摘要:
A method of wiring a head suspension assembly includes fixing a tube binding a plurality of wires on a suspension assembly, and fixing the wires extending from the fixed tube on the suspension while leading them to a top side of the suspension. The suspension has a tab frame with first and second frames. Each wire led to the top side of the suspension is bonded to the second frame of a tab frame. An insulation film is removed from each connecting portion of the wires to connect the wires to respective connecting pads of the slider. A first frame is bent substantially perpendicular to the suspension, and the second frame is bent substantially perpendicular to the first frame, thereby positioning the wires bonded to the second frame at the connecting pads on the slider. The wires are then ultrasonically welded to the respective connecting pads on the slider.
摘要:
A head gimbal assembly is provided with a slider that flies above the surface of a disk, and a head for reading/writing data from/onto the surface of the disk. One or more conductive wires are connected to the head and are used to transmit data. A load beam supports the wire(s) thereon and holds the head/slider near a front end of the load beam. Each wire forms a wire loop between the head connecting point edge and the wire fixing point. A predetermined portion of each wire loop is pressed from above on the surface of the load beam, and then pushed toward the head connecting point edge, thereby plastically deforming a section between the head connecting point edge and the predetermined portion of the wire loop.
摘要:
A head support arm of a disk drive device comprises; a front portion supporting a head/slider assembly, a rear portion pivotally mounted on a frame of the disk drive device, a bending portion between the front portion and the rear portion, a plurality of electrically conductive wires covered by a tube, and a first fixing position and a second fixing position symmetrically located on both sides of a center line of the head support arm at positions between the bending portion and the front portion, characterized in that the tube is attached to the head support arm between the bending portion and the rear portion, the plurality of electrically conductive wires extending from a front end of the tube on the side of the front portion of the head support arm extend over the bending portion and are divided into a first group and a second group, the first group of wires is fixed to the second fixing position.
摘要:
Embodiments of the invention provide a head gimbal assembly (HGA) provided with a solder ball connecting structure suitable for the re-utilization of a suspension assembly. In one embodiment, the HGA includes lead wires provided at front ends thereof with lead pads and also includes slider pads capable of being connected to the lead pads by solder ball bonding with the use of solder balls. Respective grooves formed in the surfaces of the slider pads inhibit the solder balls from rotating and moving over the surfaces of the slider pads and the lead pads before the radiation of a laser beam.
摘要:
Embodiments of the invention correct the static attitude of a head gimbal assembly (HGA) with high accuracy. In one embodiment, a vector group that constitutes the shortest path from the initial attitude of the HGA to the final anticipatory attitude is formed. The vector group is formed of the plural displacement vectors that give a variety of variations in static attitude when unit shots of laser light are performed on the HGA. Displacement vectors are synthesized while the displacement vectors each giving the anticipatory attitude closest to a target attitude are being selected in order from the initial attitude, toward the target attitude. Unit shots equivalent to the number of displacement vectors are performed on irradiating positions related to the displacement vectors included in the vector group. The static attitude existing after the unit shots is measured, then the displacement vectors are corrected, and a vector group constituting the new shortest path is formed. Highly accurate attitude correction is thus realized.
摘要:
A method for removing a lead-free solder from a slider pad is provided to permit re-utilization of a head/slider used in a magnetic disk drive. In one embodiment, a slider pad formed on a head/slider and a lead pad are connected to each other through a lead-free solder fillet. A cutting tool is heated beforehand to a temperature near the melting point of the lead-free solder. The cutting tool is moved in parallel with a surface of the slider pad to cut the solder fillet while softening the solder fillet. The solder fillet is removed so as not to impose a stress on the slider pad and in a state in which the head/slider can be re-utilized.
摘要:
A set of bonding pads are ultrasonically connected to a set of leads. The bonding pads are formed on a predetermined plane of a slider held by a slider holder accessible to the recording plane of a disk in a disk drive. The leads are held by the slider holder and have joints that are formed so as to respectively face each of the bonding pads. A front end plane of a wedge working on the joints is tilted in a direction in which the first sides of the joints correspond to external connection sides. The ultrasonic connection is completed by pressing the joints of the leads against the faced boding pads.