REMOVAL OF CHARGE BETWEEN A SUBSTRATE AND AN ELECTROSTATIC CLAMP
    41.
    发明申请
    REMOVAL OF CHARGE BETWEEN A SUBSTRATE AND AN ELECTROSTATIC CLAMP 有权
    去除基板和静电夹之间的电荷

    公开(公告)号:US20100265631A1

    公开(公告)日:2010-10-21

    申请号:US12759990

    申请日:2010-04-14

    IPC分类号: H01L21/683 H02N13/00

    摘要: An electrostatic clamp, which more effectively removes built up charge from a substrate prior to and during removal, is disclosed. Currently, the lift pins and ground pins are the only mechanisms used to remove charge from the substrate after implantation. The present discloses describes a clamp having one of more additional low resistance paths to ground. These additional conduits allow built up charge to be dissipated prior to and during the removal of the substrate from the clamp. By providing sufficient charge drainage from the backside surface of the substrate 114, the problem whereby the substrate sticks to the clamp can be reduced. This results in a corresponding reduction in substrate breakage.

    摘要翻译: 公开了一种静电夹具,其在去除和移除之前更有效地从衬底上去除积聚的电荷。 目前,电极引脚和接地引脚是植入后从衬底去除电荷的唯一机制。 本公开描述了一种具有更多附加的低电阻路径到地之一的夹具。 这些额外的管道允许在从夹具移除衬底之前和期间消耗积分电荷。 通过从基板114的背面提供足够的电荷排出,可以减少基板粘附到夹具上的问题。 这导致基板断裂的相应减少。

    MASK APPLIED TO A WORKPIECE
    42.
    发明申请
    MASK APPLIED TO A WORKPIECE 失效
    MASK应用于工作

    公开(公告)号:US20100184243A1

    公开(公告)日:2010-07-22

    申请号:US12689605

    申请日:2010-01-19

    摘要: A method of fabricating a workpiece is disclosed. A material defining apertures is applied to a workpiece. A species is introduced to the workpiece through the apertures and the material is removed. For example, the material may be evaporated, may form a volatile product with a gas, or may dissolve when exposed to a solvent. The species may be introduced using, for example, ion implantation or gaseous diffusion.

    摘要翻译: 公开了一种制造工件的方法。 将定义孔的材料施加到工件上。 通过孔将物质引入工件,并且去除材料。 例如,该材料可能被蒸发,可能与气体形成挥发性产物,或者当暴露于溶剂时可能会溶解。 可以使用例如离子注入或气体扩散来引入物种。

    IN-VACUUM PROTECTIVE LINERS
    44.
    发明申请
    IN-VACUUM PROTECTIVE LINERS 审中-公开
    真空保护衬管

    公开(公告)号:US20090179158A1

    公开(公告)日:2009-07-16

    申请号:US12353642

    申请日:2009-01-14

    IPC分类号: H01J27/00 G21K1/00 H01J49/00

    摘要: This device has a liner disposed on a face in a vacuum chamber. A component in the vacuum chamber defines the face. The liner is configured to protect the workpiece from contamination or to prevent blistering of the face caused by implantation of atoms or ions into the face. The liner may be disposable and removed from the face in the vacuum chamber and replaced with a new liner in some embodiments. This liner may be a polymer with a roughened surface, be carbon-based, or be composed of carbon nanotubes in some embodiments.

    摘要翻译: 该装置具有设置在真空室中的表面上的衬垫。 真空室中的部件限定了面。 衬套被配置为保护工件免受污染或防止由于将原子或离子注入到面中引起的起泡。 在一些实施例中,衬垫可以是一次性的并且从真空室中的表面移除并替换为新衬里。 在一些实施方案中,该衬垫可以是具有粗糙表面的聚合物,为碳基,或由碳纳米管组成。

    ELECTROSTATIC CHUCK WITH SEPARATED ELECTRODES
    45.
    发明申请
    ELECTROSTATIC CHUCK WITH SEPARATED ELECTRODES 有权
    具有分离电极的静电卡盘

    公开(公告)号:US20080239614A1

    公开(公告)日:2008-10-02

    申请号:US11690950

    申请日:2007-03-26

    IPC分类号: H01L21/683

    摘要: Electrostatic clamping devices and methods for reducing contamination to a workpiece coupled to an electrostatic clamping device are disclosed. According to an embodiment an electrostatic clamping device for coupling a workpiece comprises: an embossment portion on a surface of a body to contact the workpiece; and at least two electrodes within the body; wherein the two electrodes are separated by a separation portion below the embossment portion.

