公开(公告)号：US08035116B2

公开(公告)日：2011-10-11

申请号：US11896829

申请日：2007-09-06

Applicant: Mitsuhiko Ogihara ,  Hiroyuki Fujiwara ,  Masataka Muto ,  Takahito Suzuki ,  Tomoki Igari

Inventor： Mitsuhiko Ogihara ,  Hiroyuki Fujiwara ,  Masataka Muto ,  Takahito Suzuki ,  Tomoki Igari

IPC: H01L29/18

CPC classification number: G03G15/326 ,  B41J2/45 ,  G03G15/04054 ,  G03G2215/0409 ,  H01L27/153

Abstract: A semiconductor device includes a substrate; a first conductive type semiconductor layer disposed on a main surface of the substrate; a second conductive type semiconductor layer disposed on the first conductive type semiconductor layer; a plurality of light emitting elements; and a second conductive side wiring pattern for commonly connecting the second conductive type semiconductor layer in the light emitting elements arranged adjacently. The second conductive type semiconductor layer includes a first conductive type semiconductor connection surface and a second conductive type semiconductor connection surface between the first conductive type semiconductor layer.

Abstract translation: 半导体器件包括衬底; 设置在所述基板的主表面上的第一导电型半导体层; 设置在所述第一导电型半导体层上的第二导电型半导体层; 多个发光元件; 以及用于共同连接相邻布置的发光元件中的第二导电类型半导体层的第二导电侧布线图案。 第二导电型半导体层包括第一导电型半导体连接面和第一导电型半导体层之间的第二导电型半导体连接面。

公开(公告)号：US07893455B2

公开(公告)日：2011-02-22

申请号：US11738557

申请日：2007-04-23

Applicant: Mitsuhiko Ogihara ,  Hiroyuki Fujiwara ,  Masataka Muto ,  Tomoki Igari ,  Hiroshi Kurokawa

Inventor： Mitsuhiko Ogihara ,  Hiroyuki Fujiwara ,  Masataka Muto ,  Tomoki Igari ,  Hiroshi Kurokawa

IPC: H01L29/24 ,  H01L23/48

CPC classification number: B41J2/451 ,  H01L33/38 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An inclined surface having an inclination angle θ is formed in an edge portion which forms an opening portion of an inter-layer insulating film, thereby reducing a stress by the inclined surface.

Abstract translation: 具有倾斜角度的倾斜表面; 形成在形成层间绝缘膜的开口部的边缘部，由此减小倾斜面的应力。

公开(公告)号：US20070222077A1

公开(公告)日：2007-09-27

申请号：US11690907

申请日：2007-03-26

Applicant: Mitsuhiko Ogihara ,  Hiroyuki Fujiwara ,  Masataka Muto ,  Tomohiko Sagimori ,  Tomoki Igari

Inventor： Mitsuhiko Ogihara ,  Hiroyuki Fujiwara ,  Masataka Muto ,  Tomohiko Sagimori ,  Tomoki Igari

IPC: H01L23/52 ,  H01L23/48 ,  H01L29/40

CPC classification number: H01L27/15 ,  B41J2/45 ,  H01L25/0753 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A composite semiconductor device includes a substrate, a plurality of circuits, a semiconductor thin film layer, and a dummy pattern. The circuits are formed on the substrate, and include one or more wiring layers. The semiconductor thin film layer includes semiconductor elements and is disposed on an uppermost surface of the one or more layers. A dummy pattern is formed in an area where the one or more wiring layers are absent. A spin-coated layer is formed between the semiconductor thin film layer and the wiring layers. The spin-coated layer may be formed of an organic material or an oxide material.

Abstract translation: 复合半导体器件包括衬底，多个电路，半导体薄膜层和虚设图案。 电路形成在基板上，并且包括一个或多个布线层。 半导体薄膜层包括半导体元件，并且设置在一个或多个层的最上表面上。 在一个或多个布线层不存在的区域中形成虚设图案。 在半导体薄膜层和布线层之间形成旋涂层。 旋涂层可以由有机材料或氧化物材料形成。

公开(公告)号：US08906250B2

公开(公告)日：2014-12-09

申请号：US12744285

申请日：2008-11-20

Applicant: Masato Kaneko ,  Harutomo Ikeda ,  Tokue Sato ,  Takayuki Kato ,  Takahiro Hoshida ,  Masato Takamatsu ,  Masahiro Suzuki ,  Shuichi Yasuda ,  Masataka Muto ,  Shozo Ikejima ,  Masahito Yamashita

