公开(公告)号：US11744981B2

公开(公告)日：2023-09-05

申请号：US17503829

申请日：2021-10-18

Applicant: International Business Machines Corporation

Inventor： Mahmoud Amin ,  Krishna R. Tunga ,  Lawrence A. Clevenger ,  Zhenxing Bi ,  Leigh Anne H. Clevenger

IPC: A61M21/02 ,  G08B21/02 ,  A61B5/00 ,  G06N3/042 ,  H04L67/12 ,  G08B7/06 ,  A61H1/00

CPC classification number: A61M21/02 ,  A61B5/7264 ,  A61B5/7405 ,  A61B5/747 ,  A61B5/749 ,  A61B5/7455 ,  A61H1/00 ,  G06N3/042 ,  G08B7/06 ,  G08B21/02 ,  H04L67/12 ,  A61H2201/5007 ,  A61H2205/062 ,  A61H2205/081

Abstract: Systems, computer-implemented methods and/or computer program products that facilitate real-time response to defined symptoms are provided. In one embodiment, a computer-implemented method comprises: monitoring, by a system operatively coupled to a processor, a state of an entity; detecting, by the system, defined symptoms of the entity by analyzing the state of the entity; and transmitting, by the system, a signal that causes audio response or a haptic response to be provided to the entity, wherein transmission of the signal that causes the audio response or the haptic response is based on detection of the defined symptoms.

公开(公告)号：US11302651B2

公开(公告)日：2022-04-12

申请号：US16575549

申请日：2019-09-19

Applicant: International Business Machines Corporation

Inventor： Kamal K. Sikka ,  Krishna R. Tunga ,  Hilton T. Toy ,  Thomas Weiss ,  Shidong Li ,  Sushumna Iruvanti

IPC: H05K1/02 ,  H05K1/11 ,  H01L23/00 ,  H01L23/498 ,  H01L21/48 ,  H01L21/027 ,  H05K3/30 ,  H05K1/18 ,  H05K1/03

Abstract: A technique relates to an electronic package. A substrate is configured to receive a chip. A stiffener is attached to the substrate. The stiffener includes a core material with a first material formed on opposing sides of the core material.

公开(公告)号：US20220093556A1

公开(公告)日：2022-03-24

申请号：US17030360

申请日：2020-09-23

Applicant: International Business Machines Corporation

Inventor： Katsuyuki Sakuma ,  Krishna R. Tunga ,  Shidong Li ,  Griselda Bonilla

IPC: H01L23/00 ,  H01L21/48

Abstract: An integrated circuit package substrate (ICPS) system includes a die including a first array of connectors and a substrate including a second array of connectors that is configured to be thermocompression bonded to the first array of connectors at a bonding temperature that is above a solder melting temperature. The first die is bonded to the substrate such that the first die is asymmetric with respect to a substrate center, and the second array of connectors is adjusted, at an alignment temperature that is below the solder melting temperature, for thermal expansion to the bonding temperature with respect to a reference point that is not a first die center.

公开(公告)号：US10985129B2

公开(公告)日：2021-04-20

申请号：US16384148

申请日：2019-04-15

Applicant: International Business Machines Corporation

Inventor： Thomas E. Lombardi ,  Steve Ostrander ,  Krishna R. Tunga ,  Thomas A. Wassick

IPC: H01L23/00 ,  H01L23/36 ,  H01L21/48

Abstract: Multiple integrated circuit (IC) devices are connected to a top side metallization surface of a multi IC device carrier. The carrier includes resin based substrate layers and associated wiring line layers. To reduce stain of the resin layers, especially in region(s) within the carrier between the IC devices, a stiffener or stiffeners are applied to the back side metallization (BSM) surface of the IC device carrier. The stiffener(s) reduce the amount of curvature of the IC device carrier and reduce the strain seen by the resin layer(s), thereby mitigating the risk for cracks forming and expanding within the resin layers.

公开(公告)号：US10832987B2

公开(公告)日：2020-11-10

申请号：US15934972

申请日：2018-03-24

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Charles L. Arvin ,  Marcus E. Interrante ,  Thomas E. Lombardi ,  Hilton T. Toy ,  Krishna R. Tunga ,  Thomas Weiss

IPC: H01L23/373 ,  H05K1/02 ,  H01L23/42 ,  H01L23/538 ,  H01L23/00

Abstract: A method of managing thermal warpage of a laminate which includes: assembling a stiffener and an adhesive on the laminate, the stiffener being a material that has a higher modulus of elasticity than the laminate; applying a force to deform the laminate a predetermined amount; heating the laminate, stiffener and adhesive to a predetermined temperature at which the adhesive cures to bond the stiffener to the laminate; cooling the laminate, stiffener and adhesive to a temperature below the predetermined temperature, the laminate maintaining its deformed shape.

