公开(公告)号：US06883977B2

公开(公告)日：2005-04-26

申请号：US10013084

申请日：2001-12-10

申请人： Mindaugas F. Dautartas ,  David W. Sherrer ,  Neal Ricks ,  Dan A. Steinberg

发明人： Mindaugas F. Dautartas ,  David W. Sherrer ,  Neal Ricks ,  Dan A. Steinberg

IPC分类号： G02B6/42 ,  H05K3/34 ,  G02B6/36

CPC分类号： G02B6/4201 ,  G02B6/423 ,  G02B6/4232 ,  H05K3/3436

摘要： An optical device package includes a substrate; an optical fiber, a frame, and optionally a lid and an optical semiconductor component. The upper surface of the frame includes conductive visa extending vertically to solder balls on its upper surface. Conductive traces along the surface of the substrate provide electrical communication between the optical semiconductor component and the frame. The optical device package is adapted for flip-chip type mounting to a circuit board or other mounting surface.

摘要翻译： 光学器件封装包括衬底; 光纤，框架，以及可选的盖子和光学半导体部件。 框架的上表面包括在其上表面上与焊球垂直延伸的导电签证。 沿着衬底表面的导电迹线提供光学半导体部件和框架之间的电连通。 光学器件封装适于倒装芯片类型安装到电路板或其他安装表面。

公开(公告)号：US06842552B1

公开(公告)日：2005-01-11

申请号：US10356663

申请日：2003-01-31

申请人： Dan A. Steinberg ,  John J. Fisher ,  David W. Sherrer ,  Mindaugas F. Dautartas ,  William T. Stacy

发明人： Dan A. Steinberg ,  John J. Fisher ,  David W. Sherrer ,  Mindaugas F. Dautartas ,  William T. Stacy

IPC分类号： G02B6/35 ,  G02B6/38 ,  G02B6/26 ,  G02B6/42

CPC分类号： G02B6/3506 ,  G02B6/3508 ,  G02B6/3546 ,  G02B6/3582 ,  G02B6/3834 ,  G02B6/3839 ,  G02B6/3841 ,  G02B6/3882

摘要： The present invention provides an optical switch. The switch includes a substrate and a first waveguide holding member. The switch also includes a second waveguide holding member disposed over the substrate and movable relative to the first waveguide holding member to provide a switching function. A movement guiding member is provided for guiding the movement of the second waveguide holding member. A registration element is disposed at the movement guiding member for positioning the second waveguide holding member at a selected location relative to the first waveguide holding member. The selected location is one that provides alignment between a selected waveguide of the first waveguide holding member and a selected waveguide of the second waveguide holding member.

摘要翻译： 本发明提供一种光开关。 开关包括基板和第一波导保持构件。 开关还包括设置在基板上并且可相对于第一波导保持构件移动以提供开关功能的第二波导保持构件。 移动引导构件用于引导第二波导保持构件的运动。 一个配准元件设置在运动引导构件上，用于将第二波导保持构件相对于第一波导保持构件定位在选定位置。 所选择的位置是提供第一波导保持构件的选定波导与第二波导保持构件的选定波导之间的对准的位置。

公开(公告)号：US06545573B1

公开(公告)日：2003-04-08

申请号：US09679325

申请日：2000-10-04

申请人： Mindaugas F. Dautartas ,  John M. Geary

发明人： Mindaugas F. Dautartas ,  John M. Geary

IPC分类号： H01P100

CPC分类号： H01P1/162

摘要： An optical microwave package eliminates launching electrical modes into a microwave strip-line by forming a moat in a housing portion of the package to suppress microwave resonant energy. The moat can be filled with a conductive material to further suppress package resonances. Additionally, the bottom of a substrate positioned within the housing is isolated from any conductive metal to further suppress microwave resonant energy.

摘要翻译： 光学微波组件通过在封装的壳体部分中形成护城河以抑制微波谐振能量，从而消除了将微波带状线路的电模式发射到微波带状线中。 护城河可以填充导电材料以进一步抑制包装共振。 此外，位于壳体内的基板的底部与任何导电金属隔离，以进一步抑制微波共振能量。

公开(公告)号：US06124158A

公开(公告)日：2000-09-26

申请号：US327793

申请日：1999-06-08

申请人： Mindaugas F. Dautartas ,  Lalita Manchanda

发明人： Mindaugas F. Dautartas ,  Lalita Manchanda

IPC分类号： H01L21/28 ,  H01L21/316 ,  H01L29/51 ,  H01L21/8238

CPC分类号： H01L21/28185 ,  H01L21/02178 ,  H01L21/0228 ,  H01L21/02304 ,  H01L21/28194 ,  H01L21/28202 ,  H01L21/28273 ,  H01L21/31616 ,  H01L29/517 ,  H01L29/518

