System and method for micro-electromechanical operation of an interferometric modulator
    41.
    发明授权
    System and method for micro-electromechanical operation of an interferometric modulator 失效
    用于干涉式调制器的微机电操作的系统和方法

    公开(公告)号:US08115988B2

    公开(公告)日:2012-02-14

    申请号:US12241600

    申请日:2008-09-30

    IPC分类号: G02B26/00

    摘要: An interferometric modulator is formed by a stationary layer and a mirror facing the stationary layer. The mirror is movable between the undriven and driven positions. Landing pads, bumps or spring clips are formed on at least one of the stationary layer and the mirror. The landing pads, bumps or spring clips can prevent the stationary layer and the mirror from contacting each other when the mirror is in the driven position. The spring clips exert force on the mirror toward the undriven position when the mirror is in the driven position and in contact with the spring clips.

    摘要翻译: 干涉式调制器由固定层和面向固定层的反射镜形成。 镜子可以在未驱动和被驱动位置之间移动。 在固定层和反射镜中的至少一个上形成着陆垫,凸块或弹簧夹。 当反射镜处于驱动位置时,着陆垫,凸块或弹簧夹可以防止固定层和反射镜彼此接触。 当镜子处于从动位置并与弹簧夹接触时,弹簧夹在镜子上朝着未驱动的位置施加力。

    Spatial light modulator with integrated optical compensation structure
    42.
    发明授权
    Spatial light modulator with integrated optical compensation structure 失效
    具有集成光学补偿结构的空间光调制器

    公开(公告)号:US08111445B2

    公开(公告)日:2012-02-07

    申请号:US12014657

    申请日:2008-01-15

    IPC分类号: G02B26/00

    摘要: A spatial light modulator comprises an integrated optical compensation structure, e.g., an optical compensation structure arranged between a substrate and a plurality of individually addressable light-modulating elements, or an optical compensation structure located on the opposite side of the light-modulating elements from the substrate. The individually addressable light-modulating elements are configured to modulate light transmitted through or reflected from the transparent substrate. Methods for making such spatial light modulators involve fabricating an optical compensation structure over a substrate and fabricating a plurality of individually addressable light-modulating elements over the optical compensation structure. The optical compensation structure may be a passive optical compensation structure. The optical compensation structure may include one or more of a supplemental frontlighting source, a diffuser, a black mask, a diffractive optical element, a color filter, an anti-reflective layer, a structure that scatters light, a microlens array, and a holographic film.

    摘要翻译: 空间光调制器包括集成的光学补偿结构,例如,布置在基板和多个可单独寻址的光调制元件之间的光学补偿结构,或位于光调制元件的相对侧上的光学补偿结构 基质。 可单独寻址的光调制元件被配置为调制透射通过或从透明基板反射的光。 制造这种空间光调制器的方法包括在衬底上制造光学补偿结构,并在光学补偿结构上制造多个单独可寻址的光调制元件。 光学补偿结构可以是无源光学补偿结构。 光学补偿结构可以包括补充前照明光源,漫射器,黑色掩模,衍射光学元件,滤色器,抗反射层,散射光的结构,微透镜阵列和全息图中的一个或多个 电影。

    Methods of fabricating MEMS devices having overlying support structures
    44.
    发明授权
    Methods of fabricating MEMS devices having overlying support structures 有权
    制造具有上覆支撑结构的MEMS装置的方法

    公开(公告)号:US07875485B2

    公开(公告)日:2011-01-25

    申请号:US12510046

    申请日:2009-07-27

    IPC分类号: H01L21/00

    摘要: Embodiments of MEMS devices comprise a conductive movable layer spaced apart from a conductive fixed layer by a gap, and supported by rigid support structures, or rivets, overlying depressions in the conductive movable layer, or by posts underlying depressions in the conductive movable layer. In certain embodiments, portions of the rivet structures extend through the movable layer and contact underlying layers. In other embodiments, the material used to form the rigid support structures may also be used to passivate otherwise exposed electrical leads in electrical connection with the MEMS devices, protecting the electrical leads from damage or other interference.

    摘要翻译: MEMS器件的实施例包括通过间隙与导电固定层间隔开的导电可移动层,并且由导电可移动层中的上凹部的刚性支撑结构或铆钉支撑,或由导电可移动层中的凹陷下方的柱支撑。 在某些实施例中,铆钉结构的部分延伸穿过可移动层并接触下面的层。 在其他实施例中,用于形成刚性支撑结构的材料也可以用于钝化与MEMS装置电连接的其它暴露的电引线,保护电引线免受损坏或其他干扰。

    MEMS DEVICES HAVING OVERLYING SUPPORT STRUCTURES AND METHODS OF FABRICATING THE SAME
    46.
    发明申请
    MEMS DEVICES HAVING OVERLYING SUPPORT STRUCTURES AND METHODS OF FABRICATING THE SAME 有权
    具有过度支持结构的MEMS器件及其制造方法

    公开(公告)号:US20100019336A1

    公开(公告)日:2010-01-28

    申请号:US12510046

    申请日:2009-07-27

    IPC分类号: H01L31/02 H01L31/18

    摘要: Embodiments of MEMS devices comprise a conductive movable layer spaced apart from a conductive fixed layer by a gap, and supported by rigid support structures, or rivets, overlying depressions in the conductive movable layer, or by posts underlying depressions in the conductive movable layer. In certain embodiments, portions of the rivet structures extend through the movable layer and contact underlying layers. In other embodiments, the material used to form the rigid support structures may also be used to passivate otherwise exposed electrical leads in electrical connection with the MEMS devices, protecting the electrical leads from damage or other interference.

