公开(公告)号：US20110220493A1

公开(公告)日：2011-09-15

申请号：US13047210

申请日：2011-03-14

Applicant: Kiyoshi Aratake

Inventor： Kiyoshi Aratake

IPC: C23C14/34 ,  H01L41/22

CPC classification number: H03H3/02 ,  H03H9/02 ,  H03H9/10 ,  H03H9/19 ,  Y10T29/42

Abstract: Provided are a masking material capable of suppressing the occurrence of pattern blurring when forming a pattern on a substrate by a sputtering method, a piezoelectric vibrator using the masking material, a method of manufacturing the piezoelectric vibrator, and an oscillator, an electronic device, and a radio-controlled timepiece each having the piezoelectric vibrator. A masking material which is used when forming a pattern on a substrate by a sputtering method includes openings corresponding to the pattern, and portions where the openings are not formed have a uniform thickness.

Abstract translation: 提供了一种掩模材料，其能够通过溅射法在基板上形成图案时抑制图案模糊的发生，使用掩模材料的压电振动器，压电振动器的制造方法以及振荡器，电子设备和 每个具有压电振动器的无线电控制的钟表。 通过溅射法在基板上形成图形时使用的掩模材料包括对应于图案的开口，并且不形成开口的部分具有均匀的厚度。

公开(公告)号：US20110193646A1

公开(公告)日：2011-08-11

申请号：US13035490

申请日：2011-02-25

Applicant: Kazuyoshi Sugama ,  Kiyoshi Aratake ,  Masashi Numata

Inventor： Kazuyoshi Sugama ,  Kiyoshi Aratake ,  Masashi Numata

IPC: H03B5/32 ,  H01L41/053 ,  H01L41/22

CPC classification number: H03H9/1021 ,  H03H9/21 ,  Y10T29/42

Abstract: A piezoelectric vibrator according to the invention includes a base substrate and a lid substrate which are connected to each other and have a cavity formed therebetween; a piezoelectric vibrating reed that is mounted on the base substrate in the cavity; an external electrode that is formed on a lower surface of the base substrate; and a through electrode which is formed so as to pass through the base substrate, maintain the airtightness in the cavity, and electrically connect the piezoelectric vibrating reed with the external electrode. The through electrode is formed by a press molding by a forming mold having a pin, and includes a through hole of a taper-shaped section, in which a taper angle is in the range of 15° or more and 20° or less, and a conductive paste that is hardened after being filled in the through hole.

Abstract translation: 根据本发明的压电振动器包括彼此连接并且在其间形成的空腔的基底基板和盖基板; 安装在空腔中的基底基板上的压电振动片; 外部电极，形成在所述基底基板的下表面上; 以及形成为穿过基底基板的贯通电极，保持空腔中的气密性，并将压电振动片与外部电极电连接。 贯通电极通过具有销的成型模具的压制成形而形成，并且包括锥形截面的通孔，其中锥角在15°以上且20°以下的范围内，以及 在填充在通孔中之后被硬化的导电膏。

公开(公告)号：US20100326721A1

公开(公告)日：2010-12-30

申请号：US12819858

申请日：2010-06-21

Applicant: Takahiko NAKAMURA ,  Keiji Sato ,  Hitoshi Takeuchi ,  Daisuke Terada ,  Kiyoshi Aratake ,  Masashi Numata

Inventor： Takahiko NAKAMURA ,  Keiji Sato ,  Hitoshi Takeuchi ,  Daisuke Terada ,  Kiyoshi Aratake ,  Masashi Numata

IPC: H01L23/48 ,  H01L41/053 ,  H05K13/04

CPC classification number: H03H9/1021 ,  Y10T29/49169

Abstract: In a structure where an electronic component is mounted on a glass base material, an external electrode is provided on an opposite side to the component mounted on the base, and a through electrode and the base are welded to each other at a temperature equal to or higher than a glass softening point, electrical conduction is ensured between the electronic component and the external electrode. An electronic device includes a base, a through electrode which pass through the base and has a metal film formed on both end surfaces after an insulating material on the surface is removed by polishing, an electronic component which is provided on one surface of the through electrode through a connection portion, an external electrode which is provided on an opposite side to a side of the base on which the electronic component is provided, and a cap which protects the electronic component on the base.