Inventor： Masato Kaneko ,  Harutomo Ikeda ,  Tokue Sato ,  Takayuki Kato ,  Takahiro Hoshida ,  Masato Takamatsu ,  Masahiro Suzuki ,  Shuichi Yasuda ,  Masataka Muto ,  Shozo Ikejima ,  Masahito Yamashita

IPC: C09K5/04 ,  C10M107/24 ,  C10M107/34 ,  C10M145/26

CPC classification number: C09K5/045 ,  C09K2205/112 ,  C09K2205/126 ,  C10M107/24 ,  C10M107/34 ,  C10M145/26 ,  C10M171/008 ,  C10M2207/026 ,  C10M2207/0406 ,  C10M2207/042 ,  C10M2209/043 ,  C10M2209/104 ,  C10M2209/1055 ,  C10M2209/1075 ,  C10M2209/108 ,  C10M2209/1085 ,  C10M2223/041 ,  C10N2220/022 ,  C10N2220/302 ,  C10N2230/66 ,  C10N2240/30 ,  C10N2280/00

Abstract: A lubricating oil composition for refrigerator including a base oil and an acid scavenger, and a compressor using the composition are provided, where the acid scavenger is a polyalkylene glycol derivative represented by a formula (1) as follows: R1—[(OR2)e—OR3]f  (1) and the base oil is at least one compound selected from a group consisting of polyvinyl ether, polyalkylene glycol and an ether-base compound represented by a formula (2) as follows, Ra-[(ORb)n-(X)—(ORc)k]x-Rd  (2) where meanings of respective signs are as described in the specification.

Abstract translation: 提供了一种含有基础油和酸清除剂的冷冻机用润滑油组合物和使用该组合物的压缩机，其中，除酸剂为式（1）所示的聚亚烷基二醇衍生物，如下：R1 - [（OR2）e -OR3] f（1），基油是选自聚乙烯醚，聚亚烷基二醇和由式（2）表示的醚基化合物如下的至少一种化合物：Ra - [（ORb）n - （X） - （ORc）k] x-Rd（2）其中各符号的含义如说明书中所述。

公开(公告)号：US07847298B2

公开(公告)日：2010-12-07

申请号：US11363477

申请日：2006-02-27

Applicant: Mitsuhiko Ogihara ,  Masataka Muto ,  Tomoki Igari ,  Takahito Suzuki

Inventor： Mitsuhiko Ogihara ,  Masataka Muto ,  Tomoki Igari ,  Takahito Suzuki

IPC: H01L27/15

CPC classification number: H01L33/0079 ,  G03G15/04054 ,  G03G15/326 ,  G03G2215/0409 ,  H01L24/24 ,  H01L24/25 ,  H01L27/153 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/49175 ,  H01L2224/73267 ,  H01L2924/01322 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A semiconductor composite apparatus includes a substrate and a planarizing layer, and a semiconductor thin film. The planarizing layer is formed on the substrate either directly or indirectly. The planarizing layer includes a first surface that faces the substrate, and a second surface that is on the side of the planarizing layer remote from the substrate. The semiconductor thin film formed on the planarizing layer. The second surface has a roughness of not more than 5 nm.

Abstract translation: 半导体复合装置包括基板和平坦化层以及半导体薄膜。 平坦化层直接或间接地形成在基板上。 平坦化层包括面向衬底的第一表面和位于平坦化层远离衬底的一侧的第二表面。 形成在平坦化层上的半导体薄膜。 第二表面的粗糙度不超过5nm。

公开(公告)号：US20100244054A1

公开(公告)日：2010-09-30

申请号：US12730826

申请日：2010-03-24

Applicant: Mitsuhiko OGIHARA ,  Tomohiko SAGIMORI ,  Takahito SUZUKI ,  Masataka MUTO

Inventor： Mitsuhiko OGIHARA ,  Tomohiko SAGIMORI ,  Takahito SUZUKI ,  Masataka MUTO

IPC: H01L33/16 ,  H01L21/30 ,  H01L29/04

CPC classification number: H01L33/02 ,  H01L25/046 ,  H01L25/0753 ,  H01L25/167 ,  H01L29/045 ,  H01L33/0079 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A method for manufacturing a semiconductor device, includes: a step of etching a Si (111) substrate along a (111) plane of the Si (111) substrate to separate a Si (111) thin-film device having a separated surface along the (111) plane.

