公开(公告)号：US20160095260A1

公开(公告)日：2016-03-31

申请号：US14831090

申请日：2015-08-20

申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION

发明人： Levi A. CAMPBELL ,  Christopher R. CIRAULO ,  Milnes P. DAVID ,  Dustin W. DEMETRIOU ,  Robert K. MULLADY ,  Roger R. SCHMIDT

IPC分类号： H05K7/20

CPC分类号： H05K7/20727 ,  H05K7/20181

摘要： Apparatuses and methods are provided for blocking removal of an air-moving assembly from a chassis when in operational state. The apparatus includes a protective louver assembly having a louver(s) and an interlock element(s). The louver(s) is disposed at an air inlet or an air outlet of the air-moving assembly, and pivots between an operational and a quiesced orientation, dependent on presence or absence, respectively, of airflow through the air-moving assembly. The interlock element(s) is associated with the louver(s) to pivot with the louver(s) between the operational orientation and the quiesced orientation. In the operational orientation, the interlock element(s) blocks, at least in part, access to at least one fastener securing the air-moving assembly within the chassis, and thereby prevents removal of the air-moving assembly from the chassis when in the operational state.

摘要翻译： 提供了设备和方法，用于当处于操作状态时阻止从底盘移除空气移动组件。 该装置包括具有百叶窗和互锁元件的保护百叶窗组件。 百叶窗设置在空气移动组件的空气入口或空气出口处，并且依赖于通过空气移动组件的气流的存在或不存在而在操作和静止取向之间枢转。 互锁元件与百叶窗相关联，以在操作方向和静止取向之间与百叶窗枢转。 在操作方向上，互锁元件至少部分地阻挡至少一个将空气移动组件固定在底盘内的紧固件，从而防止空气移动组件从底盘移除时 运行状态

公开(公告)号：US20160095259A1

公开(公告)日：2016-03-31

申请号：US14831073

申请日：2015-08-20

申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION

发明人： Levi A. CAMPBELL ,  Christopher R. CIRAULO ,  Milnes P. DAVID ,  Dustin W. DEMETRIOU ,  Robert K. MULLADY ,  Roger R. SCHMIDT

IPC分类号： H05K7/20

CPC分类号： H05K7/20727 ,  F04D25/14 ,  H05K7/20181 ,  H05K7/2019

摘要： Apparatuses and methods are provided for locking an air-moving assembly within a chassis when in operational state. The apparatus includes a locking louver assembly having a louver(s) and locking mechanism. The louver(s) is disposed at an air inlet or outlet of the air-moving assembly, and pivots between operational and quiesced orientations, dependent on presence or absence, respectively, of airflow through the air-moving assembly. The locking mechanism includes a keying element(s) affixed to the louver(s) to pivot therewith, which includes an elongated key(s) oriented in a first direction when the louver(s) is in operational orientation, and a second direction when in quiesced orientation. A key-receiving element(s) is associated with the chassis and includes a key opening(s) which receives and accommodates movement of the elongated key(s) between the first and second directions, and prevents removal of the air-moving assembly from the chassis with the key(s) oriented in the first direction.

摘要翻译： 提供了设备和方法，用于在运行状态下将空气移动组件锁定在底盘内。 该装置包括具有百叶窗和锁定机构的锁定百叶窗组件。 百叶窗设置在空气移动组件的空气入口或出口处，并且依赖于通过空气移动组件的气流的存在或不存在而在操作和静止取向之间枢转。 所述锁定机构包括固定到所述百叶窗上以与之枢转的键合元件，所述键合元件包括当所述百叶窗处于操作定向时沿第一方向定向的细长键，以及当所述百叶窗处于操作方向时的第二方向， 在静止的方向。 钥匙接收元件与底盘相关联，并且包括钥匙开口，该钥匙开口接收并容纳细长钥匙在第一和第二方向之间的运动，并且防止空气移动组件的移除 所述机箱具有朝向所述第一方向的所述键。

公开(公告)号：US20160088764A1

公开(公告)日：2016-03-24

申请号：US14494924

申请日：2014-09-24

申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION

发明人： Milnes P. DAVID ,  Michael J. DOMITROVITS ,  Joshua MURPHY ,  John V. PALMER ,  Sal M. ROSATO

IPC分类号： H05K7/20 ,  F04D25/02 ,  F04D19/00

CPC分类号： F04D25/026 ,  F04D17/16 ,  F04D19/002 ,  F04D25/08 ,  F04D25/166 ,  F04D27/005 ,  F05B2260/302 ,  F05B2260/421 ,  H02H7/09 ,  H05K7/20136 ,  H05K7/20745

