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    System and method of illuminating interferometric modulators using backlighting
    1.
    发明授权
    System and method of illuminating interferometric modulators using backlighting 失效
    使用背光照明干涉式调制器的系统和方法

    公开(公告)号：US08040588B2

    公开(公告)日：2011-10-18

    申请号：US12036668

    申请日：2008-02-25

    申请人： Clarence Chui ,  Ming-Hau Tung

    发明人： Clarence Chui ,  Ming-Hau Tung

    IPC分类号： G02B26/00 ,  G02F1/03 ,  G02F2/00

    CPC分类号： G02B26/001 ,  G09G3/3406 ,  G09G3/3466 ,  H04M1/22 ,  H04N5/7458 ,  H04W52/027 ,  Y02D70/1222 ,  Y02D70/142 ,  Y02D70/144 ,  Y02D70/164 ,  Y02D70/26 ,  Y10S359/90

    摘要： An interferometric modulator array device with backlighting is disclosed. The interferometric modulator array device comprises a plurality of interferometric modulator elements, wherein each of the interferometric modulator elements comprises an optical cavity. The interferometric modulator array includes an optical aperture region, and at least one reflecting element is positioned so as to receive light passing through the optical aperture region and reflect at least a portion of the received light to the cavities of the interferometric modulator elements. In some embodiments, the interferometric modulator elements may be separated from each other such that an optical aperture region is formed between adjacent interferometric modulator elements.

    摘要翻译： 公开了具有背光的干涉式调制器阵列器件。 干涉式调制器阵列装置包括多个干涉式调制器元件，其中每个干涉式调制器元件包括光腔。 所述干涉式调制器阵列包括光学孔区域，并且至少一个反射元件被定位成接收穿过所述光学孔径区域的光，并将所接收的光的至少一部分反射到所述干涉式调制器元件的空腔。 在一些实施例中，干涉式调制器元件可以彼此分离，使得在相邻的干涉式调制器元件之间形成光学孔径区域。

    Method of fabricating interferometric devices using lift-off processing techniques
    3.
    发明授权
    Method of fabricating interferometric devices using lift-off processing techniques 有权
    使用剥离处理技术制造干涉仪的方法

    公开(公告)号：US07906353B2

    公开(公告)日：2011-03-15

    申请号：US12494032

    申请日：2009-06-29

    申请人： Clarence Chui ,  Ming-Hau Tung

    发明人： Clarence Chui ,  Ming-Hau Tung

    IPC分类号： H01L21/00

    CPC分类号： G02B26/001

    摘要： Embodiments of the present disclosure include a method of fabricating interferometric devices using lift-off processing techniques. Use of lift-off processing in the fabrication of various layers of interferometric modulators, such as an optical stack or a flex layer, advantageously avoids individualized chemistries associated with the plurality of materials associated with each layer thereof. Moreover, use of lift-off processing allows much greater selection in both materials and facilities available for fabrication of interferometric modulators.

    摘要翻译： 本公开的实施例包括使用剥离处理技术制造干涉仪的方法。 在诸如光学堆叠或柔性层的各种干涉式调制器的制造中使用剥离处理有利地避免了与与其每层相关联的多种材料相关联的个体化化学物质。 此外，使用剥离处理可以在可用于制造干涉式调制器的材料和设备中进行更大的选择。

    METHOD OF MANUFACTURE FOR MICROELECTROMECHANICAL DEVICES
    5.
    发明申请
    METHOD OF MANUFACTURE FOR MICROELECTROMECHANICAL DEVICES 有权
    微电子设备制造方法

    公开(公告)号：US20090068781A1

    公开(公告)日：2009-03-12

    申请号：US12271793

    申请日：2008-11-14

    申请人： Ming-Hau Tung ,  Brian James Gally ,  Manish Kothari ,  Clarence Chui ,  John Batey

    发明人： Ming-Hau Tung ,  Brian James Gally ,  Manish Kothari ,  Clarence Chui ,  John Batey

    IPC分类号： H01L21/00

    CPC分类号： B81C1/00579 ,  B81B3/0008 ,  Y10T428/12542

    摘要： A method of manufacturing a microelectromechanical device includes forming at least two conductive layers on a substrate. An isolation layer is formed between the two conductive layers. The conductive layers are electrically coupled together and then the isolation layer is removed to form a gap between the conductive layers. The electrical coupling of the layers mitigates or eliminates the effects of electrostatic charge build up on the device during the removal process.