Abstract translation: 一种制造半导体器件的方法，包括：沿着Si（111）衬底的（111）面刻蚀Si（111）衬底以分离具有分离表面的Si（111）薄膜器件的步骤， （111）面。

公开(公告)号：US20100175421A1

公开(公告)日：2010-07-15

申请号：US12663941

申请日：2008-06-12

Applicant: Masato Kaneko ,  Harutomo Ikeda ,  Takayuki Kato ,  Takahiro Hoshida ,  Masaki Inoue ,  Shozo Ikejima ,  Masataka Muto ,  Masahito Yamashita

Inventor： Masato Kaneko ,  Harutomo Ikeda ,  Takayuki Kato ,  Takahiro Hoshida ,  Masaki Inoue ,  Shozo Ikejima ,  Masataka Muto ,  Masahito Yamashita

IPC: F25B43/00 ,  C10M105/10

CPC classification number: C09K5/045 ,  C09K2205/126 ,  C10M107/34 ,  C10M171/008 ,  C10M2209/1033 ,  C10M2209/1045 ,  C10M2209/1055 ,  C10M2209/1065 ,  C10M2209/1075 ,  C10M2209/1085 ,  C10N2220/021 ,  C10N2220/022 ,  C10N2220/032 ,  C10N2230/08 ,  C10N2240/30

Abstract: Provided is a lubricant composition for a refrigerator, which is characterized by using a substance mainly containing a polyoxyalkylene glycol derivative and having a hydroxyl number of 5 mgKOH/g or less, as a base oil. Also provided is a compressor using such the lubricant composition for a refrigerator. The lubricant composition for a refrigerator is used for a refrigerator which uses a refrigerant having a specific structure such as an unsaturated fluorohydrocarbon and being usable in current air-conditioning systems for cars or the like. The lubricant composition for a refrigerator exhibits excellent compatibility with the refrigerant, while having excellent stability. The compressor uses such the lubricant composition for a refrigerator.

Abstract translation: 本发明提供一种冷冻机用润滑剂组合物，其特征在于使用主要含有聚氧亚烷基二醇衍生物的羟基数为5mgKOH / g以下的物质作为基础油。 还提供了使用这种用于冰箱的润滑剂组合物的压缩机。 用于冰箱的润滑剂组合物用于使用具有特定结构的制冷剂如不饱和氟代烃并可用于汽车等的当前空调系统中的冰箱。 用于冷冻机的润滑剂组合物与制冷剂具有优异的相容性，同时具有优异的稳定性。 压缩机使用这种用于冰箱的润滑剂组合物。

公开(公告)号：US20060197102A1

公开(公告)日：2006-09-07

申请号：US11363477

申请日：2006-02-27

Applicant: Mitsuhiko Ogihara ,  Masataka Muto ,  Tomoki Igari ,  Takahito Suzuki

Inventor： Mitsuhiko Ogihara ,  Masataka Muto ,  Tomoki Igari ,  Takahito Suzuki

IPC: H01L33/00 ,  H01L29/08

CPC classification number: H01L33/0079 ,  G03G15/04054 ,  G03G15/326 ,  G03G2215/0409 ,  H01L24/24 ,  H01L24/25 ,  H01L27/153 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/49175 ,  H01L2224/73267 ,  H01L2924/01322 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A semiconductor composite apparatus includes a substrate and a planarizing layer, and a semiconductor thin film. The planarizing layer is formed on the substrate either directly or indirectly. The planarizing layer includes a first surface that faces the substrate, and a second surface that is on the side of the planarizing layer remote from the substrate. The semiconductor thin film formed on the planarizing layer. The second surface has a roughness of not more than 5 nm.

