APPARATUS FOR AND METHOD OF PROCESSING SUBSTRATE
    41.
    发明申请
    APPARATUS FOR AND METHOD OF PROCESSING SUBSTRATE 审中-公开
    装置和处理基板的方法

    公开(公告)号:US20090070946A1

    公开(公告)日:2009-03-19

    申请号:US12211549

    申请日:2008-09-16

    IPC分类号: B08B3/04 B08B3/12

    摘要: A cleaning processing part including an edge cleaning processing unit for cleaning an edge of a substrate is provided in an indexer block. An indexer robot provided in the indexer block transports an unprocessed substrate taken out of a cassette to the cleaning processing part before transporting the unprocessed substrate to an anti-reflection film processing block serving as a processor. The cleaning processing part cleans an edge and a back surface of a substrate.

    摘要翻译: 在分度块中设置有包括用于清洁基板的边缘的边缘清洁处理单元的清洁处理部。 设置在分度器块中的分度器机器人将将未处理的基板输送到用作处理器的防反射膜处理块之前,将从盒中取出的未处理基板输送到清洁处理部。 清洁处理部件清洁基板的边缘和背面。

    EPDM COMPOSITION
    42.
    发明申请
    EPDM COMPOSITION 审中-公开
    EPDM组合物

    公开(公告)号:US20130251507A1

    公开(公告)日:2013-09-26

    申请号:US13991259

    申请日:2011-11-29

    IPC分类号: C09K3/10 F04B15/00

    摘要: Disclosed is an EPDM composition for molding sealing materials, containing a plasticizer; the plasticizer being a paraffinic oil or naphthenic oil in which the absolute value of the difference between its SP value (solubility parameter; determined by Small's formula) and the SP value of EPDM is 0.3 (cal/cm3)1/2 or less; and the composition being free of an ether ester plasticizer. The EPDM composition for molding sealing materials has the following excellent effects. Because a paraffinic oil or naphthenic oil that is compatible with EPDM and has an absolute value of the difference between its SP value and the SP value of EPDM of 0.3 (cal/cm3)1/2 or less is used as the plasticizer, a peroxide crosslinked product of the EPDM composition does not form defects that cause the starting point of blisters even when it is subjected to extraction by being brought into contact with HFO-1234yf. Accordingly, the peroxide crosslinked product, when used as a sealing material, particularly a compressor sealing material, exhibits excellent blister resistance to a hydrofluoroolefin refrigerant, such as HFO-1234yf.

    摘要翻译: 公开了一种用于模塑包含增塑剂的密封材料的EPDM组合物; 增塑剂是其SP值(溶解度参数;由Small公式测定)与EPDM的SP值之差的绝对值为0.3(cal / cm 3)1/2以下的石蜡油或环烷油; 并且该组合物不含醚酯增塑剂。 用于模制密封材料的EPDM组合物具有以下优异的效果。 由于使用与EPDM相容并且其SP值与EPDM的SP值的绝对值为0.3(cal / cm 3)1/2以下的石蜡油或环烷油作为增塑剂,因此使用过氧化物 EPDM组合物的交联产物即使在通过与HFO-1234yf接触进行萃取时也不会形成引起起泡点的缺陷。 因此,当用作密封材料的过氧化物交联产物,特别是压缩机密封材料时,对HFO-1234yf等氢氟烯烃制冷剂具有优异的耐起泡性。

    Substrate treatment method and substrate treatment apparatus
    43.
    发明授权
    Substrate treatment method and substrate treatment apparatus 有权
    基板处理方法和基板处理装置

    公开(公告)号:US07600522B2

    公开(公告)日:2009-10-13

    申请号:US12397632

    申请日:2009-03-04

    IPC分类号: B08B3/00

    CPC分类号: H01L21/02052 H01L21/67051

    摘要: A substrate treatment method including the steps of: generating droplets of a treatment liquid by mixing the treatment liquid with a gas; and causing the treatment liquid droplets generated in the liquid droplet generating step to impinge on a surface of a substrate being treated. The treatment liquid droplets have a volume median diameter of 5 μm to 40 μm.

    摘要翻译: 一种基板处理方法,包括以下步骤:通过将处理液与气体混合来产生处理液的液滴; 并且使得在液滴产生步骤中产生的处理液滴撞击正被处理的基板的表面。 处理液滴的体积中值粒径为5〜40μm。

    Substrate treating method and apparatus
    46.
    发明申请
    Substrate treating method and apparatus 审中-公开
    基板处理方法及装置

    公开(公告)号:US20050229946A1

    公开(公告)日:2005-10-20

    申请号:US11157330

    申请日:2005-06-15

    摘要: A substrate treating method for cleaning a substrate by supplying a cleaning solution thereto. The method comprises the steps of supplying the cleaning solution having ozone dissolved therein to the substrate, and irradiating the cleaning solution with ultraviolet light. By irradiating the cleaning solution having ozone dissolved therein with ultraviolet light, oxygen radicals are generated easily to increase the activity of the cleaning solution. Thus, a significantly improved cleaning capability is achieved even with low concentration ozone water. This method is applicable also to a piecemeal treatment for cleaning large substrates. Since the cleaning solution supplied to the substrate contains ozone in a low concentration, a filter and piping materials for supplying the cleaning solution need not have strong ozone resistance.

