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公开(公告)号：US20110007281A1
公开(公告)日：2011-01-13
申请号：US12919380
申请日：2009-03-25
IPC分类号： G03B21/16
CPC分类号： G03B21/16
摘要： A projector including a light source, an optical deflection element including a reflective surface, a mounting plate that holds the optical deflection element with a heat conductive member interposed between the optical deflection element and the mounting plate so that the reflective surface faces the light source, and a foreign matter intrusion preventing frame that is provided between the light source and the mounting plate so as to surround the reflective surface, the projector including: a heat receiving portion that is provided so as to surround at least one side of the optical deflection element; a heat radiating portion that is provided on the mounting plate outside the foreign matter intrusion preventing frame; and a heat pipe that includes the heat receiving portion and the heat radiating portion.
摘要翻译： 一种投影仪，包括光源，包括反射表面的光学偏转元件，安装板，其将光学偏转元件保持在介于光学偏转元件和安装板之间的导热构件，使得反射表面面向光源， 以及设置在所述光源和所述安装板之间以围绕所述反射表面的异物入侵防止框架，所述投影仪包括：受热部，其设置成围绕所述光学偏转元件的至少一侧 ; 散热部，其设置在异物防止框架外部的安装板上; 以及包括所述受热部和所述散热部的热管。
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2.发明授权Cooling system for light emitting device and light emitting device using the same 有权用于发光装置的冷却系统和使用其的发光装置公开(公告)号：US08845134B2
公开(公告)日：2014-09-30
申请号：US13582856
申请日：2011-03-02
申请人： Masaki Chiba , Minoru Yoshikawa
发明人： Masaki Chiba , Minoru Yoshikawa
CPC分类号： H01L33/642 , F21V29/54 , F21V29/713 , F21V31/00 , H01L25/167 , H01L33/52 , H01L2924/0002 , H01L2924/00
摘要： An LED cooling system includes: hermetically sealed space 5 containing air and housing light emitting device 10 including light emitting body 1, the hermetically sealed space 5 including heat dissipation member 14 and cover film 11 having a double-layered structure; cooling element 4 contacting heat dissipation member 14 in hermetically sealed space 5, the cooling element 4 having a heat absorbing surface 4a absorbing heat from light emitting device 10 and heat dissipating surface 4b contacting heat dissipation member 14 to dissipate the heat absorbed by heat absorbing surface 4a through heat dissipation member 14; and metal plate 3 between light emitting device 10 and cooling element 4. Cover film 11 includes transparent resin film 12 outside hermetically sealed space 5, and metal film 13 located inside hermetically sealed space 5 and including opening 13a for exposing the light exit surface of light emitting body 1 through resin film 12.
摘要翻译： LED冷却系统包括：密封空间5，其包含空气和包括发光体1的壳体发光装置10，密封空间5包括散热构件14和具有双层结构的覆盖膜11; 冷却元件4在密封空间5中接触散热构件14，冷却元件4具有从发光装置10吸收热量的吸热表面4a和与散热构件14接触的散热表面4b，以消散由吸热表面吸收的热量 4a通过散热构件14; 以及发光元件10与冷却元件4之间的金属板3.覆盖膜11包括在密封空间5的外部的透明树脂膜12和位于密封空间5的内部的金属膜13，并且具有露出光出射面的开口13a 发射体1通过树脂膜12。
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公开(公告)号：US20140144169A1
公开(公告)日：2014-05-29
申请号：US14131230
申请日：2012-07-05
IPC分类号： H05K7/20
CPC分类号： H05K7/20309 , F28D15/0266 , G06F1/20 , G06F2200/201 , H05K7/20318 , H05K7/20727 , H05K7/20818
摘要： A cooling system comprising: an evaporator for evaporating a refrigerant by performing heat exchange with outside air; a condenser for condensing a gas refrigerant into a liquid refrigerant by making a refrigerant and a cooling medium perform heat exchange with each other; a gas refrigerant pipe and a liquid refrigerant pipe connecting the evaporator and the condenser; and the evaporator including: an upper part header provided in a highest position of the evaporator, and connected with the condenser by the gas refrigerant pipe, through the gas refrigerant pipe a gas refrigerant flowing; a lower part header provided in a lowest position of the evaporator, and connected with the condenser by the liquid refrigerant pipe, through the liquid refrigerant pipe a liquid refrigerant flowing; a middle header provided in an intermediate position between the upper part header and the lower part header, and connected with the condenser by the liquid refrigerant pipe, through the liquid refrigerant pipe the liquid refrigerant flowing; an upper part evaporator, arranged between the upper part header and the middle header, including an upper part steam generating tube having a first flow path for leading a refrigerant of the middle header to the upper part header while making the refrigerant of the middle header perform heat exchange with outside air and having a second flow path for leading a refrigerant of the lower part header to the upper part header while making the refrigerant of the lower part header perform heat exchange with outside air; and a lower part evaporator, arranged between the lower part header and the middle header, including a lower part steam generating tube having a third flow path inserted into the middle header while making a refrigerant of the lower part header perform heat exchange with outside air, the lower part steam generating tube communicated with the second flow path of the upper part steam generating tube.