    摘要翻译： 一种制造微机电装置的方法包括在基板上形成至少两个导电层。 在两个导电层之间形成隔离层。 导电层电耦合在一起，然后去除隔离层以在导电层之间形成间隙。 这些层的电耦合可减轻或消除在去除过程中静电积累在器件上的影响。

    SYSTEM AND METHOD FOR MICRO-ELECTROMECHANICAL OPERATION OF AN INTERFEROMETRIC MODULATOR
    6.
    发明申请
    SYSTEM AND METHOD FOR MICRO-ELECTROMECHANICAL OPERATION OF AN INTERFEROMETRIC MODULATOR 失效
    一种干涉式调制器的微机电操作系统与方法

    公开(公告)号：US20090022884A1

    公开(公告)日：2009-01-22

    申请号：US12241600

    申请日：2008-09-30

    申请人： Clarence Chui ,  William J. Cummings ,  Brian J. Gally ,  Ming-Hau Tung

    发明人： Clarence Chui ,  William J. Cummings ,  Brian J. Gally ,  Ming-Hau Tung

    IPC分类号： B81C5/00 ,  B05D5/12

    CPC分类号： B81B3/001 ,  B81B2201/042 ,  G02B26/001

    摘要： An interferometric modulator is formed by a stationary layer and a mirror facing the stationary layer. The mirror is movable between the undriven and driven positions. Landing pads, bumps or spring clips are formed on at least one of the stationary layer and the mirror. The landing pads, bumps or spring clips can prevent the stationary layer and the mirror from contacting each other when the mirror is in the driven position. The spring clips exert force on the mirror toward the undriven position when the mirror is in the driven position and in contact with the spring clips.

    摘要翻译： 干涉式调制器由固定层和面向固定层的反射镜形成。 镜子可以在未驱动和被驱动位置之间移动。 在固定层和反射镜中的至少一个上形成着陆垫，凸块或弹簧夹。 当反射镜处于驱动位置时，着陆垫，凸块或弹簧夹可以防止固定层和反射镜彼此接触。 当镜子处于从动位置并与弹簧夹接触时，弹簧夹在镜子上朝着未驱动的位置施加力。

    Method of manufacture for microelectromechanical devices
    7.
    发明授权
    Method of manufacture for microelectromechanical devices 有权
    微机电装置的制造方法

    公开(公告)号：US07476327B2

    公开(公告)日：2009-01-13

    申请号：US10839329

    申请日：2004-05-04

    申请人： Ming-Hau Tung ,  Brian James Gally ,  Manish Kothari ,  Clarence Chui ,  John Batey

    发明人： Ming-Hau Tung ,  Brian James Gally ,  Manish Kothari ,  Clarence Chui ,  John Batey

    IPC分类号： B21D39/00

    CPC分类号： B81C1/00579 ,  B81B3/0008 ,  Y10T428/12542

    摘要： A method of manufacturing a microelectromechanical device includes forming at least two conductive layers on a substrate. An isolation layer is formed between the two conductive layers. The conductive layers are electrically coupled together and then the isolation layer is removed to form a gap between the conductive layers. The electrical coupling of the layers mitigates or eliminates the effects of electrostatic charge build up on the device during the removal process.

    摘要翻译： 一种制造微机电装置的方法包括在基板上形成至少两个导电层。 在两个导电层之间形成隔离层。 导电层电耦合在一起，然后去除隔离层以在导电层之间形成间隙。 这些层的电耦合可减轻或消除在去除过程中静电积累在器件上的影响。

    MEMS devices having overlying support structures and methods of fabricating the same
    8.
    发明申请
    MEMS devices having overlying support structures and methods of fabricating the same 有权
    具有上覆支撑结构的MEMS器件及其制造方法

    公开(公告)号：US20070019280A1

    公开(公告)日：2007-01-25

    申请号：US11490880

    申请日：2006-07-21

    申请人： Teruo Sasagawa ,  SuryaPrakash Ganti ,  Mark Miles ,  Clarence Chui ,  Manish Kothari ,  Ming-Hau Tung

    发明人： Teruo Sasagawa ,  SuryaPrakash Ganti ,  Mark Miles ,  Clarence Chui ,  Manish Kothari ,  Ming-Hau Tung

    IPC分类号： G02F1/29 ,  G02B6/00

    CPC分类号： G02B26/001 ,  B81B3/007 ,  B81B2201/047 ,  B81B2203/0307 ,  B81B2203/053

    摘要： Embodiments of MEMS devices comprise a conductive movable layer spaced apart from a conductive fixed layer by a gap, and supported by rigid support structures, or rivets, overlying depressions in the conductive movable layer, or by posts underlying depressions in the conductive movable layer. In certain embodiments, portions of the rivet structures extend through the movable layer and contact underlying layers. In other embodiments, the material used to form the rigid support structures may also be used to passivate otherwise exposed electrical leads in electrical connection with the MEMS devices, protecting the electrical leads from damage or other interference.

