公开(公告)号：US20100200204A1

公开(公告)日：2010-08-12

申请号：US12669513

申请日：2008-07-28

申请人： Masaki Chiba ,  Shinji Watanabe ,  Minoru Yoshikawa

发明人： Masaki Chiba ,  Shinji Watanabe ,  Minoru Yoshikawa

IPC分类号： F28F1/00

CPC分类号： F25B43/00 ,  B01D19/0042 ,  B01D19/0063 ,  F28D15/00 ,  Y10T137/86236

摘要： In a cooling apparatus of an electronic equipment that cools down a heating element by circulating a refrigerant, air taken in once is prevented from taking in again into a water tank. A main water tank 1 includes two side surface parts 1a and 1b, and a cylindrical tubed part 1c. An inflow opening 2 is attached to a center of the side surface part 1a, and an outflow opening 3 is attached to a center of the side surface part 1b. A flexible pipe 6, which is made by a flexible material, is attached to the outflow opening 3 and a weight 7 is attached to an end of the flexible pipe 6.

摘要翻译： 在通过循环制冷剂来冷却加热元件的电子设备的冷却装置中，一次取出的空气被再次吸入水箱。 主水箱1包括两个侧面部分1a和1b以及圆筒形管部分1c。 流入口2安装在侧面部1a的中心，流出口3安装在侧面部1b的中心。 由柔性材料制成的柔性管6附接到流出开口3，并且重物7附接到柔性管6的一端。

公开(公告)号：US20090314473A1

公开(公告)日：2009-12-24

申请号：US12441811

申请日：2007-09-04

申请人： Minoru Yoshikawa

发明人： Minoru Yoshikawa

IPC分类号： F28D15/00 ,  G06F1/20 ,  B21D53/02

CPC分类号： H01L23/473 ,  H01L23/4006 ,  H01L2224/16 ,  H01L2224/73253 ,  Y10T29/4935

摘要： When the side of a surface of the board on which the device to be cooled is mounted is defined as the upper side while the side of the other surface is defined as the lower side in a substantially vertical direction to the board, a cooling device includes a heat receiving portion arranged on the upper side the device to be cooled for performing heat exchange with the device to be cooled; a columnar portion standing substantially perpendicularly on the board; a base having a through hole which the columnar portion passes through, and arranged on the upper side of the heat receiving portion; and biasing means for biasing the base along the columnar portion to thereby press the heat receiving portion against the device to be cooled.

摘要翻译： 当安装有要冷却的装置的板的表面的侧面被定义为上侧，而另一个表面的侧面被限定为与板基本垂直的方向的下侧时，冷却装置包括 在上侧设置有待冷却装置与被冷却装置进行热交换的热接收部; 基本上垂直于板上竖立的柱状部分; 具有柱状部通过的通孔的基部，配置在受热部的上侧; 以及偏压装置，用于沿着柱状部分偏置基座，从而将热接收部分压靠待冷却装置。

公开(公告)号：US6157897A

公开(公告)日：2000-12-05

申请号：US15910

申请日：1998-01-30

申请人： Minoru Yoshikawa

发明人： Minoru Yoshikawa

IPC分类号： G01K7/00 ,  G08B21/00 ,  H02H5/04 ,  H05K7/20 ,  G01K1/02

CPC分类号： H05K7/20209

摘要： A temperature IC is mounted to a card mounted within an electronic apparatus for monitoring airflow rate around the card to provide an alarm signal. The temperature IC includes a first IC including a temperature sensor and a second IC disposed downstream of the first IC. The second IC includes a temperature sensor and a resistor as a heating element. The second IC includes a first arithmetic unit that forms the difference in temperature out of two inputs of the temperature sensors, and a second arithmetic unit that determines thermal resistance of the second IC out of the difference in temperature and the quantity of heat released from the resistor. A memory stores date indicative of a relation between values of airflow rate and values of thermal resistance. A third arithmetic unit is provided to refer the stored data using the determined thermal resistance to find airflow rate.

