公开(公告)号：US06553647B1

公开(公告)日：2003-04-29

申请号：US09630861

申请日：2000-08-02

申请人： Kenji Itoh ,  Hiroyasu Tsuchida ,  Tatsushi Yoshida ,  Yoskio Uematsu ,  Tetsuji Ono

发明人： Kenji Itoh ,  Hiroyasu Tsuchida ,  Tatsushi Yoshida ,  Yoskio Uematsu ,  Tetsuji Ono

IPC分类号： G11B5127

CPC分类号： G11B5/486 ,  G11B5/4806 ,  Y10T29/49002 ,  Y10T29/49027 ,  Y10T29/4903 ,  Y10T29/49179 ,  Y10T29/49181 ,  Y10T29/49192

摘要： A method of wiring a head suspension assembly includes fixing a tube binding a plurality of wires on a suspension assembly, and fixing the wires extending from the fixed tube on the suspension while leading them to a top side of the suspension. The suspension has a tab frame with first and second frames. Each wire led to the top side of the suspension is bonded to the second frame of a tab frame. An insulation film is removed from each connecting portion of the wires to connect the wires to respective connecting pads of the slider. A first frame is bent substantially perpendicular to the suspension, and the second frame is bent substantially perpendicular to the first frame, thereby positioning the wires bonded to the second frame at the connecting pads on the slider. The wires are then ultrasonically welded to the respective connecting pads on the slider.

摘要翻译： 接线头悬挂组件的方法包括固定将多根电线装在悬挂组件上的管，以及将从固定管延伸的电线固定在悬架上，同时使它们到达悬架的顶侧。 悬架具有带有第一和第二框架的接片框架。 引导到悬架的顶侧的每根导线被接合到凸片框架的第二框架上。 从电线的每个连接部分去除绝缘膜，以将电线连接到滑块的相应连接焊盘。 第一框架基本上垂直于悬架弯曲，并且第二框架基本上垂直于第一框架弯曲，从而将绑定到第二框架的线定位在滑块上的连接垫上。 然后将电线超声波焊接到滑块上的各个连接焊盘。

公开(公告)号：US07583475B2

公开(公告)日：2009-09-01

申请号：US11066949

申请日：2005-02-25

申请人： Yuhsuke Matsumoto ,  Tatsumi Tsuchiya ,  Takaaki Murokawa ,  Yoshio Uematsu ,  Tatsushi Yoshida ,  Nobuyuki Hashi ,  Hiroyasu Tsuchida ,  Takuma Muraki

发明人： Yuhsuke Matsumoto ,  Tatsumi Tsuchiya ,  Takaaki Murokawa ,  Yoshio Uematsu ,  Tatsushi Yoshida ,  Nobuyuki Hashi ,  Hiroyasu Tsuchida ,  Takuma Muraki

IPC分类号： G11B5/48

CPC分类号： H05K3/3442 ,  G11B5/4853 ,  H05K1/111 ,  H05K2201/0397 ,  H05K2201/09663 ,  H05K2201/0969 ,  H05K2201/09745 ,  H05K2201/10727 ,  H05K2203/041 ,  Y02P70/611 ,  Y02P70/613

摘要： Embodiments of the invention provide techniques to prevent, when a bonding pad and a lead wiring pad are to be connected using a solder ball, the solder ball from deviating from a centerline and a soldering problem from occurring. In one embodiment, a head suspension assembly includes a solder ball disposed between a lead wiring pad provided for a flexure and a bonding pad provided for a slider. The solder ball is then melted for making a soldered joint between the lead wiring pad and the bonding pad. A through slot is provided at a position near a centerline on a front surface of the lead wiring pad. The solder ball is dropped into the through slot by gravity from the front surface of the lead wiring pad. A contact area in contact with the solder ball is thereby secured on a side of the slider.

