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公开(公告)号:US20140323946A1
公开(公告)日:2014-10-30
申请号:US14131564
申请日:2012-07-09
申请人: Frederic A. Bourke, JR. , Harold Walder , Zakaryae Fathi , Michael J. Therien , Mark W. Dewhirst , Ian N. Stanton , Jennifer Ann Ayres , Diane Renee Fels , Joseph A. Herbert
发明人: Frederic A. Bourke, JR. , Harold Walder , Zakaryae Fathi , Michael J. Therien , Mark W. Dewhirst , Ian N. Stanton , Jennifer Ann Ayres , Diane Renee Fels , Joseph A. Herbert
CPC分类号: A61N5/062 , A61K41/0085 , A61N5/0622 , A61N5/1077 , A61N2005/0661 , A61N2005/1091 , A61N2005/1098
摘要: A system and method for light stimulation within a medium. The system has a reduced-voltage x-ray source configured to generate x-rays from a peak applied cathode voltage at or below 105 kVp, and a plurality of energy-emitting particles in the medium which, upon radiation from the x-ray source, radiate at a first lower energy than the x-ray source to interact with at least one photoactivatable agent in the medium. The method introduces the plurality of energy-emitting particles into the medium, radiates the energy-emitting particles in the medium with x-rays generated from a peak applied cathode voltage at or below 105 kVp; and emits a lower energy than the x-ray source to interact with the medium or with at least one photoactivatable agent in the medium.
摘要翻译: 介质内光刺激的系统和方法。 该系统具有被配置为从等于或低于105kVp的施加阴极施加电压产生X射线的低电压x射线源,以及介质中的多个能量发射粒子,其在来自X射线源的辐射 以比x射线源低的能量辐射以与介质中的至少一种可光活化剂相互作用。 该方法将多个能量发射粒子引入到介质中,用等于或低于105kVp的施加阴极电压产生的x射线照射介质中的能量发射粒子; 并且发射比x射线源更低的能量以与介质或介质中的至少一种可光活化剂相互作用。
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公开(公告)号:US08834182B2
公开(公告)日:2014-09-16
申请号:US13573967
申请日:2012-10-17
申请人: James E. Clayton , Zakaryae Fathi
发明人: James E. Clayton , Zakaryae Fathi
IPC分类号: H01R12/00
摘要: An electrical interconnect system comprises: a flexible circuit having thereon a plurality of electrical contact pads; a contact strip comprising a plurality of electrical contacts aligned with respective pads on the flexible circuit; a compression member to engage the contacts with the pads; and, pierced areas on said pads to enhance the mechanical engagement between the contacts and the pads.
摘要翻译: 电互连系统包括:柔性电路,其上具有多个电接触焊盘; 接触条,包括与柔性电路上的相应焊盘对准的多个电触头; 压接构件,用于与所述垫接触; 以及在所述垫上的刺穿区域以增强触头和垫之间的机械接合。
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公开(公告)号:US20140106579A1
公开(公告)日:2014-04-17
申请号:US13573970
申请日:2012-10-17
申请人: James E. Clayton , Zakaryae Fathi
发明人: James E. Clayton , Zakaryae Fathi
CPC分类号: H01R12/77 , H01R13/627
摘要: An electrical interconnect system comprises: a clamping collar having a slot for receiving a bifurcated flexible circuit; a contact strip comprising a plurality of electrical contacts aligned with respective pads on the bifurcated flexible circuit when the legs of the bifurcated area are spread apart; and, a compression latch member to engage the clamping collar and compress the pads against their respective contacts on the contact strip.
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公开(公告)号:US20140106578A1
公开(公告)日:2014-04-17
申请号:US13573967
申请日:2012-10-17
申请人: James E. Clayton , Zakaryae Fathi
发明人: James E. Clayton , Zakaryae Fathi
摘要: An electrical interconnect system comprises: a flexible circuit having thereon a plurality of electrical contact pads; a contact strip comprising a plurality of electrical contacts aligned with respective pads on the flexible circuit; a compression member to engage the contacts with the pads; and, pierced areas on said pads to enhance the mechanical engagement between the contacts and the pads.
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公开(公告)号:US20140104776A1
公开(公告)日:2014-04-17
申请号:US13573976
申请日:2012-10-17
申请人: James E. Clayton , Zakaryae Fathi
发明人: James E. Clayton , Zakaryae Fathi
CPC分类号: G06F1/16 , G06F1/184 , G06F1/185 , H01R12/62 , H05K1/028 , H05K1/118 , H05K1/147 , H05K1/181 , H05K3/366 , H05K2201/046 , H05K2201/09481 , H05K2201/10159 , H05K2201/10189 , H05K2201/10409 , H05K2201/10545
摘要: An electrical interconnection system comprises a bifurcated, multilayer flex circuit having electrode pads on the inner surfaces of the bifurcation. Electronic components are mounted on one or both sides of the flex circuit by conventional means. When the bifurcation is spread apart, the electrode pads are alignable with respective contacts on a printed circuit board. After bonding the pads to the contacts by soldering, conductive adhesive, or other means, a secure electrical connection is maintained while still allowing the flex circuit to bend somewhat from side to side, creating additional design options not available with rigidly mounted components and modules.
