公开(公告)号：US09427596B2

公开(公告)日：2016-08-30

申请号：US14826229

申请日：2015-08-14

Applicant: Greatbatch Ltd.

Inventor： Jason Woods ,  Richard L. Brendel ,  Robert A. Stevenson ,  Christopher Michael Williams ,  Robert Naugler ,  Christine A. Frysz

IPC: A61N1/00 ,  A61N1/375 ,  H02G15/013 ,  H01G4/35 ,  H01G4/40 ,  H01G2/02 ,  H01G4/228 ,  H01R13/7195 ,  H03H1/00

CPC classification number: A61N1/3754 ,  H01G2/02 ,  H01G4/228 ,  H01G4/35 ,  H01G4/40 ,  H01R13/7195 ,  H02G15/013 ,  H03H1/00 ,  H03H2001/0042 ,  H03H2001/0085

Abstract: A hermetically sealed filtered feedthrough assembly for an AIMD includes an electrically conductive ferrule with an electrically conductive extension at least partially extending into the ferrule opening. An electrically non-conductive insulator hermetically seals the ferrule opening. An electrically conductive pathway is hermetically sealed and disposed through the insulator between a body fluid and device side. A filter capacitor is located on the device side. A first low impedance electrical coupling is between a first metallization of the filter capacitor and the pathway. A ground conductor is disposed through the filter capacitor in non-conductive relation with the at least one active and ground electrode plates, where the ground conductor is electrically coupled to the extension of the ferrule. An oxide-resistant metal addition is disposed on the device side and electrically couples the ground conductor to the second metallization of the filter capacitor.

Abstract translation: 用于AIMD的气密密封的过滤馈通组件包括具有至少部分延伸到套圈开口中的导电延伸部的导电套圈。 非导电绝缘体气密地密封套圈开口。 导电通路密封并通过绝缘体设置在体液和器件侧之间。 滤波电容器位于器件侧。 第一低阻抗电耦合在滤波电容器的第一金属化和通路之间。 接地导体与所述至少一个有源和接地电极板以非导电关系设置穿过所述滤波电容器，其中所述接地导体电耦合到所述套圈的延伸部。 在器件侧设置耐氧化金属添加剂，并将接地导体电耦合到滤波电容器的第二金属化。

公开(公告)号：US20160008595A1

公开(公告)日：2016-01-14

申请号：US14864959

申请日：2015-09-25

Applicant: Greatbatch Ltd.

Inventor： Robert A. Stevenson ,  Thomas Marzano ,  Keith W. Seitz ,  Steven W. Winn ,  Christine A. Frysz ,  Richard L. Brendel ,  Jason Woods ,  Dominick J. Frustaci ,  Xiaohong Tang ,  William C. Thiebolt

IPC: A61N1/08 ,  H02G3/22 ,  H01G4/40 ,  H01G4/005 ,  H01G4/12 ,  H01G4/35

CPC classification number: A61N1/3754 ,  A61N1/05 ,  A61N1/08 ,  A61N1/372 ,  A61N1/375 ,  B23K35/3013 ,  C22C29/12 ,  H01G2/103 ,  H01G4/005 ,  H01G4/12 ,  H01G4/30 ,  H01G4/35 ,  H01G4/40 ,  H01R43/00 ,  H02G3/22 ,  Y10T156/1052

Abstract: A co-connected hermetic feedthrough, feedthrough capacitor, and leadwire assembly includes a dielectric substrate with a via hole disposed through the dielectric substrate from a body fluid side to a device side. A conductive fill is disposed within the via forming a hermetic seal and is electrically conductive between the body fluid side and the device side. A feedthrough capacitor is attached to the dielectric substrate and includes a capacitor dielectric substrate, an unfilled capacitor via hole including an inner metallization, a set of capacitor active electrode plates electrically coupled to the inner metallization, an outer metallization disposed and a set of capacitor ground electrode plates electrically coupled to the outer metallization. A conductive leadwire is disposed within the unfilled capacitor via hole. An electrical joint connects the conductive fill, the capacitor inner metallization along with the capacitor active electrode plates and the conductive leadwire.