摘要翻译： 本发明的实施例提供了当使用焊球连接接合焊盘和引线接线焊盘时防止焊料球偏离中心线并发生焊接问题的技术。 在一个实施例中，头悬挂组件包括设置在为弯曲提供的引线布线垫和为滑块设置的接合焊盘之间的焊球。 然后将焊球熔化以在引线接线焊盘和焊盘之间形成焊接接头。 在引线配线衬垫的前表面上的中心线附近的位置处设有通槽。 焊球通过重力从引线接线板的前表面落入通槽。 因此，与滑块接触的接触区域被固定在滑块的一侧。

公开(公告)号：US20050199680A1

公开(公告)日：2005-09-15

申请号：US11066949

申请日：2005-02-25

申请人： Yuhsuke Matsumoto ,  Tatsumi Tsuchiya ,  Takaaki Murokawa ,  Yoshio Uematsu ,  Tatsushi Yoshida ,  Nobuyuki Hashi ,  Hiroyasu Tsuchida ,  Takuma Muraki

发明人： Yuhsuke Matsumoto ,  Tatsumi Tsuchiya ,  Takaaki Murokawa ,  Yoshio Uematsu ,  Tatsushi Yoshida ,  Nobuyuki Hashi ,  Hiroyasu Tsuchida ,  Takuma Muraki

IPC分类号： G11B5/60 ,  B23K1/00 ,  G11B21/21 ,  H05K1/11 ,  H05K3/34

CPC分类号： H05K3/3442 ,  G11B5/4853 ,  H05K1/111 ,  H05K2201/0397 ,  H05K2201/09663 ,  H05K2201/0969 ,  H05K2201/09745 ,  H05K2201/10727 ,  H05K2203/041 ,  Y02P70/611 ,  Y02P70/613

摘要： Embodiments of the invention provide techniques to prevent, when a bonding pad and a lead wiring pad are to be connected using a solder ball, the solder ball from deviating from a centerline and a soldering problem from occurring. In one embodiment, a head suspension assembly includes a solder ball disposed between a lead wiring pad provided for a flexure and a bonding pad provided for a slider. The solder ball is then melted for making a soldered joint between the lead wiring pad and the bonding pad. A through slot is provided at a position near a centerline on a front surface of the lead wiring pad. The solder ball is dropped into the through slot by gravity from the front surface of the lead wiring pad. A contact area in contact with the solder ball is thereby secured on a side of the slider.

摘要翻译： 本发明的实施例提供了当使用焊球连接接合焊盘和引线接线焊盘时防止焊料球偏离中心线并发生焊接问题的技术。 在一个实施例中，头悬挂组件包括设置在为弯曲提供的引线布线垫和为滑块设置的接合焊盘之间的焊球。 然后将焊球熔化以在引线接线焊盘和焊盘之间形成焊接接头。 在引线配线衬垫的前表面上的中心线附近的位置处设有通槽。 焊球通过重力从引线接线板的前表面落入通槽。 因此，与滑块接触的接触区域被固定在滑块的一侧。

公开(公告)号：US06459549B1

公开(公告)日：2002-10-01

申请号：US09586830

申请日：2000-06-05

申请人： Tatsumi Tsuchiya ,  Tatsushi Yoshida ,  Hiroyasu Tsuchida ,  Hiroo Inoue ,  Surya Pattanaik ,  Hiromi Ishikawa ,  Masaaki Nanba

发明人： Tatsumi Tsuchiya ,  Tatsushi Yoshida ,  Hiroyasu Tsuchida ,  Hiroo Inoue ,  Surya Pattanaik ,  Hiromi Ishikawa ,  Masaaki Nanba

IPC分类号： G11B2116

CPC分类号： G11B5/4853 ,  G11B5/4826

摘要： Apertures are formed in the portion of a flexure adjacent to the soldered portions between the bonding pads of the slider and the lead pads of lead end portions. With this, an adhesive agent for bonding the slider to a flexure tongue is moved downward from the apertures so there is no fear that the adhesive agent will contact the lead pads and the bonding pads. This design prevents the protrusion of an adhesive agent from short-circuiting the flexure, and absorbs a warp produced by shrinkage of a soldered portion by decreasing rigidity of the flexure. When both the bonding pad formed on the slider and the lead pad of a lead fixed to the platform of the flexure are disposed and soldered, the quality of the soldered portion is improved by locating the pads as close to each other as possible.