    摘要翻译: 一种用于通过向其提供清洁溶液来清洁基板的基板处理方法。 该方法包括以下步骤:将具有溶解在其中的臭氧的清洗溶液供给到基板上,并用紫外线照射清洗液。 通过用紫外线照射其中溶解有臭氧的清洁溶液,容易产生氧自由基以增加清洁溶液的活性。 因此,即使使用低浓度臭氧水也可实现显着改善的清洗能力。 该方法也适用于清洗大基材的零碎处理。 由于供给到基板的清洗液含有低浓度的臭氧,所以用于供给清洗液的过滤器和管道材料不需要具有很强的耐臭氧性。

    Substrate cleaning apparatus
    47.
    发明授权
    Substrate cleaning apparatus 有权
    基材清洗装置

    公开(公告)号:US06901938B2

    公开(公告)日:2005-06-07

    申请号:US10699671

    申请日:2003-11-04

    IPC分类号: B08B1/04 B08B3/02 H01L21/00

    摘要: The substrate processing apparatus is provided with a gas-liquid mixing nozzle for generating a gas-liquid mixture by mixing a liquid and a pressurized gas, to discharge the gas-liquid mixture to a substrate at high speeds. The mixture process is conducted in an open space out of the nozzle, and change in the supply pressure of the gas does not affect the supply of the liquid. The reaction products which having been generated on the substrate in etching process is removed at high speeds with the flow of the gas-liquid mixture, whereby the quality of the process is improved.

    摘要翻译: 基板处理装置设置有气液混合喷嘴,用于通过混合液体和加压气体来产生气液混合物,以高速将气液混合物排放到基板。 混合过程在喷嘴外的开放空间中进行,并且气体的供应压力的变化不影响液体的供应。 在气相 - 液体混合物的流动下,高速地除去在蚀刻工艺中在基板上产生的反应产物,从而提高了工艺的质量。

    Substrate cleaning apparatus
    48.
    发明授权
    Substrate cleaning apparatus 有权
    基材清洗装置

    公开(公告)号:US06705331B2

    公开(公告)日:2004-03-16

    申请号:US09987270

    申请日:2001-11-14

    IPC分类号: B09B302

    摘要: The substrate processing apparatus is provided with a gas-liquid mixing nozzle for generating a gas-liquid mixture by mixing a liquid and a pressurized gas, to discharge the gas-liquid mixture to a substrate at high speeds. The mixture process is conducted in an open space out of the nozzle, and change in the supply pressure of the gas does not affect the supply of the liquid. The reaction products which having been generated on the substrate in etching process is removed at high speeds with the flow of the gas-liquid mixture, whereby the quality of the process is improved.

    摘要翻译: 基板处理装置设置有气液混合喷嘴,用于通过混合液体和加压气体来产生气液混合物,以高速将气液混合物排放到基板。 混合过程在喷嘴外的开放空间中进行,并且气体的供应压力的变化不影响液体的供应。 在气相 - 液体混合物的流动下,高速地除去在蚀刻工艺中在基板上产生的反应产物,从而提高了工艺的质量。

    SUBSTRATE TREATMENT METHOD AND SUBSTRATE TREATMENT APPARATUS
    50.
    发明申请
    SUBSTRATE TREATMENT METHOD AND SUBSTRATE TREATMENT APPARATUS 有权
    基板处理方法和基板处理装置

    公开(公告)号:US20090165828A1

    公开(公告)日:2009-07-02

    申请号:US12397632

    申请日:2009-03-04

    IPC分类号: B08B3/02

    CPC分类号: H01L21/02052 H01L21/67051

    摘要: A substrate treatment method including the steps of: generating droplets of a treatment liquid by mixing the treatment liquid with a gas; and causing the treatment liquid droplets generated in the liquid droplet generating step to impinge on a surface of a substrate being treated. The treatment liquid droplets have a volume median diameter of 5 μm to 40 μm.

    摘要翻译: 一种基板处理方法,包括以下步骤:通过将处理液与气体混合来产生处理液的液滴; 并且使得在液滴产生步骤中产生的处理液滴撞击正被处理的基板的表面。 处理液滴的体积中值粒径为5〜40μm。