公开(公告)号：US20200328177A1

公开(公告)日：2020-10-15

申请号：US16384148

申请日：2019-04-15

Applicant: International Business Machines Corporation

Inventor： Thomas E. Lombardi ,  Steve Ostrander ,  Krishna R. Tunga ,  Thomas A. Wassick

IPC: H01L23/00 ,  H01L21/48 ,  H01L23/36

Abstract: Multiple integrated circuit (IC) devices are connected to a top side metallization surface of a multi IC device carrier. The carrier includes resin based substrate layers and associated wiring line layers. To reduce stain of the resin layers, especially in region(s) within the carrier between the IC devices, a stiffener or stiffeners are applied to the back side metallization (BSM) surface of the IC device carrier. The stiffener(s) reduce the amount of curvature of the IC device carrier and reduce the strain seen by the resin layer(s), thereby mitigating the risk for cracks forming and expanding within the resin layers.

公开(公告)号：US10770385B2

公开(公告)日：2020-09-08

申请号：US16046653

申请日：2018-07-26

Applicant: International Business Machines Corporation

Inventor： Anson J. Call ,  Brian W. Quinlan ,  Krishna R. Tunga

IPC: H01L23/00 ,  H01L23/498 ,  H01L21/48 ,  H01L23/10 ,  H01L23/053 ,  H01L23/367

Abstract: An integrated circuit (IC) chip carrier includes an internal connected plane stiffener. The connected plane stiffener includes a first plane connected to a second plane by a channel via. The first plane is separated from the second plane a plane separation dielectric layer. The channel via is within the plane separation dielectric layer. The first plane and the second plane resist bending moments internal to the IC chip carrier. The channel via resists shear forces internal to the IC chip carrier. The first plane and the second plane may be both power planes that distributes power potential within the IC chip carrier. The first plane and the second plane may be both ground planes that distributes ground potential within the IC chip carrier.

公开(公告)号：US20200090542A1

公开(公告)日：2020-03-19

申请号：US16134164

申请日：2018-09-18

Applicant: International Business Machines Corporation

Inventor： Lawrence A. Clevenger ,  Stefania Axo ,  Leigh Anne H. Clevenger ,  Krishna R. Tunga ,  MAHMOUD AMIN ,  Bryan Gury ,  Christopher J. Penny ,  Mark C. Wallen ,  ZHENXING BI ,  Yang Liu

IPC: G09B19/00 ,  G06N99/00 ,  G06F9/451 ,  G09B5/06 ,  G06F3/0481

Abstract: A computer system interacts with a user with a behavioral state. An activity performed by an entity with a behavioral state is determined. A virtual character corresponding to the entity and performing the determined activity of the entity is generated and displayed. A mental state of the entity responsive to the virtual character is detected. In response to detection of a positive mental state of the entity, one or more natural language terms are provided to the entity corresponding to the activity performed by the virtual character. Embodiments of the present invention further include a method and program product for interacting with a user with a behavioral state in substantially the same manner described above.

公开(公告)号：US20200066127A1

公开(公告)日：2020-02-27

申请号：US16217926

申请日：2018-12-12

Applicant: International Business Machines Corporation

Inventor： Mahmoud Amin ,  Krishna R. Tunga ,  Lawrence A. Clevenger ,  Zhenxing Bi ,  Leigh Anne H. Clevenger

IPC: G08B21/02 ,  H04L29/08 ,  G08B7/06 ,  A61B5/00 ,  A61H1/00 ,  A61M21/02

Abstract: Systems, computer-implemented methods and/or computer program products that facilitate real-time response to defined symptoms are provided. In one embodiment, a computer-implemented method comprises: monitoring, by a system operatively coupled to a processor, a state of an entity; detecting, by the system, defined symptoms of the entity by analyzing the state of the entity; and transmitting, by the system, a signal that causes audio response or a haptic response to be provided to the entity, wherein transmission of the signal that causes the audio response or the haptic response is based on detection of the defined symptoms.

公开(公告)号：US20200035593A1

公开(公告)日：2020-01-30

申请号：US16046653

申请日：2018-07-26

Applicant: International Business Machines Corporation

Inventor： Anson J. Call ,  Brian W. Quinlan ,  Krishna R. Tunga

IPC: H01L23/498 ,  H01L23/00 ,  H01L21/48

Abstract: An integrated circuit (IC) chip carrier includes an internal connected plane stiffener. The connected plane stiffener includes a first plane connected to a second plane by a channel via. The first plane is separated from the second plane a plane separation dielectric layer. The channel via is within the plane separation dielectric layer. The first plane and the second plane resist bending moments internal to the IC chip carrier. The channel via resists shear forces internal to the IC chip carrier. The first plane and the second plane may be both power planes that distributes power potential within the IC chip carrier. The first plane and the second plane may be both ground planes that distributes ground potential within the IC chip carrier.