摘要翻译： 在与滑块的接合焊盘和引线端部的引线焊盘之间的焊接部分相邻的挠曲部分中形成有孔。 由此，用于将滑块结合到挠曲舌的粘合剂从孔向下移动，因此不用担心粘合剂将接触引线焊盘和焊盘。 这种设计防止了粘合剂的突起使挠曲变短，并且通过降低挠曲的刚度来吸收由焊接部分的收缩产生的翘曲。 当形成在滑块上的接合焊盘和固定到弯曲部的平台的引线的引线焊盘都被布置和焊接时，通过将焊盘尽可能靠近地定位来改善焊接部分的质量。

公开(公告)号：US6052259A

公开(公告)日：2000-04-18

申请号：US98687

申请日：1998-06-17

申请人： Yasuhiro Mita ,  Tatsushi Yoshida ,  Hiromi Ishikawa ,  Tatsuya Tanaka ,  Hiroyasu Tsuchida ,  Takuya Satoh

发明人： Yasuhiro Mita ,  Tatsushi Yoshida ,  Hiromi Ishikawa ,  Tatsuya Tanaka ,  Hiroyasu Tsuchida ,  Takuya Satoh

IPC分类号： G11B5/60 ,  G11B5/48 ,  G11B21/21

CPC分类号： G11B5/4853

摘要： A head support arm of a disk drive device comprises; a front portion supporting a head/slider assembly, a rear portion pivotally mounted on a frame of the disk drive device, a bending portion between the front portion and the rear portion, a plurality of electrically conductive wires covered by a tube, and a first fixing position and a second fixing position symmetrically located on both sides of a center line of the head support arm at positions between the bending portion and the front portion, characterized in that the tube is attached to the head support arm between the bending portion and the rear portion, the plurality of electrically conductive wires extending from a front end of the tube on the side of the front portion of the head support arm extend over the bending portion and are divided into a first group and a second group, the first group of wires is fixed to the second fixing position.

摘要翻译： 盘驱动装置的头部支撑臂包括： 支撑头部/滑动器组件的前部，可枢转地安装在盘驱动装置的框架上的后部，前部和后部之间的弯曲部分，由管覆盖的多个导电线，以及第一 固定位置和第二固定位置对称地位于头部支撑臂的中心线的两侧之间的弯曲部分和前部之间的位置处，其特征在于，所述管在所述弯曲部分和所述前部之间的位置处附接到所述头部支撑臂， 在头部支撑臂的前部侧从管的前端延伸的多个导电线在弯曲部分上延伸并分成第一组和第二组，第一组 电线固定到第二固定位置。

公开(公告)号：US06676005B2

公开(公告)日：2004-01-13

申请号：US10196841

申请日：2002-07-17

申请人： Kenji Itoh ,  Naoki Kurosu ,  Yohtaroh Ichimura ,  Tatsushi Yoshida

发明人： Kenji Itoh ,  Naoki Kurosu ,  Yohtaroh Ichimura ,  Tatsushi Yoshida

IPC分类号： B23K106

CPC分类号： H01L24/85 ,  B23K20/004 ,  H01L24/45 ,  H01L24/78 ,  H01L2224/45015 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/45572 ,  H01L2224/456 ,  H01L2224/45644 ,  H01L2224/4569 ,  H01L2224/78301 ,  H01L2224/78313 ,  H01L2224/78344 ,  H01L2224/85205 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01079 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2224/48 ,  H01L2924/00 ,  H01L2924/2075

