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公开(公告)号：US20160274036A1
公开(公告)日：2016-09-22
申请号：US15067118
申请日：2016-03-10
Applicant: KLA-Tencor Corporation
Inventor： Martin Plihal
CPC classification number: G03F7/7065 , H01L22/12 , H01L22/20
Abstract: Methods and systems for determining a process window for a process performed on a specimen are provided. In general, the embodiments preferentially sample locations in an instance of at least a portion of a device formed on a specimen at a value of a parameter of a process performed on the specimen that is closest to an edge of a determined process window for the process. If defects are detected at the sampled locations, then the sampling may be performed again but for a different instance of the device formed at a value of the parameter that is closer to nominal than the previously used value. When no defects are detected at the sampled locations, then the sampling may be ended, and the determined process window may be modified based on the value of the parameter corresponding to the instance of the device in which no defects were detected.
Abstract translation: 提供了用于确定对样本进行的处理的处理窗口的方法和系统。 通常，实施例优选地在形成在样本上的装置的至少一部分的情况下以在最接近所确定的处理窗口的边缘的样本上执行的处理的参数的值来采样位置 。 如果在采样位置处检测到缺陷，则可以再次执行采样，但是对于在比该先前使用的值更接近标称值的参数值处形成的设备的不同实例。 当在采样位置没有检测到缺陷时，可以结束采样，并且可以基于与其中没有检测到缺陷的设备的实例相对应的参数的值来修改所确定的处理窗口。
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Patent Agency Ranking
公开(公告)号：US09430743B2
公开(公告)日：2016-08-30
申请号：US14637242
申请日：2015-03-03
Applicant: KLA-Tencor Corporation
Inventor： Martin Plihal
CPC classification number: G06N99/005 , G06N5/025 , G06T7/001 , G06T2207/10061 , G06T2207/20081 , G06T2207/30148
Abstract: Methods and systems for classifying defects detected on a wafer are provided. One method includes inputting information for defects detected on a wafer into each of at least two defect classifiers included in a composite defect classifier. Such a method also includes, for at least one of the defects that is assigned to two or more bins in the composite defect classifier, determining a bin for the at least one of the defects based on a rank assigned to the two or more bins. The rank is assigned to the two or more bins based on one or more characteristics determined for the two or more bins, and the one or more characteristics are determined based on a comparison of predetermined defect classifications for defects in a training set and defect classifications determined for the defects in the training set by the at least two defect classifiers.
Abstract translation: 提供了用于分类在晶片上检测到的缺陷的方法和系统。 一种方法包括将在晶片上检测到的缺陷的信息输入到复合缺陷分类器中包括的至少两个缺陷分类器中的每一个中。 这种方法还包括对于分配给复合缺陷分类器中的两个或更多个箱的至少一个缺陷，基于分配给两个或多个箱的等级来确定所述至少一个缺陷的仓。 基于为两个或多个箱确定的一个或多个特性将等级分配给两个或更多个箱，并且基于针对训练集中的缺陷的预定缺陷分类和确定的缺陷分类的比较来确定一个或多个特性 对于由至少两个缺陷分类器设置的训练中的缺陷。
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公开(公告)号：US20160123898A1
公开(公告)日：2016-05-05
申请号：US14931226
申请日：2015-11-03
Applicant: KLA-Tencor Corporation
Inventor： Hong Chen , Kenong Wu , Martin Plihal , Vidur Pandita , Ravikumar Sanapala , Vivek Bhagat , Rahul Lakhawat , Oksen Baris , Rajesh Ramachandran , Naoshin Haque
IPC: G01N21/95
CPC classification number: H01J37/28 , G01N21/8851 , G01N21/9501 , G01N2021/8854 , G01N2021/8883 , G03F7/70625 , G03F7/7065 , H01J2237/24592
Abstract: Systems and methods for discovering defects on a wafer are provided. One method includes detecting defects on a wafer by applying a threshold to output generated by a detector in a first scan of the wafer and determining values for features of the detected defects. The method also includes automatically ranking the features, identifying feature cut-lines to group the defect into bins, and, for each of the bins, determining one or more parameters that if applied to the values for the features of the defects in each of the bins will result in a predetermined number of the defects in each of the bins. The method also includes applying the one or more determined parameters to the output generated by the detector in a second scan of the wafer to generate a defect population that has a predetermined defect count and is diversified in the values for the features.