Abstract translation: 一个共同连接的密封馈通电源，馈通电容器和引线组件包括具有通孔的电介质基片，其通过介电基片从体液侧设置到器件侧。 导电填料设置在通孔内形成气密密封，并且在体液侧和装置侧之间导电。 馈通电容器附接到电介质基板，并且包括电容器电介质基板，包括内部金属化的未填充的电容器通孔，电耦合到内部金属化的一组电容器有源电极板，设置的外部金属化和一组电容器接地 电极板电耦合到外部金属化。 导电引线设置在未填充的电容器通孔内。 电接头将导电填充物，电容器内部金属化以及电容器有源电极板和导电引线连接。

公开(公告)号：US09014808B2

公开(公告)日：2015-04-21

申请号：US14187297

申请日：2014-02-23

Applicant: Greatbatch Ltd.

Inventor： Robert A. Stevenson ,  Christine A. Frysz ,  Jason Woods ,  Richard L. Brendel ,  Robert S. Johnson ,  Dominick J. Frustaci ,  Warren S. Dabney ,  Keith W. Seitz ,  Thomas Marzano ,  John E. Roberts ,  William C. Thiebolt ,  Christopher M. Williams ,  Buehl E. Truex

IPC: H01G4/35 ,  A61N1/08 ,  A61N1/37 ,  A61N1/375 ,  H03H1/00 ,  A61N1/05

CPC classification number: A61N1/08 ,  A61N1/05 ,  A61N1/3718 ,  A61N1/3754 ,  H01G4/35 ,  H03H1/0007

Abstract: An RF filter for an active medical device (AMD), for handling RF power induced in an associated lead from an external RF field at a selected MRI frequency or range frequencies includes a capacitor having a capacitance of between 100 and 10,000 picofarads, and a temperature stable dielectric having a dielectric constant of 200 or less and a temperature coefficient of capacitance (TCC) within the range of plus 400 to minus 7112 parts per million per degree centigrade. The capacitor's dielectric loss tangent in ohms is less than five percent of the capacitor's equivalent series resistance (ESR) at the selected MRI RF frequency or range of frequencies.

Abstract translation: 用于在选定的MRI频率或范围频率处理来自外部RF场的相关引线中感应的RF功率的用于主动医疗装置（AMD）的RF滤波器包括具有100至10,000皮​​法之间的电容的电容器，以及温度 介电常数为200以下，电容温度系数（TCC）在400〜71212ppm /摄氏度范围内的稳定电介质。 电容器的介电损耗角正切欧姆小于所选MRI射频频率或频率范围内电容器等效串联电阻（ESR）的百分之五。

公开(公告)号：US08938309B2

公开(公告)日：2015-01-20

申请号：US13742781

申请日：2013-01-16

Applicant: Greatbatch Ltd.

Inventor： Thomas Marzano ,  Keith W. Seitz ,  Robert A. Stevenson ,  Xiaohong Tang ,  William C. Thiebolt ,  Christine A. Frysz ,  Richard L. Brendel ,  Jason Woods ,  Steven W. Winn ,  Dominick J. Frustaci ,  Buehl E. Truex ,  Donald Hickel, Jr.

IPC: A61N1/00 ,  H01R43/00 ,  A61N1/05 ,  A61N1/375 ,  H01G4/35 ,  H01G2/10 ,  A61N1/372 ,  C22C29/12

CPC classification number: A61N1/3754 ,  A61N1/05 ,  A61N1/08 ,  A61N1/372 ,  A61N1/375 ,  B23K35/3013 ,  C22C29/12 ,  H01G2/103 ,  H01G4/005 ,  H01G4/12 ,  H01G4/30 ,  H01G4/35 ,  H01G4/40 ,  H01R43/00 ,  H02G3/22 ,  Y10T156/1052

Abstract: An elevated feedthrough is attachable to a top or a side of an active implantable medical device. The feedthrough includes a conductive ferrule and a dielectric substrate. The dielectric substrate is defined as comprising a body fluid side and a device side disposed within the conductive ferrule. The dielectric substrate includes a body fluid side elevated portion generally raised above the conductive ferrule. At least one via hole is disposed through the dielectric substrate from the body fluid side to the device side. A conductive fill is disposed within the at least one via hole forming a hermetic seal and electrically conductive between the body fluid side and the device side. A leadwire connection feature is on the body fluid side electrically coupled to the conductive fill and disposed adjacent to the elevated portion of the dielectric substrate.

