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公开(公告)号:US11691339B2
公开(公告)日:2023-07-04
申请号:US16463542
申请日:2017-02-15
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: Wei Huang , Steven J. Simske , Ingeborg Tastl , Melanie M. Gottwals , Gary J. Dispoto
IPC: B29C64/00 , B29C64/171 , B33Y10/00 , B33Y30/00 , B33Y40/00 , B33Y40/20 , B22F12/00 , B29C64/245 , B29C64/255 , B33Y80/00 , B33Y40/10 , B29C64/182 , B29C64/30 , B33Y70/00 , B29C64/20 , B29C64/307 , B29C64/25 , B22F10/85 , B33Y50/02 , B22F10/00 , B01D67/00 , B29C64/205 , B29C64/176 , B29C64/10 , B29C64/40 , B33Y99/00 , B29C64/227 , B29C64/393 , B33Y50/00 , B22F12/82 , B29C64/386
CPC classification number: B29C64/171 , B01D67/00045 , B01D67/00415 , B22F10/00 , B22F10/85 , B22F12/00 , B22F12/82 , B29C64/00 , B29C64/10 , B29C64/176 , B29C64/182 , B29C64/20 , B29C64/205 , B29C64/227 , B29C64/245 , B29C64/25 , B29C64/255 , B29C64/30 , B29C64/307 , B29C64/386 , B29C64/393 , B29C64/40 , B33Y10/00 , B33Y30/00 , B33Y40/00 , B33Y40/10 , B33Y40/20 , B33Y50/00 , B33Y50/02 , B33Y70/00 , B33Y80/00 , B33Y99/00 , G03G2215/2054 , G05B2219/49023 , G05B2219/49246 , Y10T156/1722 , Y10T156/1798
Abstract: An example system includes an object and a support frame supporting the object. The support frame constrains movement of the object relative to the support frame, and the support frame includes at least one of a cage or a shackle to non-rigidly constrain movement of at least a part of the object.
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公开(公告)号:US20230146931A1
公开(公告)日:2023-05-11
申请号:US17912078
申请日:2020-04-13
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: Wei Huang , Gary J. Dispoto
IPC: B29C64/393 , B29C64/165
CPC classification number: B29C64/393 , B29C64/165 , B33Y10/00
Abstract: A device comprises a control portion to additively manufacturing a 3D object to include a first interior portion having a first thermal history different from a second thermal history of at least second interior portions surrounding the selectable first interior portion to induce an authentication surface feature at a first exterior surface portion overlying the first interior portion.
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公开(公告)号:US20230020856A1
公开(公告)日:2023-01-19
申请号:US17783423
申请日:2020-01-13
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: Wei Huang , Gary J. Dispoto
IPC: B29C64/393 , B29C64/171
Abstract: In one example in accordance with the present disclosure, a method is described. According to the method, a characteristic of each of multiple three-dimensional (3D) objects to be printed is determined. 3D objects to be printed are grouped based on characteristic similarity. For a group of 3D objects to be printed, an additive manufacturing setting is altered based on the characteristics of the 3D objects to be printed that form the group.
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公开(公告)号:US20220402204A1
公开(公告)日:2022-12-22
申请号:US17776695
申请日:2019-11-25
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: Wei Huang , Gary J Dispoto
IPC: B29C64/165 , B33Y10/00 , B33Y30/00 , B29C64/282 , B29C64/268
Abstract: In one example in accordance with the present disclosure, an additive manufacturing device is described. The additive manufacturing device includes a build material distributor to deposit layers of powdered build material onto a bed. At least one energy source selectively fuses portions of the layer of powdered build material to form a slice of a three-dimensional (3D) printed object. A detailing agent distributor of the additive manufacturing device generates a uniform property distribution across a portion of the layer of powdered build material by depositing a detailing agent.
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公开(公告)号:US20220388248A1
公开(公告)日:2022-12-08
申请号:US17774803
申请日:2019-12-10
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: Wei Huang , Gary J Dispoto
IPC: B29C64/393 , B33Y10/00 , B29C64/141 , B33Y50/02 , B22F5/00 , B22F10/20 , B22F10/85
Abstract: In one example in accordance with the present disclosure, a system is described. The system includes a fracture channel controller to determine fracture channels for a three-dimensional (3D) printed object. Portions of the 3D printed object along fracture channels are to be solidified to a lesser degree as compared to non-channel portions of the 3D printed object. The system also includes an additive manufacturing controller to control an additive manufacturing device. The additive manufacturing controller controls the additive manufacturing device to 1) solidify portions of a layer of powdered build material to form a slice of the 3D printed object and 2) selectively solidify fracture channels in the slice, wherein the fracture channels are solidified to a lesser degree as compared to non-channel portions.