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公开(公告)号：US09288931B2
公开(公告)日：2016-03-15
申请号：US14131230
申请日：2012-07-05
CPC分类号： H05K7/20309 , F28D15/0266 , G06F1/20 , G06F2200/201 , H05K7/20318 , H05K7/20727 , H05K7/20818
摘要： A cooling system comprising: an evaporator for evaporating a refrigerant by performing heat exchange with outside air; a condenser for condensing a gas refrigerant into a liquid refrigerant by making a refrigerant and a cooling medium perform heat exchange with each other; a gas refrigerant pipe and a liquid refrigerant pipe connecting the evaporator and the condenser; and the evaporator including: an upper part header provided in a highest position of the evaporator, and connected with the condenser by the gas refrigerant pipe, through the gas refrigerant pipe a gas refrigerant flowing; a lower part header provided in a lowest position of the evaporator, and connected with the condenser by the liquid refrigerant pipe, through the liquid refrigerant pipe a liquid refrigerant flowing; a middle header provided in an intermediate position between the upper part header and the lower part header, and connected with the condenser by the liquid refrigerant pipe, through the liquid refrigerant pipe the liquid refrigerant flowing; an upper part evaporator, arranged between the upper part header and the middle header, including an upper part steam generating tube having a first flow path for leading a refrigerant of the middle header to the upper part header while making the refrigerant of the middle header perform heat exchange with outside air and having a second flow path for leading a refrigerant of the lower part header to the upper part header while making the refrigerant of the lower part header perform heat exchange with outside air; and a lower part evaporator, arranged between the lower part header and the middle header, including a lower part steam generating tube having a third flow path inserted into the middle header while making a refrigerant of the lower part header perform heat exchange with outside air, the lower part steam generating tube communicated with the second flow path of the upper part steam generating tube.
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公开(公告)号：US08511342B2
公开(公告)日：2013-08-20
申请号：US12669513
申请日：2008-07-28
申请人： Masaki Chiba , Shinji Watanabe , Minoru Yoshikawa
发明人： Masaki Chiba , Shinji Watanabe , Minoru Yoshikawa
IPC分类号： F17D1/00
CPC分类号： F25B43/00 , B01D19/0042 , B01D19/0063 , F28D15/00 , Y10T137/86236
摘要： In a cooling apparatus of an electronic equipment that cools down a heating element by circulating a refrigerant, air taken in once is prevented from taking in again into a water tank. A main water tank 1 includes two side surface parts 1a and 1b, and a cylindrical tubed part 1c. An inflow opening 2 is attached to a center of the side surface part 1a, and an outflow opening 3 is attached to a center of the side surface part 1b. A flexible pipe 6, which is made by a flexible material, is attached to the outflow opening 3 and a weight 7 is attached to an end of the flexible pipe 6.
摘要翻译： 在通过循环制冷剂来冷却加热元件的电子设备的冷却装置中，一次取出的空气被再次吸入水箱。 主水箱1包括两个侧面部分1a和1b以及圆筒形管部分1c。 流入口2安装在侧面部1a的中心，流出口3安装在侧面部1b的中心。 由柔性材料制成的柔性管6附接到流出开口3，并且重物7附接到柔性管6的一端。
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公开(公告)号：US20130206368A1
公开(公告)日：2013-08-15
申请号：US13880252
申请日：2011-10-14
CPC分类号： F28D15/02 , B23P15/26 , F28D15/0266 , F28F13/187 , H01L23/427 , H01L2924/0002 , Y10T29/49359 , H01L2924/00
摘要： In a cooling device using an ebullient cooling system, the cooling performance adversely decreases if the evaporator includes projections activating the convection heat transfer and the bubble nuclei are formed on the inner wall surface, therefore, a cooling device according to an exemplary aspect of the invention includes an evaporator storing a refrigerant; a condenser condensing and liquefying a vapor-state refrigerant vaporized in the evaporator and radiating heat; and a connection connecting the evaporator and the condenser; wherein the evaporator includes a base thermally contacting with an object to be cooled, and a container; the base includes a plurality of projections on a boiling surface of a surface at an inner wall side contacting with the refrigerant; and a bubble nucleus forming surface is included only on a part of a refrigerant contacting surface including the boiling surface and the surface of the projections.