Abstract translation: 升高的馈通可附接到有源可植入医疗装置的顶部或侧面。 馈通包括导电套圈和电介质基片。 电介质基板被定义为包括体液侧和设置在导电套圈内的器件侧。 电介质基片包括通常在导电套圈上方升高的体液侧提升部分。 至少一个通孔穿过电介质基底从体液侧设置到器件侧。 导电填料设置在至少一个通孔内，形成气密密封并在体液侧和装置侧之间导电。 引线连接特征在体液侧电耦合到导电填充物并且邻近电介质基底的升高部分设置。

公开(公告)号：US20140330355A1

公开(公告)日：2014-11-06

申请号：US14316896

申请日：2014-06-27

Applicant: Greatbatch Ltd.

Inventor： Robert A. Stevenson ,  Warren S. Dabney ,  Christine A. Frysz ,  Richard L. Brendel

IPC: A61N1/08 ,  A61N1/05

CPC classification number: A61N1/08 ,  A61N1/05 ,  A61N1/086 ,  H01F17/02 ,  H03H1/0007

Abstract: A multilayer helical wave filter having a primary resonance at a selected RF diagnostic or therapeutic frequency or frequency range, includes an elongated conductor forming at least a portion of an implantable medical lead. The elongated conductor includes a first helically wound segment having at least one planar surface, a first end and a second end, which forms a first inductive component, and a second helically wound segment having at least one planar surface, a first end and a second end, which forms a second inductive element. The first and second helically wound segments are wound in the same longitudinal direction and share a common longitudinal axis. Planar surfaces of the helically wound segments face one another, and a dielectric material is disposed between the facing planar surfaces of the helically wound segments and between adjacent coils of the helically wound segments, thereby forming a capacitance.

Abstract translation: 在选定的RF诊断或治疗频率或频率范围内具有初级共振的多层螺旋波滤波器包括形成可植入医疗引线的至少一部分的细长导体。 细长导体包括具有至少一个平坦表面的第一螺旋缠绕段，形成第一感应组件的第一端和第二端，以及具有至少一个平坦表面的第二螺旋缠绕段，第一端和第二端 端部，其形成第二电感元件。 第一和第二螺旋缠绕段在相同的纵向缠绕并共享共同的纵向轴线。 螺旋缠绕段的平面表面彼此面对，并且电介质材料设置在螺旋缠绕段的相对的平坦表面之间和螺旋缠绕段的相邻线圈之间，从而形成电容。

公开(公告)号：US20140194964A1

公开(公告)日：2014-07-10

申请号：US14202653

申请日：2014-03-10

Applicant: GREATBATCH LTD.

Inventor： Jason Woods ,  Richard L. Brendel ,  Robert A. Stevenson ,  Christopher M. Williams ,  Robert Naugler ,  Christine A. Frysz

IPC: A61N1/08

CPC classification number: A61N1/3754 ,  H01G2/02 ,  H01G4/228 ,  H01G4/35 ,  H01G4/40 ,  H01R13/7195 ,  H03H1/0007 ,  H03H7/1766 ,  H03H2001/0042 ,  H03H2001/0085

Abstract: A hermetically sealed filtered feedthrough assembly for an AIMD includes an insulator hermetically sealed to a conductive ferrule or housing. A conductor is hermetically sealed and disposed through the insulator in non-conductive relation to the conductive ferrule or housing between a body fluid side and a device side. A feedthrough capacitor is disposed on the device side. A first low impedance electrical connection is between a first end metallization of the capacitor and the conductor. A second low impedance electrical connection is between a second end metallization of the capacitor and the ferrule or housing. The second low impedance electrical connection includes an oxide-resistant metal addition attached directly to the ferrule or housing and an electrical connection coupling the second end metallization electrically and physically directly to the oxide-resistant metal addition.