摘要： Apparatuses and methods are provided for facilitating air-cooling of, for instance, one or more electronics racks within a data center. The apparatus includes an air-moving assembly and one or more flywheels. The air-moving assembly includes a shaft, one or more mechanical fans coupled to the shaft to rotate, at least in part, with the shaft, and a motor coupled to the shaft to rotatably drive the shaft. The flywheel(s) is sized and coupled to the shaft of the air-moving assembly to store rotational energy, and to facilitate, for a specified period of time, continued rotation of the shaft during interruption in power to the motor. In one implementation, the flywheel(s) is sized and coupled to the shaft to facilitate, for the specified time period, continued rotation of the shaft at a specified percentage, or greater, rotational speed of the shaft compared with shaft speed when rotatably driven by the motor.

公开(公告)号：US20150109728A1

公开(公告)日：2015-04-23

申请号：US14058581

申请日：2013-10-21

申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION

发明人： Levi A. CAMPBELL ,  Richard C. CHU ,  Milnes P. DAVID ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Roger R. SCHMIDT ,  Robert E. SIMONS

IPC分类号： H05K7/20

CPC分类号： H05K7/203 ,  H05K7/20 ,  H05K7/20236 ,  H05K7/20336 ,  H05K7/20781

摘要： A cooled electronic system and cooling method are provided, wherein a field-replaceable bank of electronic components is cooled by an apparatus which includes an enclosure at least partially surrounding and forming a compartment about the electronic components, a fluid disposed within the compartment, and a heat sink associated with the enclosure. The field-replaceable bank extends, in part, through the enclosure to facilitate operative docking of the electronic components into one or more respective receiving sockets of the electronic system. The electronic components of the field-replaceable bank are, at least partially, immersed within the fluid to facilitate immersion-cooling of the components, and the heat sink facilitates rejection of heat from the fluid disposed within the compartment. In one embodiment, multiple thermal conductors project from an inner surface of the enclosure into the compartment to facilitate transfer of heat from the fluid to the heat sink.

公开(公告)号：US20150107801A1

公开(公告)日：2015-04-23

申请号：US14058562

申请日：2013-10-21

申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION

发明人： Levi A. CAMPBELL ,  Richard C. CHU ,  Milnes P. DAVID ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Roger R. SCHMIDT ,  Robert E. SIMONS

IPC分类号： H05K7/20

CPC分类号： H05K7/2039 ,  H05K7/20254 ,  H05K7/20772

摘要： Cooling apparatuses, cooled electronic modules, and methods of fabrication are provided which facilitate heat transfer from one or more electronic components to a coolant. The cooling apparatus includes a coolant-cooled heat sink with a thermally conductive structure having a coolant-carrying compartment including a varying cross-sectional coolant flow area through which coolant flows in a direction substantially parallel to a main heat transfer surface of the structure coupled to the electronic component(s). The coolant-cooled heat sink includes a coolant inlet and a coolant outlet in fluid communication with the coolant-carrying compartment, and the coolant flow area of the coolant-carrying compartment decreases, at least in part, in a direction of coolant flow through the coolant-carrying compartment. The decreasing coolant flow area facilitates an increasing effective heat transfer coefficient between the main heat transfer surface and the coolant by, at least in part, accelerating the coolant flow within the coolant-carrying compartment.

摘要翻译： 提供冷却装置，冷却的电子模块和制造方法，其有助于从一个或多个电子部件到冷却剂的热传递。 该冷却装置包括具有导热结构的冷却剂冷却的散热器，该导热结构具有一个带有冷却剂输送隔室，该冷却剂输送室包括变化的横截面冷却剂流动区域，冷却剂流动区域通过冷却剂流动区域大致平行于结构的主传热表面 电子组件。 冷却剂冷却的散热器包括冷却剂入口和与冷却剂携带室流体连通的冷却剂出口，并且冷却剂承载室的冷却剂流动区域至少部分地沿冷却剂流过 冷气携带舱。 减少的冷却剂流动面积有助于通过至少部分地加速冷却剂供给室内的冷却剂流而增加主传热表面和冷却剂之间的有效传热系数。

公开(公告)号：US20150036288A1

公开(公告)日：2015-02-05

申请号：US14519422

申请日：2014-10-21

申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION

发明人： Levi A. CAMPBELL ,  Richard C. CHU ,  Milnes P. DAVID ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