摘要翻译： 在使用沸腾冷却系统的冷却装置中，如果蒸发器包括启动对流热传递的凸起并且在内壁表面上形成气泡核，则冷却性能不利地降低，因此，根据本发明的示例性方面的冷却装置 包括存储制冷剂的蒸发器; 冷凝和液化在蒸发器中蒸发并蒸发热的蒸气状制冷剂的冷凝器; 以及连接蒸发器和冷凝器的连接件; 其中所述蒸发器包括与要冷却的物体热接触的基座和容器; 基部包括在与制冷剂接触的内壁侧的表面的沸腾面上的多个突起部; 并且气泡核形成表面仅包括在包括沸腾表面和突起的表面的制冷剂接触表面的一部分上。
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公开(公告)号：US20150034288A1
公开(公告)日：2015-02-05
申请号：US14349034
申请日：2012-09-26
IPC分类号： F28F3/12
CPC分类号： F28F3/12 , F28D15/0233 , F28D2015/0216 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： In a cooling device using an ebullient cooling system, a cooling device becomes larger when a degree of freedom of the arrangement in installing it in electronic equipment is increased, and that it is impossible to obtain a sufficient degree of freedom of the arrangement, therefore, a flat plate cooling device according to an exemplary aspect of the invention includes a plate-like container including a first flat plate and a second flat plate opposite to the first flat plate; a refrigerant enclosed in the plate-like container; and a guiding wall unit connecting the first flat plate to the second flat plate and controlling a flow of the refrigerant in the plate-like container; wherein the plate-like container includes a heat receiving area which is thermally connected to a heating element disposed on at least one of the first flat plate and the second flat plate; and the guiding wall unit includes a pair of guiding walls, and the guiding walls are disposed on opposite sides of the heat receiving area.
摘要翻译： 在使用沸腾冷却系统的冷却装置中，当安装在电子设备中的布置的自由度增加时，冷却装置变大，并且不可能获得足够的布置自由度， 根据本发明的示例性方面的平板冷却装置包括：板状容器，包括第一平板和与第一平板相对的第二平板; 封闭在板状容器中的制冷剂; 以及引导壁单元，其将所述第一平板连接到所述第二平板并控制所述板状容器中的制冷剂的流动; 其特征在于，所述板状容器具有与设置在所述第一平板和所述第二平板中的至少一个上的加热元件热连接的热接收区域， 并且导向壁单元包括一对导向壁，并且引导壁设置在受热区域的相对侧上。
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公开(公告)号：US20130319639A1
公开(公告)日：2013-12-05
申请号：US14000681
申请日：2012-02-17
CPC分类号： F28D15/00 , B23P15/26 , F28D15/0266 , F28D15/0275 , F28F3/02 , H01L23/427 , H01L2924/0002 , Y10T29/4935 , H01L2924/00
摘要： In a cooling device using an ebullient cooling system, it is difficult to improve the cooling performance without increasing manufacturing costs, therefore, a cooling device according to an exemplary aspect of the invention includes a heat receiving unit storing a refrigerant and receiving the heat from an object to be cooled; a heat radiating unit radiating heat by condensing and liquefying a vapor-state refrigerant arising from a refrigerant vaporizing in the heat receiving unit; and a connection connecting the heat receiving unit to the heat radiating unit; wherein the heat receiving unit includes a base thermally contacting with the object to be cooled, and a container connected to the connection; the base includes a heat receiving unit outer wall composing a part of an outer wall of the heat receiving unit, and a plurality of projections disposed on a heat receiving unit undersurface of an undersurface at an inner wall side contacting with the refrigerant; the base includes a bubble nucleus forming surface on a refrigerant contacting surface composed of the heat receiving unit undersurface and the surface of the projection; and the heat receiving unit includes a vapor-state refrigerant region containing a vapor-state refrigerant between the top edge of the projection and one of inner wall surfaces of the container facing the heat receiving unit undersurface.