摘要翻译： 温度IC安装在安装在电子设备内的卡上，用于监测卡周围的气流速率以提供报警信号。 温度IC包括包括温度传感器的第一IC和设置在第一IC下游的第二IC。 第二IC包括温度传感器和作为加热元件的电阻器。 第二IC包括形成温度传感器的两个输入端的温度差的第一算术单元，以及第二运算单元，其从温差和从该温度传感器释放的热量确定第二IC的热阻 电阻。 存储器存储指示气流值和热阻值之间的关系的日期。 提供第三算术单元以使用确定的热阻来指示存储的数据以找到气流速率。

公开(公告)号：US20120223049A1

公开(公告)日：2012-09-06

申请号：US13496609

申请日：2011-02-01

申请人： Minoru Yoshikawa ,  Tomohiro Yachida

发明人： Minoru Yoshikawa ,  Tomohiro Yachida

IPC分类号： C03C15/00

CPC分类号： B32B17/06 ,  B32B7/06 ,  B32B7/10 ,  B32B7/12 ,  B32B37/02 ,  B32B37/12 ,  B32B2309/105 ,  B32B2457/208 ,  C03C15/00 ,  C03C27/10 ,  G06F3/044 ,  G06F2203/04103 ,  Y10T428/1086 ,  Y10T428/266

摘要： There is provided a thin-sheet glass substrate laminate which is approximately 100% impermeable to gas or vapor and has a high transparency and a thin thickness, and a method of manufacturing the same. A support is temporarily attached to one surface of a glass substrate after forming a pattern P on the one surface, the glass substrate is thinned by etching another surface of the glass substrate, a film base is temporarily attached to the etched another surface, the temporarily attached support is peeled off from the one surface of the glass substrate, the one surface from which the support is peeled off is laminated to a surface of a cover glass, and the temporarily attached film base is peeled off from the another surface.

摘要翻译： 提供了对气体或蒸气大约100％不透气并且具有高透明度和薄的厚度的薄片玻璃基板层压体及其制造方法。 在一个表面上形成图案P之后，将支持体临时附着在玻璃基板的一个表面上，通过蚀刻玻璃基板的另一个表面使玻璃基板变薄，将薄膜基底临时附接到蚀刻的另一个表面上 从玻璃基板的一个表面剥离附着的支撑体，将支撑体剥离的一个面层压到盖玻璃的表面，并且将临时附着的膜基材从另一个表面剥离。

公开(公告)号：US20110007281A1

公开(公告)日：2011-01-13

申请号：US12919380

申请日：2009-03-25

申请人： Minoru Yoshikawa ,  Masaki Chiba ,  Katsuyuki Takeuchi

发明人： Minoru Yoshikawa ,  Masaki Chiba ,  Katsuyuki Takeuchi

IPC分类号： G03B21/16

CPC分类号： G03B21/16

摘要： A projector including a light source, an optical deflection element including a reflective surface, a mounting plate that holds the optical deflection element with a heat conductive member interposed between the optical deflection element and the mounting plate so that the reflective surface faces the light source, and a foreign matter intrusion preventing frame that is provided between the light source and the mounting plate so as to surround the reflective surface, the projector including: a heat receiving portion that is provided so as to surround at least one side of the optical deflection element; a heat radiating portion that is provided on the mounting plate outside the foreign matter intrusion preventing frame; and a heat pipe that includes the heat receiving portion and the heat radiating portion.

摘要翻译： 一种投影仪，包括光源，包括反射表面的光学偏转元件，安装板，其将光学偏转元件保持在介于光学偏转元件和安装板之间的导热构件，使得反射表面面向光源， 以及设置在所述光源和所述安装板之间以围绕所述反射表面的异物入侵防止框架，所述投影仪包括：受热部，其设置成围绕所述光学偏转元件的至少一侧 ; 散热部，其设置在异物防止框架外部的安装板上; 以及包括所述受热部和所述散热部的热管。

公开(公告)号：US06853071B2

公开(公告)日：2005-02-08

申请号：US10152729

申请日：2002-05-23

申请人： Minoru Yoshikawa

发明人： Minoru Yoshikawa

IPC分类号： H01L23/34 ,  H01L23/367

CPC分类号： H01L23/3675 ,  H01L23/345 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2224/0401

摘要： The electronic device includes a semiconductor device, a substrate on which the semiconductor device is mounted, a flange member for holding a peripheral portion of the substrate and a cooling member, in which the flange member for supporting the substrate of the semiconductor device being thermally in contact with the cooling member is arranged to come into contact with a heater through an adapter and between the heater and the cooling member, a heat insulating material is filled.