Abstract translation: 用于AIMD的气密密封的过滤馈通组件包括密封到导电套圈或壳体的绝缘体。 导体被气密地密封并且通过绝缘体以非导电关系设置在导体套管或壳体之间，在体液侧和器件侧之间。 馈通电容器设置在器件侧。 第一低阻抗电连接在电容器的第一端金属化和导体之间。 第二低阻抗电连接在电容器的第二端金属化和套圈或壳体之间。 第二低阻抗电连接包括直接连接到套圈或壳体的耐氧化金属添加剂和将第二端金属化物电和物理直接耦合到耐氧化金属添加物的电连接。

公开(公告)号：US20130184796A1

公开(公告)日：2013-07-18

申请号：US13742781

申请日：2013-01-16

Applicant: Greatbatch Ltd.

Inventor： Thomas Marzano ,  Keith W. Seitz ,  Robert A. Stevenson ,  Xiaohong Tang ,  William C. Thiebolt ,  Christine A. Frysz ,  Richard L. Brendel ,  Jason Woods ,  Steven W. Winn ,  Dominick J. Frustaci ,  Buehl E. Truex ,  Donald Hickel, Jr.

IPC: A61N1/05

CPC classification number: A61N1/3754 ,  A61N1/05 ,  A61N1/08 ,  A61N1/372 ,  A61N1/375 ,  B23K35/3013 ,  C22C29/12 ,  H01G2/103 ,  H01G4/005 ,  H01G4/12 ,  H01G4/30 ,  H01G4/35 ,  H01G4/40 ,  H01R43/00 ,  H02G3/22 ,  Y10T156/1052

Abstract: An elevated feedthrough is attachable to a top or a side of an active implantable medical device. The feedthrough includes a conductive ferrule and a dielectric substrate. The dielectric substrate is defined as comprising a body fluid side and a device side disposed within the conductive ferrule. The dielectric substrate includes a body fluid side elevated portion generally raised above the conductive ferrule. At least one via hole is disposed through the dielectric substrate from the body fluid side to the device side. A conductive fill is disposed within the at least one via hole forming a hermetic seal and electrically conductive between the body fluid side and the device side. A leadwire connection feature is on the body fluid side electrically coupled to the conductive fill and disposed adjacent to the elevated portion of the dielectric substrate.

Abstract translation: 升高的馈通可附接到有源可植入医疗装置的顶部或侧面。 馈通包括导电套圈和电介质基片。 电介质基板被定义为包括体液侧和设置在导电套圈内的器件侧。 电介质基片包括通常在导电套圈上方升高的体液侧提升部分。 至少一个通孔穿过电介质基底从体液侧设置到器件侧。 导电填料设置在至少一个通孔内，形成气密密封并在体液侧和装置侧之间导电。 引线连接特征在体液侧电耦合到导电填充物并且邻近电介质基底的升高部分设置。

公开(公告)号：US10559409B2

公开(公告)日：2020-02-11

申请号：US16362862

申请日：2019-03-25

Applicant: Greatbatch Ltd.

Inventor： Keith W. Seitz ,  Dallas J. Rensel ,  Brian P. Hohl ,  Jonathan Calamel ,  Xiaohong Tang ,  Robert A. Stevenson ,  Christine A. Frysz ,  Thomas Marzano ,  Jason Woods ,  Richard L. Brendel

IPC: A61N1/375 ,  B23K1/19 ,  C04B41/51 ,  H01B17/30 ,  C04B41/45 ,  C04B41/88 ,  H01B19/02 ,  B23K1/00 ,  C04B41/00 ,  B23K1/008 ,  B23K26/32 ,  B23K26/21 ,  B22F7/04 ,  B23K101/36 ,  B23K103/14 ,  B22F7/08