    摘要翻译： MEMS器件的实施例包括通过间隙与导电固定层间隔开的导电可移动层，并且由导电可移动层中的上凹部的刚性支撑结构或铆钉支撑，或由导电可移动层中的凹陷下方的柱支撑。 在某些实施例中，铆钉结构的部分延伸穿过可移动层并接触下面的层。 在其他实施例中，用于形成刚性支撑结构的材料也可以用于钝化与MEMS装置电连接的其它暴露的电引线，保护电引线免受损坏或其他干扰。

    Spatial light modulator with integrated optical compensation structure
    9.
    发明授权
    Spatial light modulator with integrated optical compensation structure 有权
    具有集成光学补偿结构的空间光调制器

    公开(公告)号：US09019590B2

    公开(公告)日：2015-04-28

    申请号：US13337494

    申请日：2011-12-27

    申请人： Clarence Chui ,  Jeffrey B. Sampsell ,  William J. Cummings ,  Ming-Hau Tung

    发明人： Clarence Chui ,  Jeffrey B. Sampsell ,  William J. Cummings ,  Ming-Hau Tung

    IPC分类号： G02B26/00 ,  G02F1/1335

    CPC分类号： G02F1/21 ,  G02B26/001 ,  G02F1/1335 ,  G02F2001/13356

    摘要： A spatial light modulator comprises an integrated optical compensation structure, e.g., an optical compensation structure arranged between a substrate and a plurality of individually addressable light-modulating elements, or an optical compensation structure located on the opposite side of the light-modulating elements from the substrate. The individually addressable light-modulating elements are configured to modulate light transmitted through or reflected from the transparent substrate. Methods for making such spatial light modulators involve fabricating an optical compensation structure over a substrate and fabricating a plurality of individually addressable light-modulating elements over the optical compensation structure. The optical compensation structure may be a passive optical compensation structure. The optical compensation structure may include one or more of a supplemental frontlighting source, a diffuser, a black mask, a diffractive optical element, a color filter, an anti-reflective layer, a structure that scatters light, a microlens array, and a holographic film.

    摘要翻译： 空间光调制器包括集成的光学补偿结构，例如，布置在基板和多个可单独寻址的光调制元件之间的光学补偿结构，或位于光调制元件的相对侧上的光学补偿结构 基质。 可单独寻址的光调制元件被配置为调制透射通过或从透明基板反射的光。 制造这种空间光调制器的方法包括在衬底上制造光学补偿结构，并在光学补偿结构上制造多个单独可寻址的光调制元件。 光学补偿结构可以是无源光学补偿结构。 光学补偿结构可以包括补充前照明光源，漫射器，黑色掩模，衍射光学元件，滤色器，抗反射层，散射光的结构，微透镜阵列和全息图中的一个或多个 电影。

    Spatial light modulator with integrated optical compensation structure
    10.
    发明授权
    Spatial light modulator with integrated optical compensation structure 有权
    具有集成光学补偿结构的空间光调制器

    公开(公告)号：US08045252B2

    公开(公告)日：2011-10-25

    申请号：US12034499

    申请日：2008-02-20

    申请人： Clarence Chui ,  Jeffrey B. Sampsell ,  William J. Cummings ,  Ming-Hau Tung

    发明人： Clarence Chui ,  Jeffrey B. Sampsell ,  William J. Cummings ,  Ming-Hau Tung

    IPC分类号： G02B26/00 ,  G02F1/33

    CPC分类号： G02F1/21 ,  G02B26/001 ,  G02F1/1335 ,  G02F2001/13356

    摘要： A spatial light modulator comprises an integrated optical compensation structure, e.g., an optical compensation structure arranged between a substrate and a plurality of individually addressable light-modulating elements, or an optical compensation structure located on the opposite side of the light-modulating elements from the substrate. The individually addressable light-modulating elements are configured to modulate light transmitted through or reflected from the transparent substrate. Methods for making such spatial light modulators involve fabricating an optical compensation structure over a substrate and fabricating a plurality of individually addressable light-modulating elements over the optical compensation structure. The optical compensation structure may be a passive optical compensation structure. The optical compensation structure may include one or more of a supplemental frontlighting source, a diffuser, a black mask, a diffractive optical element, a color filter, an anti-reflective layer, a structure that scatters light, a microlens array, and a holographic film.

    摘要翻译： 空间光调制器包括集成的光学补偿结构，例如，布置在基板和多个可单独寻址的光调制元件之间的光学补偿结构，或位于光调制元件的相对侧上的光学补偿结构 基质。 可单独寻址的光调制元件被配置为调制透射通过或从透明基板反射的光。 制造这种空间光调制器的方法包括在衬底上制造光学补偿结构，并在光学补偿结构上制造多个单独可寻址的光调制元件。 光学补偿结构可以是无源光学补偿结构。 光学补偿结构可以包括补充前照明光源，漫射器，黑色掩模，衍射光学元件，滤色器，抗反射层，散射光的结构，微透镜阵列和全息图中的一个或多个 电影。