HIGH DENSITY MICROWAVE HERMETIC INTERCONNECTS FOR QUANTUM APPLICATIONS

    公开(公告)号:US20200272927A1

    公开(公告)日:2020-08-27

    申请号:US16281657

    申请日:2019-02-21

    Abstract: A quantum computer includes a refrigeration system under vacuum including a containment vessel, a qubit chip contained within a refrigerated vacuum environment defined by the containment vessel. The quantum computer further includes a plurality of interior electromagnetic waveguides and a plurality of exterior electromagnetic waveguides. The quantum computer further includes a hermetic connector assembly operatively connecting the interior electromagnetic waveguides to the exterior electromagnetic waveguides while maintaining the refrigerated vacuum environment. The hermetic connector assembly includes an exterior multi-waveguide connector, an interior multi-waveguide connector, and a dielectric plate arranged between and hermetically sealed with the exterior multi-waveguide connector and the interior multi-waveguide connector. The dielectric plate permits electromagnetic energy when carried by the interior and exterior pluralities of electromagnetic waveguides to pass therethrough.

    Mapping temperature distribution in superconducting devices

    公开(公告)号:US11674854B2

    公开(公告)日:2023-06-13

    申请号:US16460457

    申请日:2019-07-02

    CPC classification number: G01K3/14 G06F30/20 G06N10/00

    Abstract: Techniques regarding determining and/or analyzing temperature distributions experienced by quantum computer devices during operation are provided. For example, one or more embodiments described herein can comprise a system, which can comprise a memory that can store computer executable components. The system can also comprise a processor, operably coupled to the memory, and that can execute the computer executable components stored in the memory. The computer executable components can comprise a region component that can define a plurality of temperature regions from a quantum computing device layout. The computer executable component can also comprise a map component that can generate a map that characterizes a temperature distribution by determining at least one temperature achieved within the plurality of temperature regions during an operation of the quantum computing device layout.

    Majorana fermion quantum computing devices with charge sensing fabricated with ion implant methods

    公开(公告)号:US11515460B2

    公开(公告)日:2022-11-29

    申请号:US16680078

    申请日:2019-11-11

    Abstract: A quantum computing device is fabricated by forming, on a superconductor layer, a first resist pattern defining a device region and a sensing region within the device region. The superconductor layer within the sensing region is removed, exposing a region of an underlying semiconductor layer outside the device region. The exposed region of the semiconductor layer is implanted, forming an isolation region surrounding the device region. Using an etching process subsequent to the implanting, the sensing region and a portion of the device region of the superconductor layer adjacent to the isolation region are exposed. By depositing a first metal layer within the sensing region, a tunnel junction gate is formed. A reflectrometry wire comprising a second metal within the reflectrometry region is formed. A nanorod contact using the second metal within the portion of the device region outside the sensing region is formed.

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