Abstract translation: 提供了发现晶片缺陷的系统和方法。 一种方法包括通过在晶片的第一次扫描中施加由检测器产生的输出的阈值来检测晶片上的缺陷，并确定检测到的缺陷的特征的值。 该方法还包括对特征进行自动排序，识别特征切割线以将缺陷分组成箱，并且对于每个箱，确定一个或多个参数，如果应用于每个中的缺陷的特征的值 箱将导致每个箱中预定数量的缺陷。 该方法还包括将一个或多个确定的参数应用于在晶片的第二次扫描中由检测器产生的输出，以产生具有预定缺陷计数并且在特征值中多样化的缺陷群体。
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公开(公告)号：US20150276618A1
公开(公告)日：2015-10-01
申请号：US14666942
申请日：2015-03-24
Applicant: KLA-Tencor Corporation
Inventor： Martin Plihal , Ankit Jain , Michael Lennek
CPC classification number: H01L22/12 , G01N21/8851 , G01N21/9501 , G01N2021/8877 , G01N2201/063 , G01N2201/12 , H01L22/20
Abstract: Methods and systems for generating defect samples are provided. One method includes identifying a set of defects detected on a wafer having the most diversity in values of at least one defect attribute and generating different tiles for different defects in the set. The tiles define a portion of all values for the at least one attribute of all defects detected on the wafer that are closer to the values for the at least one attribute of their corresponding defects than the values for the at least one attribute of other defects. In addition, the method includes separating the defects on the wafer into sample bins corresponding to the different tiles based on their values of the at least one attribute, randomly selecting defect(s) from each of two or more of the sample bins, and creating a defect sample for the wafer that includes the randomly selected defects.
Abstract translation: 提供了生成缺陷样本的方法和系统。 一种方法包括识别在具有至少一个缺陷属性值的多样性最大的晶片上检测到的一组缺陷，并为该组中的不同缺陷生成不同的瓦片。 瓦片定义了在晶片上检测到的所有缺陷的至少一个属性的所有值的一部分，其比其它缺陷的至少一个属性的值更接近于其相应缺陷的至少一个属性的值。 另外，该方法包括：基于它们的至少一个属性值，从两个或多个样本仓中的每一个中随机选择缺陷，将晶片上的缺陷分离成与不同瓦片对应的样品仓，并创建 用于晶片的缺陷样品，其包括随机选择的缺陷。
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公开(公告)号：US20150262038A1
公开(公告)日：2015-09-17
申请号：US14505446
申请日：2014-10-02
Applicant: KLA-Tencor Corporation
Inventor： Raghavan Konuru , Naema Bhatti , Michael Lennek , Martin Plihal
CPC classification number: G06T7/0004 , G06K9/6254 , G06K9/6282 , G06K2209/19
Abstract: Methods and systems for setting up a classifier for defects detected on a wafer are provided. One method includes generating a template for a defect classifier for defects detected on a wafer and applying the template to a training data set. The training data set includes information for defects detected on the wafer or another wafer. The method also includes determining one or more parameters for the defect classifier based on results of the applying step.
Abstract translation: 提供了用于设置在晶片上检测到的缺陷的分类器的方法和系统。 一种方法包括为在晶片上检测到的缺陷生成用于缺陷分类器的模板并将模板应用于训练数据集。 训练数据集包括在晶片或另一晶片上检测到的缺陷的信息。 该方法还包括基于应用步骤的结果确定缺陷分类器的一个或多个参数。
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公开(公告)号：US20150254832A1
公开(公告)日：2015-09-10
申请号：US14637242
申请日：2015-03-03
Applicant: KLA-Tencor Corporation
Inventor： Martin Plihal
CPC classification number: G06N99/005 , G06N5/025 , G06T7/001 , G06T2207/10061 , G06T2207/20081 , G06T2207/30148
Abstract: Methods and systems for classifying defects detected on a wafer are provided. One method includes inputting information for defects detected on a wafer into each of at least two defect classifiers included in a composite defect classifier. Such a method also includes, for at least one of the defects that is assigned to two or more bins in the composite defect classifier, determining a bin for the at least one of the defects based on a rank assigned to the two or more bins. The rank is assigned to the two or more bins based on one or more characteristics determined for the two or more bins, and the one or more characteristics are determined based on a comparison of predetermined defect classifications for defects in a training set and defect classifications determined for the defects in the training set by the at least two defect classifiers.
Abstract translation: 提供了用于分类在晶片上检测到的缺陷的方法和系统。 一种方法包括将在晶片上检测到的缺陷的信息输入到复合缺陷分类器中包括的至少两个缺陷分类器中的每一个中。 这种方法还包括对于分配给复合缺陷分类器中的两个或更多个箱的至少一个缺陷，基于分配给两个或多个箱的等级来确定所述至少一个缺陷的仓。 基于为两个或多个箱确定的一个或多个特性将等级分配给两个或更多个箱，并且基于针对训练集中的缺陷的预定缺陷分类和确定的缺陷分类的比较来确定一个或多个特性 对于由至少两个缺陷分类器设置的训练中的缺陷。
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