摘要:
A stack of distributed Bragg reflectors is disposed on the surface of a semiconductor substrate. The stack includes a plurality of alternating layers of material having alternating refractive indexes with the stack having a first dopant type. A first cladding region is disposed on the stack with an active area disposed on the first cladding region. The active area includes at least two barrier layers and a quantum well layer. A second cladding region is disposed on the active area with a stack of distributed Bragg reflectors disposed on the cladding region. A contact region is disposed on the second stack of distributed Bragg reflectors. The contact region includes a magnesium doped gallium phosphide material.
摘要:
An apparatus for changing the phase of an optical storage medium changeable between a reflective phase and a dispersive phase. The apparatus including a quasi-multimode vertical cavity surface emitting laser constructed to provide a laser beam in a square shaped mode, to be directed onto the storage medium.
摘要:
A semiconductor laser package and method of fabrication including a vertical cavity surface emitting laser and a power monitoring system, such as a photodetector mounted on a mounting base. An optical element, such as a beam splitter, formed integral with the mounting base or as a separate element positioned on the mounting base in optical alignment with an emission generated by the vertical cavity surface emitting laser. The optical element characterized by reflecting a portion of the emission in the direction of the photodetector and allowing a portion of the emission to pass therethrough. An overmolded housing is positioned on the mounting base to enclose the vertical cavity surface emitting laser, the photodetector and the optical element.
摘要:
A semiconductor laser package including a mounting structure at least partially encapsulating a vertical cavity surface emitting laser and a photodetector. The vertical cavity surface emitting laser generating an emission along a path. The photodetector optically positioned and/or integrally formed with the vertical cavity surface emitting laser to receive a portion of the emission. An optical element is optionally positioned in the path, mounted on the mounting structure utilizing a snap-fit connection, a threaded or adhesive mounting. The mounting structure and optical element are fabricated to allow for proper z-axis alignment of the optical element relative to the laser emission aperture.
摘要:
An optical smart card (10) including a microchip (14) having information stored thereon, an optical holographic sensor pad (16) capable of detecting and collecting light beams emitted from a remote reader/transmitter (52), a light source (18) capable of emitting dataelectronic information contained on the microchip (14) back to the remote reader/transmitter (52) and electronics (20) connected to the sensor pad (16), the light source (18) and the microchip (14).
摘要:
A power monitoring system including a vertical cavity surface emitting laser generating an emission. A beam splitter optically positioned to receive the emission and split the emission into a first portion and a second portion. A monitor optically positioned to receive the first portion of the emission. An output of the monitor is used to control emissions of the vertical cavity surface emitting lasers.
摘要:
An optical module (100) having a first side (103) and a second side (104), a plurality of input optical ports (144) and an output optical port (120) is formed. The input optical ports (144) are disposed on the first side (103) with the output optical port (156) being disposed on the second side (104) of the optical module (100). A plurality of bifurcated waveguides (118) are disposed in the optical module, the bifurcated waveguides (118) coalesce light from the plurality of input optical ports (144) into a single high power output at the output optical port (120).
摘要:
A flexible circuit film (103) having a plurality of electrical tracings (118) is provided. A mold (102) having a cavity (112) capable of accepting the flexible circuit film (103) is provided. The flexible circuit film (103) is placed into the mold (102). A first optical portion (203) is molded with the flexible circuit film (103) in the cavity (112) of the mold (102) so as to join the flexible circuit film (103) to the first optical portion (203).
摘要:
A flexible circuit film (103) having a plurality of electrical tracings (118) is provided. A mold (102) having a cavity (112) capable of accepting the flexible circuit film (103) is provided. The flexible circuit film (103) is placed into the mold (102). A first optical portion (203) is molded with the flexible circuit film (103) in the cavity (112) of the mold (102) so as to join the flexible circuit film (103) to the first optical portion (203).
摘要:
An interconnect substrate with a surface having a plurality of electrical tracings is provided. A photonic device having a working portion and contact electrically coupled to one of the plurality of electrical tracings is disposed on the interconnect substrate. A molded optical portion is formed that encapsulates the photonic device, as well as forming a reflective surface that directs light between an external light communicating structure and the photonic device.