Abstract translation: 在将电子部件安装在玻璃基材上的结构中，外部电极设置在与安装在基座上的部件相反的一侧，并且贯通电极和基座以等于或等于或等于 高于玻璃软化点，确保电子部件和外部电极之间的导电性。 一种电子器件，其特征在于，在通过研磨除去表面的绝缘材料之后，通过所述基底并穿过形成在所述两端面上的金属膜的电极，形成在所述贯通电极的一个表面上的电子部件 通过连接部分，设置在设置有电子部件的基部的相对侧的外部电极以及保护电子部件在基部上的盖。

公开(公告)号：US20100308695A1

公开(公告)日：2010-12-09

申请号：US12857273

申请日：2010-08-16

Applicant: Masashi NUMATA ,  Kiyoshi Aratake

Inventor： Masashi NUMATA ,  Kiyoshi Aratake

IPC: H01L41/053 ,  H01L41/22

CPC classification number: H03H9/1021 ,  H03H3/02 ,  H03H9/21 ,  H03H2003/026 ,  Y10T29/42

Abstract: There is provided a piezoelectric vibrator 1 that includes a base substrate 2, a lid substrate 3, a piezoelectric vibrating reed 4, a pair of external electrodes 38 and 39, a pair of through electrodes 32 and 33, and routing electrodes 36 and 37. The lid substrate 3 includes a recess 3a for a cavity and is bonded to the base substrate so that the recess faces the base substrate. The piezoelectric vibrating reed 4 is bonded to the upper surface of the base substrate in a cavity that is formed between both the substrates. The pair of external electrodes 38 and 39 is formed on the lower surface of the base substrate. The pair of through electrodes 32 and 33 is formed so as to pass through the base substrate and is electrically connected to the pair of external electrodes, respectively. The routing electrodes 36 and 37 are formed on the upper surface of the base substrate and electrically connect the pair of through electrodes to the piezoelectric vibrating reed. The through electrodes include electrode films 32a and 33a that are formed on the inner surfaces of the through holes 30 and 31, and glass bodies 32b and 33b that are fixed to the inner surfaces of the through holes with the electrode films interposed therebetween so as to close the through holes.

Abstract translation: 提供了一种压电振动器1，其包括基底基板2，盖基板3，压电振动片4，一对外部电极38和39，一对贯通电极32和33以及布线电极36和37。 盖基板3包括用于空腔的凹部3a，并且与基底基板接合，使得凹部面向基底。 压电振动片4在形成在两个基板之间的空腔中结合到基底基板的上表面。 一对外部电极38和39形成在基底基板的下表面上。 一对贯通电极32,33形成为通过基底基板，分别与一对外部电极电连接。 布线电极36和37形成在基底基板的上表面上，并将一对通孔电连接到压电振动片。 贯通电极包括形成在通孔30和31的内表面上的电极膜32a和33a以及固定到通孔的内表面的玻璃体32b和33b，其间插入有电极膜，以便 关闭通孔。

公开(公告)号：US20100290201A1

公开(公告)日：2010-11-18

申请号：US12759417

申请日：2010-04-13

Applicant: Hitoshi Takeuchi ,  Keiji Sato ,  Kiyoshi Aratake ,  Masashi Numata ,  Takahiko Nakamura ,  Daisuke Terada ,  Takeshi Sugiyama

Inventor： Hitoshi Takeuchi ,  Keiji Sato ,  Kiyoshi Aratake ,  Masashi Numata ,  Takahiko Nakamura ,  Daisuke Terada ,  Takeshi Sugiyama

IPC: H05K5/00 ,  H01L23/48 ,  H05K13/00

CPC classification number: H01L23/055 ,  H01L2924/0002 ,  H01L2924/19041 ,  Y10T29/49002 ,  Y10T29/49124 ,  H01L2924/00

Abstract: To provide an improved solderability for mounting an electronic component onto a circuit board, a package of an electronic component (1) is formed by bonding together a base (3) made of glass and a lid (2). Outer electrodes (8) and (18) are formed on a bottom surface of the base (3), and the outer electrodes (8) and (18) are respectively connected to through electrodes (7) and (17). The outer electrodes (8) and (18) each have a laminated structure of three CrAu layers, that is, from a Cr layer (first layer) to an Au layer (sixth layer). When the outer electrodes (8) and (18) are soldered onto a circuit board, the Au layers as the second, fourth, and sixth layers are dissolved into solder, whereas the Cr layers as the third and fifth layers, which hardly form an intermetallic compound with solder, are separated to remain in solder.