摘要： The present invention enhances the reliability of wire-bonding strength by reducing a variation in the entire transformation amount of a wire. At point P1, a bonding wedge 21 abuts the wire 71, whereby a load is exerted on the wire 71. The wire 71 transforms by an amount of transformation A, and the transformation stops at point P2. The transformation amount A varies greatly. At point P3 (T1), ultrasonic wave vibration is exerted and the transformation of the wire 71 is restarted. At this stage, a variation in the transformation amount A is absorbed by an amount of transformation B and therefore a variation in the transformation amount A+B becomes small. At point P4 (T1+T2), the transformation amount A+B is maintained substantially constant. At this point P4, the transformation amount of the wire 71 is set to 0 and the measurement of the transformation amount of the wire 71 is started. And until the transformation amount of the wire 71 reaches an amount of transformation C (point P5), a load and ultrasonic wave vibration are given.

摘要翻译： 本发明通过减少线的整个变换量的变化来提高引线接合强度的可靠性。 在点P1处，接合楔21抵接线71，由此在线71上施加负载。线71变换一定量的变换A，并且变形在点P2处停止。 变换量A变化很大。 在点P3（T1），施加超声波振动，重新开始线71的变形。 在这个阶段，变换量A的变化被变换量B吸收，因此变换量A + B的变化变小。 在点P4（T1 + T2），变换量A + B保持基本恒定。 在该点P4处，将线71的变形量设定为0，开始线71的变形量的测定。 并且直到线71的变形量达到变形量C（点P5）为止，给出负载和超声波振动。

公开(公告)号：US06628380B1

公开(公告)日：2003-09-30

申请号：US09897183

申请日：2001-07-02

申请人： Masashi Fujimori ,  Kenji Itoh ,  Toru Koike ,  Yuhsuke Matsumoto ,  Seiji Nakagawa ,  Tatsumi Tsuchiya ,  Tatsushi Yoshida

发明人： Masashi Fujimori ,  Kenji Itoh ,  Toru Koike ,  Yuhsuke Matsumoto ,  Seiji Nakagawa ,  Tatsumi Tsuchiya ,  Tatsushi Yoshida

IPC分类号： G01N2100

CPC分类号： G01N21/8806 ,  G11B5/4806

摘要： A jig for inspecting the appearance of small parts with an optical microscope, the jig is equipped with a base, having an upper flat surface which becomes a mounting stage of the optical microscope, and is also provided with a member for moving the upper flat surface at least in a direction approximately parallel to a direction of an optical axis of an objective lens of the optical microscope in order to focus the optical microscope on an inspection portion of the small parts mounted on the upper flat surface. The jig is also equipped with an inspection-object supporting portion, provided with a member for supporting the small parts at the predetermined portion on the base. Furthermore, the jig is equipped with reflecting mirrors which have a mirrorlike surface with an inclined angle of approximately 45 degrees to the upper flat surface of the base.

摘要翻译： 一种用光学显微镜检查小部件的外观的夹具，该夹具具有基部，具有成为光学显微镜的安装台的上部平坦面，并且还设置有用于使上部平坦面 至少在与光学显微镜的物镜的光轴的方向大致平行的方向上，以将光学显微镜聚焦在安装在上平坦表面上的小部件的检查部分上。 该夹具还配备有检查对象支撑部，该检查对象支撑部设置有用于在基部上的预定部分处支撑小部件的部件。 此外，夹具配备有反射镜，反射镜具有与基座的上平坦表面大约45度的倾斜角的镜面。

公开(公告)号：US06355122B1

公开(公告)日：2002-03-12

申请号：US09603121

申请日：2000-06-22

申请人： Kenji Itoh ,  Naoki Kurosu ,  Yohtaroh Ichimura ,  Tatsushi Yoshida

发明人： Kenji Itoh ,  Naoki Kurosu ,  Yohtaroh Ichimura ,  Tatsushi Yoshida

IPC分类号： B23K106

CPC分类号： G11B5/4853 ,  B23K20/002

摘要： A set of bonding pads are ultrasonically connected to a set of leads. The bonding pads are formed on a predetermined plane of a slider held by a slider holder accessible to the recording plane of a disk in a disk drive. The leads are held by the slider holder and have joints that are formed so as to respectively face each of the bonding pads. A front end plane of a wedge working on the joints is tilted in a direction in which the first sides of the joints correspond to external connection sides. The ultrasonic connection is completed by pressing the joints of the leads against the faced boding pads.