摘要： A process is provided for the formation of a thin film of gate dielectric or similar material on a silicon semiconductor substrate from an organic precursor by atomic layer epitaxy, wherein the organic precursor is introduced to react with the treated surface to form a bonded monolayer of reactive species. A second reactant is introduced to react with the surface to form the desired dielectric. After each step in the cycle, the reaction chamber is purged with an inert gas to prevent reactions except on the surface. The cycle is repeated tens to hundreds of times to achieve a desired final film thickness. No less frequently than every third cycle, the film undergoes a discrete treatment step wherein ozone is introduced into the chamber to oxidize carbon contaminants therein to form volatile products which are removed from the reaction chamber by purging with the inert gas. In a preferred embodiment where the substrate is silicon or polysilicon, a sub-monolayer of a protection material is formed by boding to silicon sites on the surface before the deposition of dielectric is begun. A preferred dielectric is gate aluminum oxide that is deposited using trimethyl aluminum as a precursor.

摘要翻译： 提供了一种用于通过原子层外延从有机前体在硅半导体衬底上形成栅极电介质或类似材料的薄膜的方法，其中引入有机前体以与经处理的表面反应以形成具有反应性的键合单层 种类。 引入第二反应物以与表面反应以形成所需的电介质。 在循环中的每个步骤之后，用惰性气体吹扫反应室以防止除表面之外的反应。 该循环重复数十至数百次，以达到所需的最终膜厚度。 每隔三个循环不再频繁地，薄膜进行离散的处理步骤，其中将臭氧引入室中以氧化其中的碳污染物，以形成通过用惰性气体吹洗从反应室中除去的挥发性产物。 在衬底是硅或多晶硅的优选实施例中，保护材料的亚单层通过在开始沉积电介质之前粘附到表面上的硅位置而形成。 优选的电介质是使用三甲基铝作为前体沉积的栅极氧化铝。

公开(公告)号：US5337398A

公开(公告)日：1994-08-09

申请号：US984062

申请日：1992-11-30

申请人： Albert M. Benzoni ,  Mindaugas F. Dautartas

发明人： Albert M. Benzoni ,  Mindaugas F. Dautartas

IPC分类号： G02B6/26 ,  G02B6/42

CPC分类号： G02B6/4292 ,  G02B6/4224 ,  G02B6/4246 ,  G02B6/4249

摘要： An optical packaging arrangement is disclosed which utilizes silicon technology and overmolding techniques to provide a single in-line package with completely passive alignment between the various optical components. The technique as disclosed is useful in the packaging of a single active optical device and associated electronics, a pair of optical devices and electronics (transceiver), or an array of any desired number of such components. Since the silicon may be processed to include etched alignment fiducials and metallized bond pad sites, solder bump self-alignment and silicon optical bench technology may be used to provide for alignment between the active device, coupling lens and associated optical fiber.

摘要翻译： 公开了一种使用硅技术和包覆成型技术来提供单个在线封装的光学封装装置，其中各种光学部件之间具有完全无源对准。 所公开的技术在单个有源光学器件和相关电子器件，一对光学器件和电子器件（收发器）的包装或任何所需数量的这种部件的阵列中是有用的。 由于可以处理硅以包括蚀刻对准基准和金属化接合焊盘位置，所以可以使用焊料凸起自对准和硅光学工作台技术来提供有源器件，耦合透镜和相关联的光纤之间的对准。

公开(公告)号：US5259054A

公开(公告)日：1993-11-02

申请号：US819252

申请日：1992-01-10

申请人： Albert M. Benzoni ,  Mindaugas F. Dautartas

发明人： Albert M. Benzoni ,  Mindaugas F. Dautartas

IPC分类号： G02B6/36 ,  G02B6/42

CPC分类号： G02B6/4231 ,  G02B6/4202 ,  G02B6/4204 ,  G02B6/4232

摘要： An optical subassembly is disclosed which provides self-alignment between an active optical device and associated optical elements. In particular, the subassembly comprises a first substrate member which is utilized to support the active optical device. A separate plurality of substrate members is used to form a support for the associated optical elements (i.e., fiber, coupling lens or both), where the separate members are stacked, one on top of the other, and an aperture through the center thereof utilized to support the optical elements. The aperture may be formed to include a mechanical stop suitable for fixing the location of an optical fiber endface. Alignment fiducials formed on the device support member and the stack provide self-alignment therebetween, as well as physical attachment of the support member to the stack. The various substrate members may comprise any suitable material including, but not limited to, silicon, metal, or molded plastic.