摘要翻译: 电互连系统包括在分叉的内表面上具有电极焊盘的分叉的多层柔性电路。 电子部件通过常规方式安装在柔性电路的一侧或两侧。 当分叉分开时,电极焊盘可与印刷电路板上的各个触点对准。 在通过焊接,导电粘合剂或其他方式将焊盘接合到触点之后,保持牢固的电连接,同时仍然允许柔性电路从一侧到另一侧弯曲一些,从而产生不具有刚性安装的部件和模块的附加设计选项。
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公开(公告)号:US08692124B2
公开(公告)日:2014-04-08
申请号:US12927544
申请日:2010-11-17
申请人: James E. Clayton , Zakaryae Fathi
发明人: James E. Clayton , Zakaryae Fathi
IPC分类号: H05K1/00
CPC分类号: H05K1/118 , H01R12/79 , H05K1/117 , H05K3/363 , H05K3/4691 , H05K2201/09181
摘要: An electrical connector comprises an elongated flexible circuit having rigid strips bonded onto one or both sides and one or more ends thereof. The strips contain metallized castellations that are aligned with respective metal traces on the flex circuit and soldered thereto. The flexible portion, along with the attached rigid board(s) forms a plug assembly that mates with a socket having contact pins that engage with their respective metallized castellations, with the castellations providing a self-aligning function. The invention may be used to form a flex cable with connectors on one or both ends. Alternatively, the elongated flexible circuit may represent an extension of a larger flex circuit substrate that further contains other electronic devices mounted thereon. The socket and contact pins are preferably attachable to a motherboard by soldering or other means.
摘要翻译: 电连接器包括细长的柔性电路,其具有结合到一侧或两侧上的刚性条和其一端或多端。 这些条带包含与柔性电路上的相应金属迹线对准并焊接到其上的金属化蓖麻。 柔性部分以及附接的刚性板形成一个插头组件,该插头组件与具有与它们各自的金属化cast that接合的接触销的插座配合,cast ations提供自对准功能。 本发明可以用于在一端或两端形成具有连接器的柔性电缆。 或者,细长柔性电路可以表示进一步包含安装在其上的其它电子装置的较大柔性电路基板的延伸部。 插座和接触针优选通过焊接或其他方式附接到主板。
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公开(公告)号:US20110069460A1
公开(公告)日:2011-03-24
申请号:US12927544
申请日:2010-11-17
申请人: James E. Clayton , Zakaryae Fathi
发明人: James E. Clayton , Zakaryae Fathi
CPC分类号: H05K1/118 , H01R12/79 , H05K1/117 , H05K3/363 , H05K3/4691 , H05K2201/09181
摘要: An electrical connector comprises an elongated flexible circuit having rigid strips bonded onto one or both sides and one or more ends thereof. The strips contain metallized castellations that are aligned with respective metal traces on the flex circuit and soldered thereto. The flexible portion, along with the attached rigid board(s) forms a plug assembly that mates with a socket having contact pins that engage with their respective metallized castellations, with the castellations providing a self-aligning function. The invention may be used to form a flex cable with connectors on one or both ends. Alternatively, the elongated flexible circuit may represent an extension of a larger flex circuit substrate that further contains other electronic devices mounted thereon. The socket and contact pins are preferably attachable to a motherboard by soldering or other means.
摘要翻译: 电连接器包括细长的柔性电路,其具有结合到一侧或两侧上的刚性条和其一端或多端。 这些条带包含与柔性电路上的相应金属迹线对准并焊接到其上的金属化蓖麻。 柔性部分以及附接的刚性板形成一个插头组件,该插头组件与具有与它们各自的金属化cast that接合的接触销的插座配合,cast ations提供自对准功能。 本发明可以用于在一端或两端形成具有连接器的柔性电缆。 或者,细长柔性电路可以表示进一步包含安装在其上的其它电子装置的较大柔性电路基板的延伸部。 插座和接触针优选通过焊接或其他方式附接到主板。
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公开(公告)号:US07796399B2
公开(公告)日:2010-09-14
申请号:US12317892
申请日:2008-12-30
申请人: James E. Clayton , Zakaryae Fathi
发明人: James E. Clayton , Zakaryae Fathi
CPC分类号: H05K1/189 , H01L2224/16225 , H01L2224/73253 , H01L2924/07811 , H01L2924/15311 , H05K1/147 , H05K3/0061 , H05K2201/043 , H05K2201/056 , H05K2201/09109 , H05K2201/10159 , H05K2201/1056 , Y10T29/49124 , Y10T29/4913 , Y10T29/49144 , Y10T29/49179 , H01L2924/00
摘要: A multichip module comprises a multilayer substrate circuit having conductive patterns on its surface(s) to which microelectronic device(s) are attached. The conductive patterns include a series of electrical contacts adjacent to one edge of the substrate. The substrate is bonded to two rigid frames, one on each opposite surface. Each substrate has a series of castellations on one edge that are aligned and electrically connected to the respective contacts on the substrate, preferably by soldering. The castellations can serve as a self-aligning mechanism when the module is brought into contact with a low-profile pin array, and the module may be held in place on a motherboard by guide rails in a socket that engages the edges perpendicular to the castellated edge of the module. The module may further be provided with protective heat spreading covers.
