Abstract:
Techniques are disclosed for measurement devices and methods to obtain various physical and/or electrical parameters in an integrated manner. For example, a measurement device may include a housing, an optical emitter, a sensor, a distance measurement circuit, a length measurement circuit, an electrical meter circuit, a display, an infrared imaging module, and/or a non-thermal imaging module. The device may be conveniently carried and utilized by users to perform a series of distance measurements, wire length measurements, electrical parameter measurements, and/or fault inspections, in an integrated manner without using multiple different devices. In one example, electricians may utilize the device to perform installation of electrical wires and/or other tasks at various locations (e.g., electrical work sites). In another example, electricians may utilize the device to view a thermal image of one or more scenes at such locations for locating potential electrical faults.
Abstract:
Techniques are disclosed for systems and methods using small form factor infrared imaging devices to image scenes in proximity to a vehicle. An imaging system may include one or more infrared imaging devices, a processor, a memory, a display, a communication module, and modules to interface with a user, sensors, and/or a vehicle. Infrared imaging devices may be positioned in proximity to, mounted on, installed in, or otherwise fixed relative to a vehicle. Infrared imaging devices may be configured to capture infrared images of scenes in proximity to a vehicle. Various infrared image analytics and processing may be performed on captured infrared images to correct and/or calibrate the infrared images. Monitoring information, notifications, and/or control signals may be generated based on the corrected infrared images and then presented to a user and/or a monitoring and notification system, and/or used to control aspects of the vehicle.
Abstract:
Various techniques are provided for binning (e.g., clustering or grouping) two or more infrared sensors of a focal plane array (FPA) to permit configuration of the FPA to various dimensions and/or pixel sizes. For example, according to one or more embodiments, switchable interconnects may be implemented within the FPA, wherein the switchable interconnects comprise a plurality of switches adapted to selectively connect or disconnect infrared sensors of the FPA to/from column lines, row lines, and between each other. The switchable interconnects may also comprise another set of switches adapted to selectively connect adjacent column lines together. By selectively opening and closing appropriate switches of the switchable interconnects, two or more neighboring infrared sensors may be binned together to form a binned detector. Advantageously, the binned detector, along with the array and associated circuitry, may provide increased sensitivity, reduced power consumption, and/or increased frame rate.
Abstract:
In one embodiment, an infrared (IR) sensor module includes an IR sensor assembly, including a substrate, a microbolometer array disposed on an upper surface of the substrate; and a cap disposed on the upper surface of the substrate and hermetically enclosing the microbolometer array. A base is disposed below the substrate, and a heat spreader having a generally planar portion is interposed between a lower surface of the substrate and an upper surface of the base. In some embodiments, the heat spreader can include a material having an anisotropic thermal conductivity, e.g., graphite.
Abstract:
Various techniques are provided to identify anomalous pixels in images captured by imaging devices. In one example, an infrared image frame is received. The infrared image frame is captured by a plurality of infrared sensors based on infrared radiation passed through an optical element. A pixel of the infrared image frame is selected. A plurality of neighborhood pixels of the infrared image frame are selected. Values of the selected pixel and the neighborhood pixels are processed to determine whether the value of the selected pixel exhibits a disparity in relation to the neighborhood pixels that exceeds a maximum disparity associated with a configuration of the optical element and the infrared sensors. The selected pixel is selectively designated as an anomalous pixel based on the processing.
Abstract:
Techniques using small form factor infrared imaging modules are disclosed. An imaging system may include visible spectrum imaging modules, infrared imaging modules, and other modules to interface with a user and/or a monitoring system. Visible spectrum imaging modules and infrared imaging modules may be positioned in proximity to a scene that will be monitored while visible spectrum-only images of the scene are either not available or less desirable than infrared images of the scene. Imaging modules may be configured to capture images of the scene at different times. Image analytics and processing may be used to generate combined images with infrared imaging features and increased detail and contrast. Triple fusion processing, including selectable aspects of non-uniformity correction processing, true color processing, and high contrast processing, may be performed on the captured images. Control signals based on the combined images may be presented to a user and/or a monitoring system.
Abstract:
Techniques are disclosed for systems and methods using small form factor infrared imaging modules to monitor aspects of a power system. A system may include one or more infrared imaging modules, a processor, a memory, a display, a communication module, and modules to control components of a power system. Infrared imaging modules may be mounted on, installed in, or otherwise integrated with a power system having one or more power system components. The infrared imaging modules may be configured to capture thermal images of portions of the power system. Various thermal image analytics and profiling may be performed on the captured thermal images to determine the operating conditions and temperatures of portions of the power system. Monitoring information may be generated based on the determined conditions and temperatures and then presented to a user of the power system.
Abstract:
Various techniques are provided for implementing an infrared imaging system. In one example, a system includes a focal plane array (FPA). The FPA includes an array of infrared sensors adapted to image a scene. The FPA also includes a bias circuit adapted to provide a bias voltage to the infrared sensors. The bias voltage is selected from a range of approximately 0.2 volts to approximately 0.7 volts. The FPA also includes a read out integrated circuit (ROIC) adapted to provide signals from the infrared sensors corresponding to captured image frames. Other implementations are also provided.
Abstract:
Techniques are disclosed for measurement devices and methods to obtain various physical and/or electrical parameters in an integrated manner. For example, a measurement device may include a housing, an optical emitter, a sensor, a distance measurement circuit, a length measurement circuit, an electrical meter circuit, a display, an infrared imaging module, and/or a non-thermal imaging module. The device may be conveniently carried and utilized by users to perform a series of distance measurements, wire length measurements, electrical parameter measurements, and/or fault inspections, in an integrated manner without using multiple different devices. In one example, electricians may utilize the device to perform installation of electrical wires and/or other tasks at various locations (e.g., electrical work sites). In another example, electricians may utilize the device to view a thermal image of one or more scenes at such locations for locating potential electrical faults.
Abstract:
Techniques are provided to implement line based processing of thermal images and a flexible memory system. In one example, individual lines of a thermal image frame may be provided to an image processing pipeline. Image processing operations may be performed on the individual lines in stages of the image processing pipeline. A memory system may be used to buffer the individual lines in the pipeline stages. In another example, a memory system may be used to send and receive data between various components without relying on a single shared bus. Data transfers may be performed between different components and different memories of the memory system using a switch fabric to route data over different buses. In another example, a memory system may support data transfers using different clocks of various components, without requiring the components and the memory system to all be synchronized to the same clock source.