Abstract: A method for manufacturing a feedthrough dielectric body for an active implantable medical device includes the steps of first forming a ceramic reinforced metal composite (CRMC) paste by mixing platinum with a ceramic material to form a CRMC material, subjecting the CRMC material to a first sintering step to thereby form a sintered CRMC material, ball-milling or grinding the sintered CRMC material to form a powdered CRMC material; and then mixing the powdered CRMC material with a solvent to form the CRMC paste. The method further includes forming an alumina ceramic body in a green state, forming at least one via hole through the alumina ceramic body, filling the via hole with the CRMC paste, drying the ceramic body including the CRMC paste to form a first CRMC material filling the via hole, forming a second via hole through the first CRMC material, providing a metal core in the second via hole, and subjecting the ceramic body including the first CRMC material and the metal core to a second sintering step to thereby form the dielectric body. The dielectric body is then sealed in a ferrule opening to form a feedthrough.

公开(公告)号：US20190321628A1

公开(公告)日：2019-10-24

申请号：US16452785

申请日：2019-06-26

Applicant: Greatbatch Ltd.

Inventor： Robert A. Stevenson ,  Christine A. Frysz ,  Richard L. Brendel

IPC: A61N1/08 ,  H05K1/18 ,  H01G4/35 ,  H05K9/00 ,  H03H1/00 ,  H01R13/7195 ,  H03H7/01 ,  H05K5/00 ,  H01G4/06 ,  A61N1/375 ,  A61N1/37 ,  H01G4/40

Abstract: An EMI/energy dissipating filter for an active implantable medical device (AIMD) is described. The filter comprises a first gold braze hermetically sealing the insulator to a ferrule that is configured to be mounted in an opening in a housing for the AIMD. A lead wire is hermetically sealed in a passageway through the insulator by a second gold braze. A circuit board substrate is disposed adjacent the insulator. A two-terminal chip capacitor disposed adjacent to the circuit board has an active metallization that is electrically connected to the active electrode plates and a ground metallization that is electrically connected to the ground electrode plates of the capacitor. A ground electrical path extends from the ground metallization of the chip capacitor to the ferrule. A conductive ground pin is electrically and mechanically connected to the ferrule. The ground path comprises an internal ground plate disposed within the circuit board substrate. The internal ground plate is electrically connected to the ground metallization of the chip capacitor and to either the ferrule or the ground pin connected to the ferrule. An active electrical path extends between the active metallization of the chip capacitor and the lead wire.

公开(公告)号：US10124164B2

公开(公告)日：2018-11-13

申请号：US15651045

申请日：2017-07-17

Applicant: Greatbatch Ltd.

Inventor： Robert A. Stevenson ,  Christine A. Frysz ,  Richard L. Brendel

IPC: A61N1/375 ,  H01G4/40 ,  A61N1/08 ,  A61N1/37 ,  H01G4/35 ,  H01R13/7195 ,  H03H1/00 ,  H05K9/00 ,  H03H7/01 ,  H05K5/00 ,  H05K1/18 ,  H01G4/06

Abstract: An EMI/energy dissipating filter for an active implantable medical device (AIMD) is described. The filter comprises a first gold braze hermetically sealing the insulator to a ferrule that is configured to be mounted in an opening in a housing for the AIMD. A lead wire is hermetically sealed in a passageway through the insulator by a second gold braze. A circuit board substrate is disposed adjacent the insulator. A two-terminal chip capacitor disposed adjacent to the circuit board has an active end metallization that is electrically connected to the active electrode plates and a ground end metallization that is electrically connected to the at least one ground electrode plates of the capacitor. A ground path electrically extends between the ground end metallization of the chip capacitor and the ferrule. The ground path comprises a conductive pin electrically and mechanically connected to the ferrule by a third gold braze. The ground path comprises an internal ground plate disposed within the circuit board substrate, and the internal ground plate is electrically connected to both the conductive pin and the ground end metallization of the chip capacitor. An active path electrically extends between the active end metallization of the chip capacitor and the lead wire.