Print apparatus, print system, print method, job processing method, storage medium, and program
    41.
    发明申请
    Print apparatus, print system, print method, job processing method, storage medium, and program 有权
    打印装置,打印系统,打印方法,作业处理方法,存储介质和程序

    公开(公告)号:US20050100378A1

    公开(公告)日:2005-05-12

    申请号:US10975357

    申请日:2004-10-29

    摘要: In order to maintain high security of a job that requires a high security level even after a print interrupt factor has been removed, and to achieve both the effect of maintaining high security of a job that requires a high security level even after the print process is interrupted, and the effect of improving the productivity of jobs other than a job of this type, when a print apparatus which can process a plurality of print jobs including a print job of a first type and that of a second type restarts a print operation of a print job, which is interrupted in the print apparatus, and when the print job is a print of the first type, the print apparatus is controlled to execute an authentication process, and then allowed to restart the print operation of the print job. When the print apparatus restarts a print operation of a print job, which is interrupted in the print apparatus, and when the print job is a print of the second type, the print apparatus is allowed to restart the print operation of the print job without executing the authentication process.

    摘要翻译: 为了保持甚至在打印中断因素被去除之后需要高安全级别的作业的高安全性,并且即使在打印处理之后也能够实现要求高安全级别的作业的高安全性的效果 中断,以及提高除了这种作业以外的作业的生产率的效果,当能够处理包括第一类型的打印作业和第二类型的打印作业的多个打印作业的打印设备重新开始打印操作时 在打印装置中中断的打印作业,并且当打印作业是第一类型的打印时,控制打印装置执行认证处理,然后允许重新开始打印作业的打印操作。 当打印设备重新开始在打印设备中中断的打印作业的打印操作时,并且当打印作业是第二类型的打印时,允许打印设备重新启动打印作业的打印操作而不执行 认证过程。

    Hair clip
    42.
    发明授权

    公开(公告)号:US06536446B2

    公开(公告)日:2003-03-25

    申请号:US09948573

    申请日:2001-09-10

    申请人: Yoshio Kimura

    发明人: Yoshio Kimura

    IPC分类号: A45D820

    CPC分类号: A45D8/20

    摘要: A hair clip comprises a first clip body with one end thereof formed as a first handling portion and the other end formed as a first hair clipping portion, a second clip body with one end thereof formed as a second handling portion and the other end formed as a second hair clipping portion, a coupler for coupling the first clip body and the second clip body with each other so that the first hair clipping portion and the second hair clipping portion are made opened and closed by operating the first handling portion and the second handling portion, and an urging device for urging the first hair clipping portion and the second hair clipping portion in a direction of closing them, and at least one of the first handling portion and the second handling portion has a first part made of a first material and a second part made of a second material as a flexible material more flexible than the first material.

    Liquid supplying device
    43.
    发明授权
    Liquid supplying device 失效
    液体供应装置

    公开(公告)号:US6015066A

    公开(公告)日:2000-01-18

    申请号:US991783

    申请日:1997-12-16

    IPC分类号: G03F7/30 B67D5/08

    CPC分类号: G03F7/30 Y10T137/3124

    摘要: Disclosed herein is a device for supplying a liquid to a plurality of apparatuses which apply the liquid to substrates to process the substrates. The device comprises a tank containing the liquid, a supply passage for supplying the liquid from the tank to the apparatuses, branch passages connected to the supply passage, for supplying the liquid to liquid-applying members provided in the apparatuses, and valves provided on the branch passages, respectively. The valves are controlled each other, for opening and closing the branch passages such that the liquid-applying member of one apparatus applies the liquid to a substrate while the liquid-applying member of any other apparatus remains to apply the liquid to a substrate.

    摘要翻译: 这里公开了一种用于将液体供应到将液体施加到基板以处理基板的多个装置的装置。 该装置包括容纳液体的容器,用于将液体从罐供给到设备的供给通道,连接到供给通道的分支通道,用于将液体供应到设置在设备中的液体施加部件, 分支通道。 阀被彼此控制,用于打开和关闭分支通道,使得一个设备的液体施加构件将液体施加到基底,同时任何其他设备的液体施加构件保持将液体施加到基底。

    Apparatus for supplying a treatment material
    44.
    发明授权
    Apparatus for supplying a treatment material 失效
    用于提供处理材料的装置

    公开(公告)号:US5733375A

    公开(公告)日:1998-03-31

    申请号:US580620

    申请日:1995-12-29

    IPC分类号: C23C16/448 C23C16/00 B01F3/04

    CPC分类号: C23C16/4482

    摘要: An apparatus for supplying a treating material to a treating device has a tank containing a liquid treating material and a heat exchanger formed by a spiral pipe and provided in the tank. A nitrogen gas (N.sub.2 gas) is introduced into the tank and evaporates the liquid treating material. Water is supplied from a fluid inlet pipe connected to the lower portion of the exchanger to a fluid outlet pipe connected to the upper portion of the exchanger through the spiral pipe of the exchanger. In the heat exchange, heat exchange between the water and the liquid treating material is performed very efficiently. No use of electric power provides high safety. The temperature of the liquid treating material which is changed into a gas state by a bubbling process is controlled efficiently and the density of the vaporized treating material in the tank is made stable.