摘要翻译： 电子设备包括半导体器件，安装有半导体器件的衬底，用于保持衬底的周边部分的凸缘构件和冷却构件，其中用于将半导体器件的衬底热保护的凸缘构件 与冷却构件的接触被布置成通过适配器和加热器和冷却构件与加热器接触，填充绝热材料。

公开(公告)号：US6046498A

公开(公告)日：2000-04-04

申请号：US105251

申请日：1998-06-26

申请人： Minoru Yoshikawa

发明人： Minoru Yoshikawa

IPC分类号： H01L23/36 ,  H01L23/433 ,  H01L23/10 ,  H01L23/34

CPC分类号： H01L23/4338 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/01019

摘要： A cooling structure is provided for a multichip module on which integrated circuit devices (i.e., LSI devices) having heat-radiation surfaces are mounted, wherein there are provided a heat sink, thermal conduction blocks and thermal compounds. Recess portions are formed at a surface of the heat sink in connection with the integrated circuit devices of the multichip module. Low melting point metal material such as solder is supplied to interiors of the recess portions of the heat sink. The thermal conduction blocks are partially inserted into the interiors of the recess portions under the condition where the low melting point metal material is heated and melted, so that the thermal conduction blocks temporarily float in the melted material. To avoid heat transfer toward the integrated circuit devices, a heat insulating sheet is provided on the thermal conduction blocks. Then, the low melting point metal material is solidified, so the heat insulating sheet is removed. The thermal compounds are placed on the thermal conduction blocks. Thus, the integrated circuit devices and the thermal conduction blocks are connected together by means of the thermal compounds. Because of temporary floating of the thermal conduction blocks in the melted material, it is possible to absorb dispersion in heights and slopes of the heat-radiation surfaces of the integrated circuit devices.

摘要翻译： 提供了一种用于多芯片模块的冷却结构，其上安装有具有散热表面的集成电路器件（即，LSI器件），其中设置有散热器，导热块和热化合物。 结合多芯片模块的集成电路装置，在散热器的表面上形成凹部。 将诸如焊料的低熔点金属材料供应到散热器的凹部的内部。 在低熔点金属材料被加热和熔化的条件下，热传导块部分地插入到凹部的内部，使得导热块暂时浮在熔融材料中。 为了避免向集成电路器件的热传递，在导热块上设置隔热片。 然后，将低熔点金属材料固化，从而除去绝热片。 热化合物放置在导热块上。 因此，集成电路器件和导热块通过热化学物质连接在一起。 由于熔融材料中的热传导块的暂时浮动，可以吸收集成电路器件的散热面的高度和斜率的分散。

公开(公告)号：US5465192A

公开(公告)日：1995-11-07

申请号：US263377

申请日：1994-06-21

申请人： Minoru Yoshikawa

发明人： Minoru Yoshikawa

IPC分类号： H01L23/433 ,  H01L23/473 ,  H05K7/20

CPC分类号： H01L23/433 ,  H01L23/4735 ,  H01L2224/16

摘要： A cooling apparatus for integrated circuit chips in which the pressure of coolant does not affect the pressure exerted by the cooling apparatus on the chip. A block is provided with a plurality of holes, and cooling members are inserted in these holes. An elastic member is provided between the block and the cooling member, and the cooling member is supported in the block by the elastic member. Each of the cooling members are connected by pipes, and a bellows is provided in the pipe. When the block is loaded on the substrate on which the integrated circuit chips are mounted, the elastic member deforms and the cooling member is displaced in accordance with the height and inclination of the integrated circuit chip. The lower surface of the cooling member is brought into close contact with the integrated circuit chip due to the deformation of the elastic member. The bellows deforms in accordance with the displacement of the cooling member to ensure the normal connection of the pipe. When the coolant is supplied through a nozzle into the cooling member, the expanded bellows pushes the pipe up but does not push the cooling member down since the nozzle is fixedly secured in the cooling member.

摘要翻译： 一种用于集成电路芯片的冷却装置，其中冷却剂的压力不影响由冷却装置在芯片上施加的压力。 块设置有多个孔，并且冷却构件插入到这些孔中。 弹性构件设置在块体与冷却构件之间，并且冷却构件由弹性构件支撑在块体中。 每个冷却构件通过管连接，并且在管中设置有波纹管。 当块被装载在其上安装有集成电路芯片的基板上时，弹性构件变形，并且冷却构件根据集成电路芯片的高度和倾斜而移位。 由于弹性构件的变形，冷却构件的下表面与集成电路芯片紧密接触。 波纹管根据冷却构件的位移而变形，以确保管道的正常连接。 当冷却剂通过喷嘴供给到冷却构件中时，膨胀的波纹管将管道向上推动，但是不将冷却构件向下推动，因为喷嘴固定地固定在冷却构件中。