Abstract:
A semiconductor memory device has a duty cycle correction circuit capable of outputting a duty cycle corrected clock and its inverted clock having substantially exactly 180° phase difference therebetween. The semiconductor memory device includes a duty cycle corrector configured to receive a first clock and a second clock to generate a first output clock and a second output clock whose duty cycle ratios are corrected in response to correction signals, and a clock edge detector configured to generate the correction signals corresponding to an interval between a reference transition timing of the first output clock and a reference transition timing of the second output clock.
Abstract:
An organic light emitting display device is disclosed. One embodiment of the organic light emitting display device includes a substrate member in which a plurality of pixel regions are arranged, and a plurality of thin film transistors which are formed on the pixels regions, respectively. The device also includes a data line which is arranged along one side edge of each of the pixel region and a common power source line which is arranged along the other side edge of each of the plurality of pixel regions and is substantially parallel to the data line. The device further includes a first pixel electrode which is electrically connected to one of the plurality of thin film transistors and is formed in each region of the pixel regions. The device also includes an organic film which is formed on the first pixel electrode, and a second pixel electrode which is formed on the organic film. One side edge of the first pixel electrode which is close to the data line is overlapped with the data line.
Abstract:
A photoalignment method includes irradiating light in a first direction to a first alignment layer, and irradiating light in a second direction opposite the first direction, after disposing a first mask on the first alignment layer.
Abstract:
In a display apparatus and a method of driving the same, an active period during which one pixel is turned on is divided into a red sub frame, a green sub frame, a blue sub frame, and a white sub frame. A controller compares a gray scale of a fourth image data corresponding to the white sub frame with a reference gray scale and compensates a first image data, a second image data, and a third image data corresponding to the red, green, and blue sub frames, respectively, in accordance with the comparison result.
Abstract:
A photoalignment material includes an alignment polymer, a photoalignment additive including a compound represented by the following Chemical Formula 1 and an organic solvent. In Chemical Formula 1, R1 represents a cyclic compound. A and B independently represent a single bond or —(CnH2n)—. “n” represents an integer in a range of 1 to 12. Each —CH2— of A and/or B may be replaced with R3 represents an alkyl group having 1 to 12 carbon atoms, and each —CH2— of A and/or B may be replaced with —O—. R4 represents In Chemical Formula 1, each hydrogen atom excluding hydrogen atoms of R4 may be replaced with chlorine (Cl) or fluorine (F).
Abstract translation:光取向材料包括取向聚合物,包含由以下化学式1表示的化合物和有机溶剂的光对准添加剂。 在化学式1中,R 1表示环状化合物。 A和B独立地表示单键或 - (C n H 2n) - 。 n表示1至12范围内的整数.A和/或B的每个-CH 2可以被R 3代替,R 3表示具有1至12个碳原子的烷基,A和/或B的每个-CH 2可以 用-O-代替。 R4表示在化学式1中,除了R4的氢原子以外的各个氢原子可以被氯(Cl)或氟(F)代替。
Abstract:
A rail-to-rail amplifier includes an NMOS type amplification unit configured to perform an amplification operation on differential input signals in a domain in which DC levels of the differential input signals are higher than a first threshold value, a PMOS type folded-cascode amplification unit configured to perform an amplification operation on the differential input signals in a domain in which the DC levels of the differential input signals are lower than a second threshold value which is higher than the first threshold value, the PMOS type folded-cascode amplification unit being cascade-coupled to the NMOS type amplification unit, and an adaptive biasing unit configured to interrupt a current path of the PMOS type folded-cascode amplification unit in a domain in which the DC levels of the differential input signals are higher than the second threshold value in response to the differential input signals.
Abstract:
In a optically compensated bend (OCB) liquid crystal display, an impulsive voltage is applied to a pixel between applications of normal data voltages for displaying an image, and the impulsive voltage and the normal data voltage are controlled to prevent breaking of the bending alignment of the (OCB) liquid crystals. Accordingly, luminance of the liquid crystal display can be improved.When the normal data voltage of 0V is applied, the impulsive voltage at which the bending alignment of OCB liquid crystal is broken is set to the impulsive voltage at (for, corresponding to) the highest gray. There occurs a broken region (0-VB) where the bending alignment of the OCB liquid crystal is broken at a predetermined range that is higher than 0V. A voltage that is higher than the highest voltage (VB) of the broken region is set to a white voltage. Accordingly, luminance of the OCB liquid crystal display can be enhanced.
Abstract:
A latch circuit includes a data input/output unit configured to form a current path through a first node in response to an input data to output an output data, a holding unit configured to form a current path through a second node in response to the output data to store the output data, and a clock input unit coupled to the first and second nodes in parallel in response to a clock.
Abstract:
A semiconductor device including an edge synchronizer which outputs a synchronized strobe signal generated by synchronizing a transition time point of a strobe signal with clock edges of a main clock or a sub clock, a detector which outputs a phase determination signal indicating a phase difference between the main clock and the sub clock in response to the synchronized strobe signal, and a duty ratio corrector which adjusts a duty ratio of the main clock and the sub clock in response to the phase determination signal.
Abstract:
The present invention relates to a semiconductor packaging method. The method comprises (S1) applying a die adhesive to an upper surface of a member through screen-printing; (S2) B-stage curing the member having the die adhesive; (S3) attaching a die on the B-stage cured die adhesive; (S4) wire-bonding the die to the member; and (S5) encapsulating the outside of the resultant, after the B-stage curing process of the step S2, a degree of cure of the die adhesive shows a decrease in heat capacity by 80 to 100%, and the step S3 is performed such that the die adhesive maintains an adhesive strength of 10 kgf/cm2 or more at normal temperature after the die attaching.