Abstract translation: 半导体复合装置包括基板和平坦化层以及半导体薄膜。 平坦化层直接或间接地形成在基板上。 平坦化层包括面向衬底的第一表面和位于平坦化层远离衬底的一侧的第二表面。 形成在平坦化层上的半导体薄膜。 第二表面的粗糙度不大于5nm。

公开(公告)号：US08703662B2

公开(公告)日：2014-04-22

申请号：US12595693

申请日：2008-04-18

Applicant: Masato Kaneko ,  Harutomo Ikeda ,  Takayuki Kato ,  Takahiro Hoshida ,  Masaki Inoue ,  Shozo Ikejima ,  Masataka Muto ,  Masahito Yamashita

Inventor： Masato Kaneko ,  Harutomo Ikeda ,  Takayuki Kato ,  Takahiro Hoshida ,  Masaki Inoue ,  Shozo Ikejima ,  Masataka Muto ,  Masahito Yamashita

IPC: C10M169/04 ,  F25B43/02 ,  C09K5/00

CPC classification number: F04B39/02 ,  C10M105/38 ,  C10M171/008 ,  C10M2201/0413 ,  C10M2201/0603 ,  C10M2207/026 ,  C10M2207/2835 ,  C10M2209/1033 ,  C10M2213/0623 ,  C10M2217/0403 ,  C10M2221/003 ,  C10N2210/04 ,  C10N2210/06 ,  C10N2210/08 ,  C10N2220/021 ,  C10N2220/022 ,  C10N2220/30 ,  C10N2220/301 ,  C10N2220/302 ,  C10N2230/06 ,  C10N2230/10 ,  C10N2230/40 ,  F04B39/0215 ,  F04B53/18

Abstract: A lubricating oil composition for refrigerators comprising a base oil which comprises as a main component a polyol ester compound obtained from a polyhydric alcohol selected from among pentaerythritol, dipentaerythritol, trimethylolpropane, and neopentyl glycol and a C4 to C20 aliphatic monocarboxylic acid and which has an acid value of 0.02 mgKOH/g or less and a hydroxyl value of 5 mgKOH/g or less. A compressor using the lubricating composition. The lubricating oil composition is applicable to such refrigerators that use a refrigerant having a specific structure, such as an unsaturated fluorinated hydrocarbon compound, and being usable in current car air conditioner systems, and has excellent compatibility with the refrigerant, good sealing properties, capability of imparting a low coefficient of friction to sliding members and, yet, excellent stability. The compressor uses the lubricating composition.

Abstract translation: 一种冰箱用润滑油组合物，其特征在于，含有基油，所述基油含有由季戊四醇，二季戊四醇，三羟甲基丙烷，新戊二醇等多元醇得到的多元醇酯化合物和C4〜C20脂肪族一元羧酸作为主要成分， 值为0.02mgKOH / g以下，羟基值为5mgKOH / g以下。 使用润滑组合物的压缩机。 润滑油组合物适用于使用具有特定结构的制冷剂，例如不饱和氟化烃化合物的冰箱，并且可用于目前的汽车空调系统，并且与制冷剂具有优异的相容性，良好的密封性能， 赋予滑动构件低的摩擦系数，而且具有优异的稳定性。 压缩机使用润滑组合物。

公开(公告)号：US08415680B2

公开(公告)日：2013-04-09

申请号：US11385699

申请日：2006-03-22

Applicant: Mitsuhiko Ogihara ,  Hiroyuki Fujiwara ,  Masataka Muto ,  Takahito Suzuki ,  Tomoki Igari

Inventor： Mitsuhiko Ogihara ,  Hiroyuki Fujiwara ,  Masataka Muto ,  Takahito Suzuki ,  Tomoki Igari

IPC: H01L31/12

CPC classification number: B41J2/45 ,  H01L25/167 ,  H01L2224/48091 ,  H01L2224/48464 ,  H01L2924/00014

Abstract: A semiconductor composite apparatus, includes a first substrate, a semiconductor thin film layer, active devices, first driving circuits, and second driving circuits. The semiconductor thin film layer is formed on the first substrate and is formed of a first semiconductor material. The active devices are formed in the semiconductor thin film layer. The first driving circuits is formed of a second semiconductor material and performing a first function in which the active devices are driven. The second driving circuits are formed of a third semiconductor material and performing a second function in which the active devices are driven, the second function being different from the first function.

Abstract translation: 半导体复合设备包括第一衬底，半导体薄膜层，有源器件，第一驱动电路和第二驱动电路。 半导体薄膜层形成在第一基板上并由第一半导体材料形成。 有源器件形成在半导体薄膜层中。 第一驱动电路由第二半导体材料形成并且执行驱动有源器件的第一功能。 第二驱动电路由第三半导体材料形成，并且执行驱动有源器件的第二功能，第二功能不同于第一功能。