chen Lin

    IPC分类号： B29C45/14 ,  B06B1/02

    CPC分类号： B29C45/14795 ,  B29C2045/14155 ,  B29C2045/14803 ,  B29L2031/3481 ,  G01D11/245

    摘要： A manufacturing method of housing of electronic device comprises following steps: providing a metal member; forming a plurality of micro anchored apertures on a surface of the metal member; placing the metal member in a plastic injection mold, wherein the plastic injection mold is set at a first temperature; and providing a molten plastic material in the plastic injection mold for integrating with the surface of the metal member with an injection molding manner, wherein the plastic injection mold is set at a second temperature, and the second temperature is higher than the first temperature.

    摘要翻译： 电子设备的外壳的制造方法包括以下步骤：提供金属构件; 在所述金属构件的表面上形成多个微锚定孔; 将金属构件放置在塑料注射模具中，其中塑料注射模具设置在第一温度; 以及在所述塑料注射模具中提供熔融塑性材料，用于与所述金属构件的表面一体地注塑成型，其中所述塑料注射模具被设定在第二温度，并且所述第二温度高于所述第一温度。

    Injection mold having pre-heating device, the pre-heating device, and method for pre-heating injection mold
    46.
    发明申请
    Injection mold having pre-heating device, the pre-heating device, and method for pre-heating injection mold 有权
    注射模具具有预热装置，预热装置和预热注射模具的方法

    公开(公告)号：US20110140310A1

    公开(公告)日：2011-06-16

    申请号：US12801771

    申请日：2010-06-24

    申请人： Shu-Chen Lin

    发明人： Shu-Chen Lin

    IPC分类号： B29C45/73

    CPC分类号： B29C45/73 ,  B29C33/06 ,  B29C2035/0811

    摘要： An injection mold having pre-heating device, the pre-heating device, and method for pre-heating injection mold are provided. The pre-heating device includes a high frequency coil member and a transportation device having a Z axle servo motor, a Z axle linear sliding rail, an annular transportation belt and a lifting rack. The annular transportation belt is driven by the Z axle servo motor. The high frequency coil member is hung on the lifting rack. The lifting rack is moveably connected to the Z axle linear sliding rail, coupled to the annular transportation belt and is driven by the annular transportation belt to perform an ascent or descent movement along the Z axle linear sliding rail.

    摘要翻译： 提供了具有预热装置的注射模具，预热装置和用于预热注射模具的方法。 预热装置包括高频线圈构件和具有Z轴伺服电动机，Z轴线性滑轨，环形输送带和提升架的运输装置。 环形输送带由Z轴伺服电机驱动。 高频线圈构件悬挂在起重架上。 起重架可移动地连接到Z轴线性滑轨，联接到环形输送带，并由环形输送带驱动，以沿着Z轴线性滑轨进行上升或下降运动。

    Process for preparing phenolepoxy resins in the absence of an aqueous phase
    50.
    发明授权
    Process for preparing phenolepoxy resins in the absence of an aqueous phase 失效
    在没有水相的情况下制备苯酚酚醛树脂的方法

    公开(公告)号：US5844062A

    公开(公告)日：1998-12-01

    申请号：US841728

    申请日：1997-04-29

    申请人： Kung-Lung Cheng ,  Woan-Shiow Tzeng ,  Shu-Chen Lin

    发明人： Kung-Lung Cheng ,  Woan-Shiow Tzeng ,  Shu-Chen Lin

    IPC分类号： C07D303/22 ,  C07D303/24 ,  C08G59/24 ,  C08G59/32 ,  H05K1/03 ,  C08G59/06 ,  C08G59/08

    CPC分类号： C07D303/22 ,  C07D303/24 ,  C08G59/245 ,  C08G59/3218 ,  H05K1/0326

    摘要： A process for preparing phenolepoxy resin represented by the following formula: ##STR1## wherein: (a) R.sup.1, R.sup.2, R.sup.3, and R.sup.4, which can be the same or different, are hydrogen, C.sub.1 to C.sub.6 alkyl groups, C.sub.6 to C.sub.10 aromatic groups, or C.sub.1 to C.sub.6 alkyl group-substituted C.sub.6 to C.sub.10 aromatic groups; (b) R.sup.5 and R.sup.6, which can be the same or different, are hydrogen, C.sub.1 to C.sub.6 alkyl groups, C.sub.6 to C.sub.10 aromatic groups, or C.sub.1 to C.sub.6 alkyl group-substituted C.sub.6 to C.sub.10 aromatic groups; ##STR2## (c) R.sup.7 is hydrogen, C.sub.1 to C.sub.6 alkyl groups, C.sub.6 to C.sub.10 aromatic groups, or C.sub.1 to C.sub.6 alkyl group-substituted C.sub.6 to C.sub.10 aromatic groups; (d) R.sup.8 and R.sup.9, which can be the same of different, are hydrogen, C.sub.1 to C.sub.6 alkyl groups, C.sub.6 to C.sub.10 aromatic groups, or C.sub.1 to C.sub.6 alkyl group-substituted C.sub.6 to C.sub.10 aromatic groups; and (e) n is an integer of 0 or 1. The phenolepoxy resin can be advantageously used in making packaging materials for ICs, as a substrate additive for printed circuit boards, and as adhesive for the electronic industry. The process includes the steps of preparing a reaction medium which contains only polyphenol, epihalohydrinl and an imidazole catalyst, and then causing the reaction medium to react in the absence of an aqueous phase.

    摘要翻译： 一种制备由下式表示的苯氧基树脂的方法：其中：（a）可以相同或不同的R 1，R 2，R 3和R 4为氢，C 1至C 6烷基，C 6至C 10芳族 或C 1〜C 6烷基取代的C 6〜C 10芳香族基团; （b）R5和R6可以相同或不同，为氢，C1至C6烷基，C6至C10芳族基团或C1至C6烷基取代的C6至C10芳族基团; （c）R7是氢，C1至C6烷基，C6至C10芳族基团或C1至C6烷基取代的C6至C10芳族基团; （d）可以相同不同的R 8和R 9为氢，C 1至C 6烷基，C 6至C 10芳族基团或C 1至C 6烷基取代的C 6至C 10芳族基团; 和（e）n为0或1的整数。苯酚环氧树脂可以有利地用于制造用于IC的包装材料，作为印刷电路板的基材添加剂和作为电子工业的粘合剂。 该方法包括制备仅含有多酚，表卤代醇和咪唑催化剂的反应介质，然后使反应介质在不存在水相的情况下反应的步骤。