    摘要翻译: MEMS器件的实施例包括通过间隙与导电固定层间隔开的导电可移动层,并且由导电可移动层中的上凹部的刚性支撑结构或铆钉支撑,或由导电可移动层中的凹陷下方的柱支撑。 在某些实施例中,铆钉结构的部分延伸穿过可移动层并接触下面的层。 在其他实施例中,用于形成刚性支撑结构的材料也可以用于钝化与MEMS装置电连接的其它暴露的电引线,保护电引线免受损坏或其他干扰。

    METHOD OF FABRICATING INTERFEROMETRIC DEVICES USING LIFT-OFF PROCESSING TECHNIQUES
    47.
    发明申请
    METHOD OF FABRICATING INTERFEROMETRIC DEVICES USING LIFT-OFF PROCESSING TECHNIQUES 有权
    使用提升加工技术制造干涉装置的方法

    公开(公告)号:US20090262412A1

    公开(公告)日:2009-10-22

    申请号:US12494032

    申请日:2009-06-29

    IPC分类号: G02B26/02 B05D5/12 B29D11/00

    CPC分类号: G02B26/001

    摘要: Embodiments of the present disclosure include a method of fabricating interferometric devices using lift-off processing techniques. Use of lift-off processing in the fabrication of various layers of interferometric modulators, such as an optical stack or a flex layer, advantageously avoids individualized chemistries associated with the plurality of materials associated with each layer thereof. Moreover, use of lift-off processing allows much greater selection in both materials and facilities available for fabrication of interferometric modulators.

    摘要翻译: 本公开的实施例包括使用剥离处理技术制造干涉仪的方法。 在诸如光学堆叠或柔性层的各种干涉式调制器的制造中使用剥离处理有利地避免了与与其每层相关联的多种材料相关联的个体化化学物质。 此外,使用剥离处理可以在可用于制造干涉式调制器的材料和设备中进行更大的选择。

    System and method for micro-electromechanical operation of an interferometric modulator
    48.
    发明授权
    System and method for micro-electromechanical operation of an interferometric modulator 有权
    用于干涉式调制器的微机电操作的系统和方法

    公开(公告)号:US07567373B2

    公开(公告)日:2009-07-28

    申请号:US11189690

    申请日:2005-07-26

    IPC分类号: G02B26/00

    摘要: An interferometric modulator is formed by a stationary layer and a mirror facing the stationary layer. The mirror is movable between the undriven and driven positions. Landing pads, bumps or spring clips are formed on at least one of the stationary layer and the mirror. The landing pads, bumps or spring clips can prevent the stationary layer and the mirror from contacting each other when the mirror is in the driven position. The spring clips exert force on the mirror toward the undriven position when the mirror is in the driven position and in contact with the spring clips.

    摘要翻译: 干涉式调制器由固定层和面向固定层的反射镜形成。 镜子可以在未驱动和被驱动位置之间移动。 在固定层和反射镜中的至少一个上形成着陆垫,凸块或弹簧夹。 当反射镜处于驱动位置时,着陆垫,凸块或弹簧夹可以防止固定层和反射镜彼此接触。 当镜子处于从动位置并与弹簧夹接触时,弹簧夹在镜子上朝着未驱动的位置施加力。

    CONDUCTIVE BUS STRUCTURE FOR INTERFEROMETRIC MODULATOR ARRAY
    50.
    发明申请
    CONDUCTIVE BUS STRUCTURE FOR INTERFEROMETRIC MODULATOR ARRAY 有权
    用于干涉式调制器阵列的导电总线结构

    公开(公告)号:US20080080043A1

    公开(公告)日:2008-04-03

    申请号:US11875613

    申请日:2007-10-19

    IPC分类号: G02F1/29

    摘要: Embodiments of an interferometric modulator are disclosed having various enhancements and features including a conductive bus. In certain embodiments, the interferometric modulator has a first conductive layer suspended over a second electrode layer. In certain embodiments, a second conductive layer is provided over the first conductive layer. One of the first and/or second conductive buses may further connect to the first electrode layer and/or the second electrode layer. Other disclosed features can be incorporated into embodiments of the interferometric modulator to improve response time, power consumption, and image resolution.

    摘要翻译: 公开了具有包括导电总线的各种增强和特征的干涉式调制器的实施例。 在某些实施例中,干涉式调制器具有悬挂在第二电极层上的第一导电层。 在某些实施例中,在第一导电层上提供第二导电层。 第一和/或第二导电总线之一可以进一步连接到第一电极层和/或第二电极层。 其他公开的特征可并入干涉式调制器的实施例中以改善响应时间,功耗和图像分辨率。