摘要翻译： 在使用沸腾冷却系统的冷却装置中，难以提高冷却性能而不增加制造成本，因此，根据本发明的示例性方面的冷却装置包括：储存制冷剂的热量接收单元， 待冷却物体; 散热单元，其通过冷凝和液化在所述受热单元中蒸发的制冷剂产生的蒸气状制冷剂来散热; 以及将热接收单元连接到散热单元的连接; 其中所述热接收单元包括与待冷却物体热接触的基座和连接到所述连接件的容器; 所述基座包括构成所述受热单元的外壁的一部分的受热单元外壁和在与所述制冷剂接触的内壁侧的下表面的受热单元下表面上的多个突起; 底座包括由热接收单元下表面和突起的表面构成的制冷剂接触表面上的气泡核形成表面; 并且所述受热单元包括在所述突起的顶部边缘和所述容器的面对所述受热单元下表面的内壁表面之一中包含蒸气状态的制冷剂的蒸汽状态的制冷剂区域。
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公开(公告)号：US20140190738A1
公开(公告)日：2014-07-10
申请号：US14240348
申请日：2012-08-15
IPC分类号： H05K1/02
CPC分类号： H05K1/021 , F28D15/0266 , G06F1/20 , H05K7/2029
摘要： An electronic substrate 100D has a tabular base material 110 which can install a heater element 120 and the cooling structure that cools the heater element 120. An electronic substrate 100 can be plugged in/out in the case 200 in the direction which is almost parallel to the face of the base material 110. The cooling structure is installed on the tabular base material 110, and has the first heat radiation part 160D with a hollow shape and the heat transfer part 700. The first heat radiation part 160D with a hollow shape radiates the generated heat of the heater element 120 installed in the base material. The heat transfer part 700 transfers the generated heat of the heater element 120 to the first heat radiation part 160D. The first heat radiation part 160D has the first joint surface 165 formed along a face which is almost vertical to the insert and removal direction W of the base material 110. The first heat radiation part 160D is connected to the second radiation part 260B set up in the case 200 thermally through the first joint surface 165. As a result, the generated heat of the heater element can be radiated sufficiently.
摘要翻译： 电子基板100D具有片状基材110，其可以安装加热元件120和冷却加热器元件120的冷却结构。电子基板100可以在壳体200中沿几乎平行于 基体材料110的表面。冷却结构安装在片状基材110上，并具有中空形状的第一散热部160D和传热部700.具有中空形状的第一散热部160D辐射 安装在基材中的加热器元件120产生的热量。 传热部700将发热元件120的发热传递到第一散热部160D。 第一散热部分160D具有沿着基本材料110的插入和移除方向W几乎垂直的面形成的第一接合表面165.第一散热部分160D连接到设置在第一辐射部分260B中的第二辐射部分260B 壳体200热穿过第一接合表面165.结果，可以充分地辐射加热器元件的产生的热量。
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10.发明申请PIPING STRUCTURE OF COOLING DEVICE, METHOD FOR MAKING THE SAME, AND METHOD FOR CONNECTING PIPES 审中-公开冷却装置的管道结构，其制造方法以及连接管道的方法公开(公告)号：US20140027100A1
公开(公告)日：2014-01-30
申请号：US14110671
申请日：2012-04-10
IPC分类号： F28F1/00
CPC分类号： F28F1/00 , F28D15/0266 , F28F1/003 , F28F13/187 , F28F19/04 , F28F21/084 , F28F2255/02
摘要： In a piping structure of a cooling device using an ebullient cooling system, the cooling performance of the cooling device is degraded if the pipe is provided with flexibility, therefore, a piping structure of a cooling device according to an exemplary aspect of the invention includes a first tubular part with a hollow portion through which a refrigerant used in the cooling device flows; wherein the first tubular part is made of metal materials; and the surface roughness of the inner surface of the first tubular part is less than or equal to the size of a condensation nucleus for the refrigerant.
摘要翻译： 在使用沸腾冷却系统的冷却装置的配管结构中，如果管道具有柔性，则冷却装置的冷却性能下降，因此根据本发明的示例性方面的冷却装置的管道结构包括 第一管状部分，其具有中空部分，冷却装置中使用的制冷剂通过该中空部分流动; 其中所述第一管状部分由金属材料制成; 并且第一管状部的内表面的表面粗糙度小于或等于制冷剂的凝结核的尺寸。
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