摘要翻译： 一组焊盘被超声波连接到一组引线。 接合焊盘形成在由磁盘驱动器中的盘的记录平面可访问的滑块架保持的滑块的预定平面上。 引线由滑块保持器保持并且具有形成为分别面对每个接合焊盘的接头。 在接头处工作的楔的前端面在接头的第一面对应于外部连接侧的方向上倾斜。 超声波连接通过将引线的接头压在面对的焊盘上而完成。

公开(公告)号：US06493189B1

公开(公告)日：2002-12-10

申请号：US09560325

申请日：2000-04-28

申请人： Kenji Itoh ,  Yasuhiro Mita ,  Masaaki Nanba ,  Tatsushi Yoshida

发明人： Kenji Itoh ,  Yasuhiro Mita ,  Masaaki Nanba ,  Tatsushi Yoshida

IPC分类号： G11B548

CPC分类号： G11B5/486 ,  Y10T29/4903

摘要： A head gimbal assembly is provided with a slider that flies above the surface of a disk, and a head for reading/writing data from/onto the surface of the disk. One or more conductive wires are connected to the head and are used to transmit data. A load beam supports the wire(s) thereon and holds the head/slider near a front end of the load beam. Each wire forms a wire loop between the head connecting point edge and the wire fixing point. A predetermined portion of each wire loop is pressed from above on the surface of the load beam, and then pushed toward the head connecting point edge, thereby plastically deforming a section between the head connecting point edge and the predetermined portion of the wire loop.

摘要翻译： 头部万向节组件设置有在盘的表面上方飞行的滑块，以及用于从/从盘的表面读取/写入数据的头部。 一个或多个导线连接到头部并用于传输数据。 负载梁支撑其上的线，并将头/滑块保持在负载梁的前端附近。 每个线在头连接点边缘和线固定点之间形成线环。 每个线环的预定部分从负载梁的表面上方按压，然后被推向头部连接点边缘，从而使头部连接点边缘和线环的预定部分之间的部分塑性变形。

公开(公告)号：US20110132879A1

公开(公告)日：2011-06-09

申请号：US12961989

申请日：2010-12-07

申请人： Yuhsuke Matsumoto ,  Eiki Oosawa ,  Tatsumi Tsuchiya ,  Hideto Imai ,  Tatsushi Yoshida

发明人： Yuhsuke Matsumoto ,  Eiki Oosawa ,  Tatsumi Tsuchiya ,  Hideto Imai ,  Tatsushi Yoshida

IPC分类号： B23K9/04

CPC分类号： B23K1/0016 ,  B23K1/0056 ,  B23K3/0623

摘要： A method for connecting electrical parts The method includes retaining a piece of metal within a nozzle, supplying inert gas to the nozzle, and irradiating the retained piece of metal with a light source while the supplied inert gas flows from apertures in the nozzle. The metal is melted by the light source. The method also includes ejecting the melted metal from the nozzle by the supplied inert gas onto electrical parts.

摘要翻译： 一种用于连接电气部件的方法该方法包括将一块金属保持在喷嘴内，向喷嘴供给惰性气体，并且在所供应的惰性气体从喷嘴中的孔流动的同时用光源照射保留的金属片。 金属被光源熔化。 该方法还包括通过所提供的惰性气体将熔融的金属从喷嘴喷射到电气部件上。