Abstract translation: 为了提供用于将电子部件安装到电路板上的改进的可焊性，通过将由玻璃制成的基部（3）和盖（2）接合在一起而形成电子部件（1）的封装。 外电极（8）和（18）形成在基座（3）的底表面上，外电极（8）和（18）分别连接到电极（7）和（17）。 外部电极（8）和（18）各自具有三个CrAu层的层压结构，即从Cr层（第一层）到Au层（第六层）。 当将外电极（8）和（18）焊接到电路板上时，作为第二层，第四层和第六层的Au层溶解在焊料中，而作为第三层和第五层的Cr层几乎不形成 金属间化合物与焊料分离，保留在焊料中。

公开(公告)号：US07531945B2

公开(公告)日：2009-05-12

申请号：US11505693

申请日：2006-08-17

Applicant: Kiyoshi Aratake

Inventor： Kiyoshi Aratake

IPC: H01L41/08

CPC classification number: H03H9/1035 ,  H01L2924/0002 ,  H03H9/0542 ,  H03H9/0595 ,  H03H9/215 ,  H01L2924/00

Abstract: To provide a quartz crystal vibrator, an oscillator and an electronic apparatus capable of preventing a bonding electrode from being corroded and easily maintaining soundness of the bonding electrode over a long period of time, a quartz crystal vibrator is provided with a quartz crystal vibrating plate formed by surrounding a quartz crystal vibrating piece by a frame-like portion, a hermetically closed vessel including a lid member and a base member in a plate-like shape for interposing the quartz crystal vibrating plate in a thickness direction, bonding electrodes provided between the lid member and the quartz crystal vibrating plate and between the base member and the quartz crystal vibrating plate and electrically connected to an inner electrode, and a protecting film for protecting the bonding electrode, provided with a recess portion recessed to an inner side of the hermetically closed vessel from an outer edge portion between the lid member and the quartz crystal vibrating plate and an outer edge portion between the base member and the quartz crystal vibrating plate, the protecting film is provided at the recess portion and the bonding electrode is disposed on the inner side of the recess portion.

公开(公告)号：US20070044565A1

公开(公告)日：2007-03-01

申请号：US11506055

申请日：2006-08-17

Applicant: Kiyoshi Aratake

Inventor： Kiyoshi Aratake

IPC: G01M7/00

CPC classification number: H03H9/1021 ,  H03H9/21

Abstract: To provide a piezoelectric vibrator, an oscillator, an electronic part, an electronic apparatus, a method of fabricating a piezoelectric vibrator and a method of fabricating an electronic part capable of swiftly and easily providing a plurality of electrodes for applying a voltage to a piezoelectric vibrating piece while maintaining airtightness at inside of a hermetically sealed vessel, there is provided a piezoelectric vibrator including a hermetically sealed vessel 2 constituted by overlapping a lid member 6 and a base member 7 in a plate-like shape, a piezoelectric vibrating piece 3 provided at inside of the hermetically sealed vessel 2, a lead-out electrode 16 provided at an overlapping face 6a of the lid member 6, electrically connected to the piezoelectric vibrating piece 3 by way of a connecting portion, and extending the connecting portion 15 to an edge portion of the overlapping face 6a of the lid member 6, an external electrode 27 electrically connected to the lead-out electrode 16 from a side face of the hermetically sealed vessel 2, and a bonding film 20 comprising a metal or silicone provided between the overlapping face 6a of the lid member 6 and an overlapping face 7a of the base member 7, in which an insulating film 22 is provided between the lead-out electrode 16 and the bonding film 20.

Abstract translation: 提供压电振动器，振荡器，电子部件，电子设备，制造压电振动器的方法和制造电子部件的方法，其能够快速且容易地提供用于向压电振动器施加电压的多个电极 同时保持密封容器内部的气密性，提供了一种压电振动器，其包括通过将盖构件6和基座构件7重叠成板状而构成的气密密封容器2，压电振动片3设置在 在密封容器2的内部，设置有盖构件6的重叠面6a的引出电极16，其通过连接部与压电振动片3电连接，并且将连接部15延伸到 盖构件6的重叠面6a的边缘部分，与导出件电连接的外部电极27 电极16从密封容器2的侧面，以及接合膜20，其包括设置在盖构件6的重叠面6a和基部构件7的重叠面7a之间的金属或硅酮，其中 绝缘膜22设置在引出电极16和接合膜20之间。

公开(公告)号：US06417478B1

公开(公告)日：2002-07-09

申请号：US09493759

申请日：2000-01-28

Applicant: Masayoshi Shiraishi ,  Kiyoshi Aratake ,  Yasuhiro Nohara

Inventor： Masayoshi Shiraishi ,  Kiyoshi Aratake ,  Yasuhiro Nohara

IPC: B23K1116

CPC classification number: B23K1/0004

Abstract: To provide an anodic bonding method which can favorably bond between members different in thermal expansion coefficient. In an anodic bonding method of applying a voltage to and bonding between a first member 10 having a bonding film 11 on a bonding surface and a second member 12 closely put on the bonding surface of the first member 10 through the bonding film 11 in a manner that the first member 10 is rendered as an anode, characterized in that: the bonding film 11 is of a metal film and the second member 12 is of a soda-lime glass, and a bonding temperature is at 100-200° C. and an application voltage is at 0.5-5.0 kV.