摘要翻译: 多芯片模块包括在其表面上具有导电图案的多层衬底电路,微电子器件附接到多个衬底电路。 导电图案包括与衬底的一个边缘相邻的一系列电接触。 衬底被粘合到两个刚性框架上,每个相对表面上一个。 每个衬底在一个边缘上具有一系列在优选通过焊接的衬底上对准并电连接到衬底上的相应接触件的蓖耳。 当模块与低轮廓的针阵列接触时,这些哨座可以用作自对准机构,并且模块可以通过插座中的导轨固定在主板上的位置,该插座与垂直于雉鸡的边缘接合 模块的边缘。 模块还可以设置有保护性散热罩。
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公开(公告)号:US07724530B2
公开(公告)日:2010-05-25
申请号:US12317890
申请日:2008-12-30
申请人: James E. Clayton , Zakaryae Fathi
发明人: James E. Clayton , Zakaryae Fathi
CPC分类号: H05K1/189 , H01L2224/16225 , H01L2224/73253 , H01L2924/07811 , H01L2924/15311 , H05K1/147 , H05K3/0061 , H05K2201/043 , H05K2201/056 , H05K2201/09109 , H05K2201/10159 , H05K2201/1056 , Y10T29/49124 , Y10T29/4913 , Y10T29/49144 , Y10T29/49179 , H01L2924/00
摘要: A multichip module comprises a multilayer substrate circuit having conductive patterns on its surface(s) to which microelectronic device(s) are attached. A part of the substrate is flexible and bifurcated. Two rigid members are attached lengthwise, one on either side of the substrate, and the free ends of the bifurcation are reflexed respectively about these members and bonded to them. Electrodes are located on the bifurcations so that they will be exposed outwardly and/or downwardly after reflexing. The module may further be provided with protective heat spreading covers. The electrodes and rigid members may be configured to engage a mating socket or they may be solderable to a printed circuit board.
摘要翻译: 多芯片模块包括在其表面上具有导电图案的多层衬底电路,微电子器件附接到多个衬底电路。 基板的一部分是柔性的并且分叉。 两个刚性构件纵向连接,一个位于衬底的两侧,并且分叉的自由端分别围绕这些构件反射并结合到它们上。 电极位于分叉处,使得它们在反射之后将向外和/或向下暴露。 模块还可以设置有保护性散热罩。 电极和刚性构件可以被配置为接合配合插座,或者它们可焊接到印刷电路板。
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公开(公告)号:US07520781B2
公开(公告)日:2009-04-21
申请号:US11715206
申请日:2007-03-07
申请人: James E. Clayton , Zakaryae Fathi
发明人: James E. Clayton , Zakaryae Fathi
IPC分类号: H01R24/00
CPC分类号: H01R12/721 , H01R12/88 , H01R43/0256 , H01R43/18
摘要: A socket assembly for multichip in-line modules comprises: at least three parallel in-line sockets, one of which is an edge-card socket adapted to matably engage electrodes on the edge of a printed circuit board, and the others of which are module sockets adapted to accept multichip in-line modules; and, internal connections between respective pins in each of the parallel sockets, whereby signals from the printed circuit board may be simultaneously carried to each of the multichip in-line modules. Alternatively, a socket assembly for multichip in-line modules comprises: a substantially rigid housing structure; at least two parallel in-line sockets adapted to accept multichip in-line modules; a set of electrodes adapted for soldering to a printed circuit board; and, internal connections between respective pins in each of the parallel sockets and the set of electrodes, whereby signals from the printed circuit board may be simultaneously carried to each of the multichip in-line modules.
摘要翻译: 用于多芯片在线模块的插座组件包括:至少三个平行的在线插座,其中一个插座适合于与印刷电路板的边缘上的电极适配地接合,并且其中一个是模块 适用于接受多芯片在线模块的插座; 以及在每个并行插座中的相应引脚之间的内部连接,由此来自印刷电路板的信号可以同时传送到多芯片直插模块中的每一个。 或者,用于多芯片在线模块的插座组件包括:基本上刚性的壳体结构; 至少两个平行的在线插座适于接受多芯片在线模块; 一组适用于焊接到印刷电路板的电极; 以及每个并联插座和电极组中的各个引脚之间的内部连接,由此来自印刷电路板的信号可以同时传送到多芯片直列模块中的每一个。
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