    摘要翻译: 公开了用于减少与静电夹紧装置连接的工件的污染的静电夹紧装置和方法。 根据实施例,用于联接工件的静电夹紧装置包括:在主体表面上与工件接触的压花部分; 和身体内至少两个电极; 其中两个电极由压花部分下方的分离部分分开。

    Active wafer cooling during damage engineering implant to enhance buried oxide formation in SIMOX wafers
    46.
    发明授权
    Active wafer cooling during damage engineering implant to enhance buried oxide formation in SIMOX wafers 失效
    在损伤工程植入期间的有源晶片冷却以增强SIMOX晶片中的掩埋氧化物形成

    公开(公告)号:US06998353B2

    公开(公告)日:2006-02-14

    申请号:US10011518

    申请日:2001-11-05

    IPC分类号: H01L21/31

    CPC分类号: H01L21/76243 Y10S438/966

    摘要: The present invention provides methods and system for forming a buried oxide layer (BOX) region in a semiconductor substrate, such as, a silicon wafer. In one aspect, in a method of the invention, an initial dose of oxygen ions is implanted in the substrate while maintaining the substrate temperature in a range of about 300° C. to 600° C. Subsequently, a second dose of oxygen ions is implanted in the substrate while actively cooling the substrate to maintain the substrate temperature in range of about 50° C. to 150° C. These ion implantation steps are followed by an annealing step in an oxygen containing atmosphere to form a continuous BOX region in the substrate. In one preferred embodiment, the initial ion implantation step is performed in a chamber that includes a device for heating the substrate while the second ion implantation step is performed in a separate chamber that is equipped with a device for actively cooling the substrate. The annealing step can be performed in a third chamber or in either of the first or second chambers.

    摘要翻译: 本发明提供了在诸如硅晶片的半导体衬底中形成掩埋氧化物层(BOX)区的方法和系统。 一方面,在本发明的方法中,将初始剂量的氧离子注入到衬底中,同时将衬底温度保持在约300℃至600℃的范围内。随后,第二剂量的氧离子为 植入衬底中同时主动冷却衬底,以将衬底温度维持在约50℃至150℃的范围内。这些离子注入步骤之后是在含氧气氛中的退火步骤,以形成连续的BOX区域 基质。 在一个优选实施例中,初始离子注入步骤在包括用于加热衬底的器件的腔室中执行,而第二离子注入步骤在配备有用于主动冷却衬底的器件的单独室中执行。 退火步骤可以在第三室或第一室或第二室中的任一个中进行。

    Sputtering system
    47.
    发明授权
    Sputtering system 失效
    溅射系统

    公开(公告)号:US5019233A

    公开(公告)日:1991-05-28

    申请号:US434605

    申请日:1989-11-08

    摘要: A system (10) for the vacuum processing of substrates such as semiconductor wafers which includes a central handling chamber (14), a number of separately pumped and randomly accessed process chambers (16-19), and dual load lock chambers (22) which communicate with the central handling chamber. This configuration permits one batch of substrates to be subjected to load lock evacuation while a second batch, having been previously evacuated, is transferred one at a time to selected process chambers. Substrate transfer from the load locks to the central handling chamber is by means of elevators (42) and by means of a handling assembly (24) which undergoes and Z motion only, with final transfer from the central handling chamber to the process chambers being accomplished by pivoting platen assemblies (66).

