公开(公告)号：US20170137707A1

公开(公告)日：2017-05-18

申请号：US15253688

申请日：2016-08-31

Applicant: LEXTAR ELECTRONICS CORPORATION

Inventor： Ye Jin ,  Ru-Shi Liu ,  Yu-Chun Lee ,  Ching-Yi Chen ,  Tzong-Liang Tsai

IPC: C09K11/61 ,  H01L33/56 ,  H01L33/62 ,  H01L33/50

CPC classification number: C09K11/617 ,  H01L33/502 ,  H01L33/504 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49107 ,  H01L2224/73265 ,  H01L2933/0041 ,  H01L2924/00014

Abstract: The present invention provides a method for fabricating a fluoride phosphor. A first solution is formed by dissolving potassium fluoride (KF) and either K2MnF6 or KMnO4 in a hydrofluoric acid solution. A second solution is formed by mixing a surfactant and a silane. The first solution and the second solution are mixed to form a precipitate. The precipitate is collected after the first solution and the second solution are mixed. The present invention also provides a fluoride phosphor represented by the following formula: K2[SiF6]:Mn4+. The fluoride phosphor has a particle size in a range of about 1 μm to about 10 μm. The present invention further provides a light-emitting apparatus and backlight module employing the same.

公开(公告)号：US09065027B2

公开(公告)日：2015-06-23

申请号：US14149051

申请日：2014-01-07

Applicant: Lextar Electronics Corporation

Inventor： Li-Cheng Yang ,  Yu-Chun Lee

IPC: H01L33/00 ,  H01L33/58 ,  G02F1/15 ,  H01L33/50 ,  H01L33/44

CPC classification number: H01L33/58 ,  G02F1/15 ,  G02F1/157 ,  G02F2001/1515 ,  G02F2202/04 ,  H01L33/44 ,  H01L33/50 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: A LED package structure includes a base portion, a light-emitting chip, a cup portion and an encapsulating glue. The base portion has an upper surface and a lower surface. The upper surface has a die-bonding area. The light-emitting chip emits a light with a first wavelength and is located on the die-bonding area. The cup portion is located on the base portion to surround the die-bonding area to form a recess having an opening. The encapsulating glue is filled into the recess. The encapsulating glue has a wavelength conversion material configured to convert part of the light with the first wavelength into a light with a second wavelength. The cup portion includes an electro chromic layer electrically connected to a first external power and a transmittance of the electro chromic layer is changed in accordance with an input voltage of the first external power to adjust the light-emitting profile of the light-emitting chip.

Abstract translation: LED封装结构包括基部，发光芯片，杯部和封装胶。 基部具有上表面和下表面。 上表面具有芯片接合区域。 发光芯片发射具有第一波长的光并且位于芯片接合区域上。 杯部位于基部上以包围芯片接合区域以形成具有开口的凹部。 封装胶被填充到凹槽中。 封装胶具有被配置为将具有第一波长的光的一部分转换成具有第二波长的光的波长转换材料。 杯部包括电连接到第一外部电源的电致铬层，并且根据第一外部电源的输入电压改变电致发光层的透射率，以调节发光芯片的发光轮廓。