Visible light emitting vertical cavity surface emitting laser with
gallium phosphide contact layer and method of fabrication
    41.
    发明授权
    Visible light emitting vertical cavity surface emitting laser with gallium phosphide contact layer and method of fabrication 失效
    可见光发射垂直腔表面发射激光器与磷化镓接触层及其制造方法

    公开(公告)号:US5923696A

    公开(公告)日:1999-07-13

    申请号:US774822

    申请日:1996-12-27

    摘要: A stack of distributed Bragg reflectors is disposed on the surface of a semiconductor substrate. The stack includes a plurality of alternating layers of material having alternating refractive indexes with the stack having a first dopant type. A first cladding region is disposed on the stack with an active area disposed on the first cladding region. The active area includes at least two barrier layers and a quantum well layer. A second cladding region is disposed on the active area with a stack of distributed Bragg reflectors disposed on the cladding region. A contact region is disposed on the second stack of distributed Bragg reflectors. The contact region includes a magnesium doped gallium phosphide material.

    摘要翻译: 分布式布拉格反射器的堆叠被布置在半导体衬底的表面上。 堆叠包括具有交替折射率的多个交替层的材料,堆叠具有第一掺杂剂类型。 第一包层区域设置在堆叠上,具有设置在第一包层区域上的有源区域。 有源区包括至少两个势垒层和量子阱层。 第二包层区域设置在有源区上,并且布置在包层区域上的分布式布拉格反射器堆叠。 接触区域布置在分布布拉格反射器的第二堆叠上。 接触区域包括掺杂镁的磷化镓材料。

    Semiconductor laser for package with power monitoring system
    43.
    发明授权
    Semiconductor laser for package with power monitoring system 失效
    半导体激光器封装带电源监控系统

    公开(公告)号:US5881084A

    公开(公告)日:1999-03-09

    申请号:US814532

    申请日:1997-03-10

    摘要: A semiconductor laser package and method of fabrication including a vertical cavity surface emitting laser and a power monitoring system, such as a photodetector mounted on a mounting base. An optical element, such as a beam splitter, formed integral with the mounting base or as a separate element positioned on the mounting base in optical alignment with an emission generated by the vertical cavity surface emitting laser. The optical element characterized by reflecting a portion of the emission in the direction of the photodetector and allowing a portion of the emission to pass therethrough. An overmolded housing is positioned on the mounting base to enclose the vertical cavity surface emitting laser, the photodetector and the optical element.

    摘要翻译: 一种半导体激光器封装及其制造方法,包括垂直腔表面发射激光器和功率监控系统,例如安装在安装基座上的光电检测器。 一种光学元件,例如分束器,其与安装基座一体形成,或者作为与由垂直腔表面发射激光器产生的发射光学对准的位于安装基座上的单独元件。 所述光学元件的特征在于,在所述光电检测器的方向上反射所述发射的一部分并允许所述发射的一部分通过。 包覆模制的壳体位于安装基座上以包围垂直腔表面发射激光器,光电检测器和光学元件。

    Semiconductor laser package with power monitoring system and optical
element
    44.
    发明授权
    Semiconductor laser package with power monitoring system and optical element 失效
    具有功率监控系统和光学元件的半导体激光封装

    公开(公告)号:US5838703A

    公开(公告)日:1998-11-17

    申请号:US719829

    申请日:1996-09-30

    摘要: A semiconductor laser package including a mounting structure at least partially encapsulating a vertical cavity surface emitting laser and a photodetector. The vertical cavity surface emitting laser generating an emission along a path. The photodetector optically positioned and/or integrally formed with the vertical cavity surface emitting laser to receive a portion of the emission. An optical element is optionally positioned in the path, mounted on the mounting structure utilizing a snap-fit connection, a threaded or adhesive mounting. The mounting structure and optical element are fabricated to allow for proper z-axis alignment of the optical element relative to the laser emission aperture.

    摘要翻译: 一种半导体激光器封装,包括至少部分地封装垂直腔表面发射激光器的安装结构和光电检测器。 垂直腔表面发射激光器沿着路径产生发射。 光电探测器与垂直腔表面发射激光器光学定位和/或整体地形成以接收发射的一部分。 光学元件可选地定位在路径中,利用卡扣连接,螺纹或粘合剂安装安装在安装结构上。 制造安装结构和光学元件以允许光学元件相对于激光发射孔的适当的z轴对准。

    Smart card with contactless optical interface
    45.
    发明授权
    Smart card with contactless optical interface 失效
    智能卡带有非接触式光接口

    公开(公告)号:US5789733A

    公开(公告)日:1998-08-04

    申请号:US717058

    申请日:1996-09-20

    IPC分类号: G06K7/10 G06K19/077 G06K19/06

    摘要: An optical smart card (10) including a microchip (14) having information stored thereon, an optical holographic sensor pad (16) capable of detecting and collecting light beams emitted from a remote reader/transmitter (52), a light source (18) capable of emitting dataelectronic information contained on the microchip (14) back to the remote reader/transmitter (52) and electronics (20) connected to the sensor pad (16), the light source (18) and the microchip (14).

    摘要翻译: 一种光学智能卡(10),包括具有存储在其上的信息的微芯片(14),能够检测和收集从远程读取器/发射器(52)发射的光束的光学全息传感器垫(16),光源(18) 能够将包含在微芯片(14)上的数据电子信息发送回连接到传感器焊盘(16),光源(18)和微芯片(14)的远程读取器/发射器(52)和电子器件(20)。

    Coalescing optical module and method for making
    47.
    发明授权
    Coalescing optical module and method for making 失效
    聚光光模块及其制作方法

    公开(公告)号:US5636298A

    公开(公告)日:1997-06-03

    申请号:US699318

    申请日:1996-08-19

    摘要: An optical module (100) having a first side (103) and a second side (104), a plurality of input optical ports (144) and an output optical port (120) is formed. The input optical ports (144) are disposed on the first side (103) with the output optical port (156) being disposed on the second side (104) of the optical module (100). A plurality of bifurcated waveguides (118) are disposed in the optical module, the bifurcated waveguides (118) coalesce light from the plurality of input optical ports (144) into a single high power output at the output optical port (120).

    摘要翻译: 具有第一侧(103)和第二侧(104)的光学模块(100),多个输入光学端口(144)和输出光学端口(120)。 输入光学端口(144)设置在第一侧(103)上,输出光学端口(156)设置在光学模块(100)的第二侧(104)上。 多个分支波导(118)设置在光学模块中,分叉波导(118)将来自多个输入光学端口(144)的光聚结成在输出光学端口(120)处的单个高功率输出。

    Reflective optoelectronic interface device and method of making
    50.
    发明授权
    Reflective optoelectronic interface device and method of making 失效
    反光光电接口装置及其制作方法

    公开(公告)号:US5369529A

    公开(公告)日:1994-11-29

    申请号:US95452

    申请日:1993-07-19

    摘要: An interconnect substrate with a surface having a plurality of electrical tracings is provided. A photonic device having a working portion and contact electrically coupled to one of the plurality of electrical tracings is disposed on the interconnect substrate. A molded optical portion is formed that encapsulates the photonic device, as well as forming a reflective surface that directs light between an external light communicating structure and the photonic device.

    摘要翻译: 提供了具有多个电气追踪的表面的互连基板。 具有工作部分和接触电耦合到多个电气跟踪中的一个的光子器件设置在互连衬底上。 形成封装光子器件的模制光学部分,以及形成在外部光通信结构和光子器件之间引导光的反射表面。