公开(公告)号：US20170358619A1

公开(公告)日：2017-12-14

申请号：US15671223

申请日：2017-08-08

Applicant: GLOBALFOUNDRIES INC.

Inventor： John J. Ellis-Monaghan ,  Qizhi Liu ,  Steven M. Shank

IPC: H01L27/146 ,  H01L31/0232 ,  H01L21/762

CPC classification number: H01L27/14632 ,  G02B6/4202 ,  H01L21/76224 ,  H01L21/76283 ,  H01L27/1462 ,  H01L27/1463 ,  H01L27/14685 ,  H01L27/14687 ,  H01L31/0232 ,  H01L31/02327 ,  H01L31/101

Abstract: Disclosed are structures and methods of forming the structures so as to have a photodetector isolated from a substrate by stacked trench isolation regions. In one structure, a first trench isolation region is in and at the top surface of a substrate and a second trench isolation region is in the substrate below the first. A photodetector is on the substrate aligned above the first and second trench isolation regions. In another structure, a semiconductor layer is on an insulator layer and laterally surrounded by a first trench isolation region. A second trench isolation region is in and at the top surface of a substrate below the insulator layer and first trench isolation region. A photodetector is on the semiconductor layer and extends laterally onto the first trench isolation region. The stacked trench isolation regions provide sufficient isolation below the photodetector to allow for direct coupling with an off-chip optical fiber.

公开(公告)号：US09715064B1

公开(公告)日：2017-07-25

申请号：US15263817

申请日：2016-09-13

Applicant: GLOBALFOUNDRIES INC.

Inventor： Jeffrey P. Gambino ,  Robert K. Leidy ,  John J. Ellis-Monaghan ,  Brett T. Cucci ,  Jeffrey C. Maling ,  Jessie C. Rosenberg

IPC: G02B6/124 ,  G02B6/34 ,  G02B6/12

CPC classification number: G02B6/124 ,  G02B6/34 ,  G02B2006/12107

Abstract: Disclosed are multi-chip modules (MCMs) that allow for chip-to-chip transmission of light signals. The MCMs can incorporate at least two components, which are attached (e.g., by interconnects). For example, in one MCM disclosed herein, the two components can be an integrated circuit chip and an interposer to which the integrated circuit chip and one or more additional integrated circuit chips are attached by interconnects. In another MCM disclosed herein, the two components can be two integrated circuit chips that are stacked and attached to each other by interconnects. In either case, the two components can each have a waveguide and a grating coupler coupled to one end of the waveguide. The grating couplers on the different components can be approximately vertically aligned, thereby allowing light signals to be transmitted between the waveguides on those different components. Also, disclosed herein are methods of forming such MCMs.