IPC分类号： G06F1/20

CPC分类号： H05K7/20818 ,  G06F1/20 ,  G06F2200/201 ,  H05K7/2029 ,  H05K7/20309 ,  H05K7/20318 ,  H05K7/20809

摘要： Methods of facilitating cooling an electronic system are provided, which include: providing a heat sink(s) configured to cool an electronic component(s), the heat sink(s) including a coolant-carrying channel for a first coolant, the first coolant providing two-phase cooling to the electronic component(s) and being discharged from the heat sink(s) as coolant exhaust with coolant vapor; providing a node-level condensation module coupled in fluid communication with the heat sink(s), the condensation module receiving first coolant exhaust from the heat sink(s) and being liquid-cooled via a second coolant to condense coolant vapor before return to a rack-level return manifold; automatically controlling at least one of liquid-cooling of the heat sink(s), or liquid-cooling of the condensation module(s); and providing a control valve for adjusting flow rate of the second coolant to the condensation module(s), the control valve being automatically controlled based on a characterization of the coolant vapor in the coolant exhaust.

摘要翻译： 提供了方便冷却电子系统的方法，其包括：提供被配置为冷却电子部件的散热器，所述散热器包括用于第一冷却剂的冷却剂传送通道，所述第一冷却剂 向电子部件提供两相冷却，并以冷却剂蒸气作为冷却剂排出从散热器排出; 提供与所述散热器流体连通的节点级冷凝模块，所述冷凝模块从所述散热器接收第一冷却剂排出物，并经由第二冷却剂进行液冷，以冷却冷却剂蒸汽，然后返回到 机架式回流歧管; 自动控制散热器的液体冷却中的至少一个或冷凝模块的液体冷却; 并且提供用于调节第二冷却剂到冷凝模块的流量的控制阀，基于冷却剂排气中的冷却剂蒸汽的表征来自动控制控制阀。

公开(公告)号：US20140124174A1

公开(公告)日：2014-05-08

申请号：US13671857

申请日：2012-11-08

申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION

发明人： Levi A. CAMPBELL ,  Richard C. CHU ,  Milnes P. DAVID ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Roger R. SCHMIDT ,  Robert E. SIMONS

IPC分类号： F28D15/00

CPC分类号： F28D15/02 ,  F28F3/048 ,  F28F3/12 ,  F28F2250/08 ,  H05K7/203 ,  H05K7/20772 ,  H05K7/20809 ,  Y10T29/4935 ,  Y10T29/49359

摘要： Cooling apparatuses and methods of fabrication thereof are provided to facilitate two-phase, immersion-cooling of one or more electronic components. The cooling apparatus includes a housing having a compartment within which dielectric fluid is disposed which facilitates immersion-cooling of the electronic component(s). A liquid-cooled heat sink is associated with the housing and cools a cooling surface exposed within the compartment. One or more pumps are disposed within the compartment and configured to pump dielectric fluid liquid within the compartment towards the cooling surface to facilitate cooling the liquid within the compartment below a saturation temperature of the dielectric fluid. The heat sink includes or is coupled to condensing and sub-cooling regions exposed within the compartment.

摘要翻译： 提供冷却装置及其制造方法以便于一个或多个电子部件的两相浸没冷却。 冷却装置包括壳体，该壳体具有隔室，在该隔室中布置介质流体，其有利于电子部件的浸入冷却。 液体冷却散热器与壳体相关联并且冷却暴露在隔间内的冷却表面。 一个或多个泵设置在隔室内，并且构造成将腔室内的介质流体液体朝向冷却表面泵送，以便于冷却介质流体的饱和温度以下室内的液体。 散热器包括或耦合到暴露在隔室内的冷凝和次冷却区域。

公开(公告)号：US20140123492A1

公开(公告)日：2014-05-08

申请号：US13780613

申请日：2013-02-28

申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION

发明人： Levi A. CAMPBELL ,  Richard C. CHU ,  Milnes P. DAVID ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Roger R. SCHMIDT ,  Robert E. SIMONS

IPC分类号： F28D15/00

CPC分类号： F28D15/02 ,  F28F3/048 ,  F28F3/12 ,  F28F2250/08 ,  H05K7/203 ,  H05K7/20772 ,  H05K7/20809 ,  Y10T29/4935 ,  Y10T29/49359

摘要： A method of fabricating a cooling apparatus is provided to facilitate two-phase, immersion-cooling of one or more electronic components. The cooling apparatus includes a housing having a compartment within which dielectric fluid is disposed which facilitates immersion-cooling of the electronic component(s). A liquid-cooled heat sink is associated with the housing and cools a cooling surface exposed within the compartment. One or more pumps are disposed within the compartment and configured to pump dielectric fluid liquid within the compartment towards the cooling surface to facilitate cooling the liquid within the compartment below a saturation temperature of the dielectric fluid. The heat sink includes or is coupled to condensing and sub-cooling regions exposed within the compartment.