Abstract translation: 提供可以有利地结合热膨胀系数不同的部件之间的阳极接合方法。 在通过接合膜11以紧密接合在第一部件10的接合面上的第一部件10与接合面11接合的接合膜11的第一部件10与第二部件12之间施加电压并进行接合的阳极接合方法中， 使第一构件10呈阳极，其特征在于，接合膜11为金属膜，第二构件12为钠钙玻璃，接合温度为100〜200℃， 施加电压为0.5-5.0kV。

公开(公告)号：US08444801B2

公开(公告)日：2013-05-21

申请号：US12869098

申请日：2010-08-26

Applicant: Kiyoshi Aratake

Inventor： Kiyoshi Aratake

IPC: B29C65/14

CPC classification number: H03H3/02 ,  H03H9/1014

Abstract: An anodic bonding method of anodically bonding a base wafer 10 and a lid wafer 11 includes:(1) superimposing the base wafer 10 and the lid wafer 11 onto each other in a direction where a bonding film 9 faces a cavity C; (2) subsequent to the superimposition step, pressurizing and holding the base wafer 10 and the lid wafer 11 in a vacuum state in the superimposition direction; and (3) subsequent to the pressurizing step, partitioning and setting a plurality of intended bonding areas A1, A2, A3 and A4 in a concentric form on a contacting surface where the base wafer 10 and the lid wafer 11 are in contact with each other and applying a DC voltage to each of the plurality of intended bonding areas A1, A2, A3 and A4.

Abstract translation: 阳极接合基底晶片10和盖子晶片11的阳极接合方法包括：（1）将基底晶片10和盖子晶片11在接合薄膜9面向空腔C的方向上彼此重叠; （2）在叠加步骤之后，将基底晶片10和盖片11加压并保持在叠置方向的真空状态; 和（3）在加压步骤之后，在基底晶片10和盖子晶片11彼此接触的接触表面上以同心形式分割和设置多个预期的粘合区域A1，A2，A3和A4 以及向所述多个预期粘合区域A1，A2，A3和A4中的每一个施加DC电压。

公开(公告)号：US08427250B2

公开(公告)日：2013-04-23

申请号：US13112570

申请日：2011-05-20

Applicant: Kiyoshi Aratake

Inventor： Kiyoshi Aratake

IPC: H03B5/32 ,  H01L41/053

CPC classification number: H03H9/215 ,  H03H3/04 ,  H03H9/0519 ,  H03H9/1021 ,  H03H2003/0492 ,  Y10T29/42

Abstract: The piezoelectric vibrator includes: a package in which a first substrate and a second substrate are superimposed so as to form a cavity therebetween; outer electrodes which are formed on an outer surface of the first substrate; inner electrodes which are formed on the first substrate so as to be accommodated in the cavity; penetration electrodes which are formed so as to penetrate through the first substrate so that the outer electrodes and the inner electrodes are electrically connected; and a piezoelectric vibrating reed which is sealed in the cavity and electrically connected to the inner electrodes at the inner side of the cavity. The first substrate and the second substrate are bonded by a bonding film that is formed of a low-melting-point glass, and the bonding film is heated to a predetermined bonding temperature when the first substrate and the second substrate are bonded together, and is formed by being heated to a temperature higher than the bonding temperature before the bonding is performed.

Abstract translation: 压电振子包括：第一基板和第二基板叠加在其中以在其间形成空腔的封装; 形成在第一基板的外表面上的外电极; 内电极，其形成在第一基板上以容纳在空腔中; 穿透电极，其形成为穿过第一基板，使得外电极和内电极电连接; 以及压电振动片，其密封在空腔中并且在腔的内侧电连接到内部电极。 第一基板和第二基板通过由低熔点玻璃形成的接合膜接合，并且当第一基板和第二基板接合在一起时，接合膜被加热到预定的接合温度，并且是 通过加热到高于接合前的接合温度的温度而形成。