    摘要翻译: 一种用于真空处理诸如半导体晶片的衬底的系统(10),其包括中央处理室(14),多个单独泵送和随机存取的处理室(16-19)和双负载锁定室(22),所述系统 与中央处理室通信。 这种配置允许一批衬底经受负载锁排空,而先前已被抽空的第二批次被一次一个地转移到选定的处理室。 从装载锁到中央处理室的基板转移是借助于电梯(42)和借助于处理组件(24)而进行的,并且只有Z运动才能从中央处理室到处理室的最终传送被完成 通过枢转压板组件(66)。

    Method of cooling textured workpieces with an electrostatic chuck
    48.
    发明授权
    Method of cooling textured workpieces with an electrostatic chuck 有权
    用静电卡盘冷却纹理工件的方法

    公开(公告)号:US08672311B2

    公开(公告)日:2014-03-18

    申请号:US12791278

    申请日:2010-06-01

    IPC分类号: B23Q3/00

    摘要: A workpiece support, which more effectively cools a textured workpiece is disclosed. A layer is added on top of a workpiece support. This layer is sufficiently soft so as to conform to the textured workpiece. Furthermore, the layer has a dielectric constant such that it does not alter the normal operation of the underlying electrostatic clamp. In some embodiments, the locations of the ground and lift pins are moved to further reduce the leakage of backside gas.

    摘要翻译: 公开了一种更有效地冷却纹理工件的工件支撑件。 在工件支架的顶部添加一层。 该层足够柔软以符合纹理化的工件。 此外,该层具有介电常数,使得其不会改变下面的静电夹的正常操作。 在一些实施例中,移动地面和升降销的位置以进一步减少背侧气体的泄漏。

    Modulating implantation for improved workpiece splitting
    49.
    发明授权
    Modulating implantation for improved workpiece splitting 有权
    调整植入以改善工件分裂

    公开(公告)号:US08487280B2

    公开(公告)日:2013-07-16

    申请号:US12909225

    申请日:2010-10-21

    IPC分类号: G21K5/00

    CPC分类号: H01L21/76254 H01L21/26506

    摘要: A first species is implanted into an entire surface of a workpiece and helium is implanted into this entire surface with a non-uniform dose. The first species may be, for example, hydrogen, helium, or nitrogen. The helium has a higher dose at a portion of a periphery of the workpiece. When the workpiece is split, this split is initiated at the periphery with the higher dose. The non-uniform dose may be formed by altering a scan speed of the workpiece or an ion beam current of the helium. In one instance, the non-uniform dose of the helium is larger than a uniform dose of the hydrogen.

    摘要翻译: 将第一种植入植入工件的整个表面,并以不均匀的剂量将氦注入整个表面。 第一种可以是例如氢,氦或氮。 氦在工件周边的一部分具有更高的剂量。 当工件分裂时,该分裂在较高剂量的周边开始。 可以通过改变工件的扫描速度或氦的离子束电流来形成非均匀剂量。 在一种情况下,氦的不均匀剂量大于均匀剂量的氢。

    Technique for manufacturing a solar cell
    50.
    发明授权
    Technique for manufacturing a solar cell 有权
    太阳能电池制造技术

    公开(公告)号:US07816239B2

    公开(公告)日:2010-10-19

    申请号:US12581491

    申请日:2009-10-19

    IPC分类号: H01L21/04

    摘要: Techniques for manufacturing solar cells are disclosed. In one particular exemplary embodiment, the technique may comprise disposing a mask upstream of the solar cell, the mask comprising a plurality of filaments spaced apart from one another to define at least one aperture; directing a ribbon ion beam of desired species toward the solar cell to ion implant a portion of the solar cell defined by the at least one aperture of the mask; and orienting the ribbon ion beam such that longer cross-section dimension of the ribbon beam is perpendicular to the aperture in one plane.

    摘要翻译: 公开了制造太阳能电池的技术。 在一个特定的示例性实施例中,技术可以包括在太阳能电池的上游设置掩模,所述掩模包括彼此间隔开的多个细丝以限定至少一个孔; 将所需物质的带状离子束引向太阳能电池以离子注入由掩模的至少一个孔限定的太阳能电池的一部分; 并且使带状离子束定向成使得带状束的较长横截面尺寸垂直于一个平面中的孔。