摘要翻译： 提供一种制造冷却装置的方法，以便于一个或多个电子部件的两相浸没冷却。 冷却装置包括壳体，该壳体具有隔室，在该隔室中布置介质流体，其有利于电子部件的浸入冷却。 液体冷却散热器与壳体相关联并且冷却暴露在隔间内的冷却表面。 一个或多个泵设置在隔室内，并且构造成将腔室内的介质流体液体朝向冷却表面泵送，以便于冷却介质流体的饱和温度以下室内的液体。 散热器包括或耦合到暴露在隔室内的冷凝和次冷却区域。

公开(公告)号：US20140102669A1

公开(公告)日：2014-04-17

申请号：US13758143

申请日：2013-02-04

申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION

发明人： Levi A. CAMPBELL ,  Richard C. CHU ,  Milnes P. DAVID ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS ,  Prabjit SINGH ,  Jing ZHANG

IPC分类号： F28D1/02

CPC分类号： H05K7/20836 ,  F28F2265/14

摘要： An automated multi-fluid cooling method is provided for cooling an electronic component(s). The method includes obtaining a coolant loop, and providing a coolant tank, multiple valves, and a controller. The coolant loop is at least partially exposed to outdoor ambient air temperature(s) during normal operation, and the coolant tank includes first and second reservoirs containing first and second fluids, respectively. The first fluid freezes at a lower temperature than the second, the second fluid has superior cooling properties compared with the first, and the two fluids are soluble. The multiple valves are controllable to selectively couple the first or second fluid into the coolant in the coolant loop, wherein the coolant includes at least the second fluid. The controller automatically controls the valves to vary first fluid concentration level in the coolant loop based on historical, current, or anticipated outdoor air ambient temperature(s) for a time of year.

摘要翻译： 提供了用于冷却电子部件的自动多流体冷却方法。 该方法包括获得冷却剂回路，以及提供冷却剂箱，多个阀和控制器。 在正常操作期间，冷却剂回路至少部分地暴露于室外环境空气温度，并且冷却剂箱分别包括容纳第一和第二流体的第一和第二储存器。 第一流体在比第二流体低的温度下冻结，第二流体与第一流体相比具有优异的冷却性能，并且两种流体是可溶的。 多个阀是可控制的，以选择性地将第一或第二流体耦合到冷却剂回路中的冷却剂中，其中冷却剂至少包括第二流体。 控制器根据一年中的历史，当前或预期的室外空气环境温度，自动控制阀门改变冷却剂回路中的第一个液体浓度水平。

公开(公告)号：US20140085817A1

公开(公告)日：2014-03-27

申请号：US13788987

申请日：2013-03-07

申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION

发明人： Levi A. CAMPBELL ,  Richard C. CHU ,  Milnes P. DAVID ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Roger R. SCHMIDT ,  Robert E. SIMONS

IPC分类号： H05K7/20

CPC分类号： H05K7/20 ,  H05K7/20236 ,  H05K7/20772 ,  Y10T29/49117

摘要： A method is provided for pumped immersion-cooling of selected electronic components of an electronic system, such as a node or book of a multi-node rack. The method includes providing a housing assembly defining a compartment about the component(s) to be cooled, which is coupled to a first side of a printed circuit board. The assembly includes a first frame with an opening sized to accommodate the component(s), and a second frame. The first and second frames are sealed to opposite sides of the board via a first adhesive layer and a second adhesive layer, respectively. The printed circuit board is at least partially porous to a coolant to flow through the compartment, and the first frame, second frame, and first and second adhesive layers are non-porous with respect to the coolant, and provide a coolant-tight seal to the first and second sides of the printed circuit board.

摘要翻译： 提供了一种用于对诸如多节点机架的节点或书的电子系统的所选择的电子部件进行抽吸浸没冷却的方法。 该方法包括提供围绕待冷却的部件限定隔室的壳体组件，该组件联接到印刷电路板的第一侧。 组件包括具有开口尺寸以容纳部件的第一框架和第二框架。 第一和第二框架分别经由第一粘合剂层和第二粘合剂层密封到板的相对侧。 印刷电路板至少部分地多孔于冷却剂流过隔间，并且第一框架，第二框架和第一和第二粘合剂层相对于冷却剂是无孔的，并且提供冷却剂密封到 印刷电路板的第一和第二面。