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公开(公告)号:US11229605B2
公开(公告)日:2022-01-25
申请号:US16077321
申请日:2017-02-15
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: Wei Huang , Nathan Moroney , Steven J. Simske , Gary J. Dispoto
Abstract: An example device includes at least one three-dimensional (3D) printed tablet and a 3D-printed production support structure. Each 3D-printed tablet includes an excipient material and an active ingredient. The 3D-printed support structure includes a 3D-printed planar structure comprising the excipient material and at least one 3D-printed connecting member comprising the excipient material. The planar structure includes at least one aperture, each aperture corresponding to one of the at least one 3D-printed tablet. The connecting member detachably connects the at least one 3D-printed tablet with the 3D-printed planar structure and positions the at least one 3D-printed tablets within the apertures.
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公开(公告)号:US20210174594A1
公开(公告)日:2021-06-10
申请号:US17047364
申请日:2018-08-28
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: Wei Huang , Gary J Dispoto
IPC: G06T19/00 , B33Y30/00 , B33Y50/02 , B29C64/393 , B22F10/85
Abstract: An example system includes a three-dimensional (3D) printer to produce a 3D working product. The 3D working product includes cured material forming a printed portion of a 3D object and uncured material, and the printed portion of the 3D object is at least partly embedded in the uncured material. The example system further includes a controller to generate a virtualized image of at least a part of the 3D object and a display coupled to the controller, the display to display a virtualized environment, the virtualized environment including the virtualized image of the 3D object, the virtualized image of the 3D object corresponding to at least a part of the printed portion of the 3D object.
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公开(公告)号:US20210114290A1
公开(公告)日:2021-04-22
申请号:US16606275
申请日:2017-10-25
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: Wei Huang , Gary J. Dispoto
IPC: B29C64/165 , B29C64/40 , B29C64/393 , B29C64/268 , B29C64/218
Abstract: According to examples, a three-dimensional (3D) fabrication system may include a controller to identify a feature of an object to be fabricated and based on the identified feature having a size that is smaller than a predefined size, determine a thermal support for the identified feature. The controller may also control fabrication components to form, through application of energy, the determined thermal support from a first set of particles, form an intermediate section adjacent to the formed thermal support from a second set of particles, and form, through application of energy, the feature adjacent to the intermediate section from a third set of particles, in which heat from the thermal support is to reduce a thermal bleed rate of the third set of particles.
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公开(公告)号:US10967559B2
公开(公告)日:2021-04-06
申请号:US16462679
申请日:2017-02-14
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: Wei Huang , Lihua Zhao , Gary J. Dispoto
IPC: B29C64/10 , G01N27/04 , B33Y10/00 , B33Y30/00 , B33Y50/02 , B33Y80/00 , B29C64/393 , B29C70/70 , B29C70/88 , B29L31/34
Abstract: According to an example, a three-dimensional (3D) printed object may include a body formed of an electrically non-conductive material. In addition, an electrically conductive channel, a sensing device, and a signal emitter may be embedded within the body. The sensing device may be in electrical communication with the electrically conductive channel such that the sensing device is affected by a disruption in a current applied through the electrically conductive channel. In addition, the signal emitter may emit a wireless signal in response to the sensing device being affected by a disruption in the applied current.
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公开(公告)号:US20200147892A1
公开(公告)日:2020-05-14
申请号:US16473434
申请日:2017-04-27
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: Wei Huang , Ingeborg Tastl
IPC: B29C64/393 , B29C64/112 , B29C64/209 , B33Y10/00 , B33Y30/00 , B33Y50/02
Abstract: A device includes a material dispenser and a fluid dispenser. The material dispenser is to dispense a build material layer-by-layer, to at least partially additively form a first 3D object. The fluid dispenser is to dispense at least one fluid agent at selectable exterior voxel locations of the respective layers to at least partially define an external surface of the first 3D object as a first color to represent a first non-color material property of at least a first portion of the first 3D object. The selection of the first color is independent of characteristics of the first non-color material property.
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