    摘要翻译: 一种用于将处理材料供给到处理装置的装置具有容纳液体处理材料的容器和由螺旋管形成的热交换器并设置在罐中。 将氮气(N 2气)引入罐中并蒸发液体处理材料。 水从连接到交换器下部的流体入口管供给到通过交换器的螺旋管连接到交换器的上部的流体出口管。 在热交换中,水和液体处理材料之间的热交换非常有效地进行。 不使用电力提供高安全性。 有效地控制通过鼓泡处理而变为气态的液体处理材料的温度,使罐内的汽化处理材料的密度稳定。

    Resist process apparatus
    45.
    发明授权
    Resist process apparatus 失效
    抗蚀加工设备

    公开(公告)号:US5061144A

    公开(公告)日:1991-10-29

    申请号:US442535

    申请日:1989-11-28

    摘要: A resist process apparatus of the invention serves to load/unload a semiconductor wafer in/from the respective process mechanisms. The apparatus includes a wafer holding member for holding a semiconductor wafer, and X, Y, Z and .theta. driving mechanisms for conveying the wafer holding member to a resist coating mechanism and the like. The wafer holding member includes a support frame which is larger than diameter of a semiconductor wafer, and a plurality of support members, arranged on the support frame, for supporting the semiconductor wafer in partial contact with the peripheral portion of the semiconductor wafer. Since the contact area between the support members and a semiconductor wafer is small, changes in temperature of the semiconductor, when it is held, are small.

    摘要翻译: 本发明的抗蚀剂处理装置用于在各个加工机构中加载/卸载半导体晶片。 该装置包括用于保持半导体晶片的晶片保持构件和用于将晶片保持构件输送到抗蚀剂涂覆机构等的X,Y,Z和θ驱动机构。 晶片保持构件包括比半导体晶片的直径大的支撑框架和布置在支撑框架上的多个支撑构件,用于支撑半导体晶片与半导体晶片的周边部分部分接触。 由于支撑构件和半导体晶片之间的接触面积小,因此在保持时半导体的温度变化小。

    Pin for use in a workpiece clamping apparatus
    46.
    发明授权
    Pin for use in a workpiece clamping apparatus 失效
    用于工件夹紧装置的销

    公开(公告)号:US5026222A

    公开(公告)日:1991-06-25

    申请号:US490385

    申请日:1990-03-08

    IPC分类号: B23B31/10 B23B33/00 B23Q3/18

    摘要: A pin for use in a chuck for clamping a discoid portion of a workpiece, the chuck including a base, at least to fixed clamps secured on a front end surface of the base, a movable clamp adjacent to the front end surface of the base and the pin secured to the front end surface of the base. The pin is adapted to fit in a hole formed in a discoid when the discoid is mounted on the chuck wherein the hole has a larger diameter than the pin. The pin has generally rhombic transversed section with a long diagonal and a short diagonal. The pin is truncated by a predetermined amount at each end along the long diagonal to allow the workpiece to move a limited distance relative to the pin along a line formed by the short diagonal. The limited distance may be a function of an initial clearance between the discoid portion and the chuck or a function or a variation between the diameter of the discoid portion and its design diameter, or a function of both. In the preferred embodiment, the predetermined amount truncated from each end of the pin is a function of 1/2 the difference between the long diagonal and the square root of the difference between the long diagonal squared and the limited distance squared.

    Vapor cooled semiconductor device having an improved structure and
mounting assembly
    49.
    发明授权
    Vapor cooled semiconductor device having an improved structure and mounting assembly 失效
    具有改进的结构和安装组件的蒸气冷却的半导体器件

    公开(公告)号:US3996604A

    公开(公告)日:1976-12-07

    申请号:US545346

    申请日:1975-01-30

    摘要: A vapor cooled semiconductor device which comprises an envelope having at least one aperture, at least one semiconductor element enclosed therein, an electrode contacting the semiconductor element and exposed across the aperture of the envelope, an expandable diaphragm disposed through an insulator between the electrode and the wall of the envelope to seal the gap therebetween, spherical spring plates disposed outside the envelope and arranged to support the semiconductor element through the electrode under pressure, and a liquid coolant enclosed in the closed envelope, with space provided therein, whereby the semiconductor element may be cooled by the latent heat of vaporization of the liquid coolant.

    摘要翻译: 一种蒸汽冷却的半导体器件,其包括具有至少一个孔的外壳,封装在其中的至少一个半导体元件,与半导体元件接触并暴露于外壳的孔的电极,可扩张的隔膜,其设置成穿过电极和 密封其间的间隙的球形弹簧板,设置在外壳外部并且布置成在压力下支撑半导体元件通过电极,以及封闭在封闭的外壳中的液体冷却剂,其中设置有空间,由此半导体元件可以 被液体冷却剂的蒸发潜热所冷却。