中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

41 records (took 0.014 seconds)

    Light-emitting diode device
    2.
    发明授权
    Light-emitting diode device 有权

    公开(公告)号：US11652193B2

    公开(公告)日：2023-05-16

    申请号：US17083329

    申请日：2020-10-29

    Applicant: Lextar Electronics Corporation

    Inventor： Yi-Ting Tsai ,  Hung-Chia Wang ,  Chia-Chun Hsieh ,  Hung-Chun Tong ,  Yu-Chun Lee ,  Tzong-Liang Tsai

    IPC: H01L33/50

    CPC classification number: H01L33/502 ,  H01L33/508

    Abstract: A light-emitting diode device is provided. First and second green conversion materials are respectively configured to convert a blue light emitted from a blue light-emitting diode to generate a first green light with a first wavelength range and a first wavelength FWHM, and a second green light with a second wavelength range and a second wavelength FWHM. The second wavelength FWHM is smaller than the first wavelength FWHM. A lower bound of the first wavelength range is smaller than a lower bound of the second wavelength range, and an upper bound of the second wavelength range is greater than an upper bound of the first wavelength range. An output light emitted from the light-emitting diode device has a spectral characteristic of less than 50% of TÜV Rheinland and more than 90% of wide color gamut.

    Light emitting diode chip scale packaging structure and direct type backlight module
    3.
    发明授权
    Light emitting diode chip scale packaging structure and direct type backlight module 有权

    公开(公告)号：US10312408B2

    公开(公告)日：2019-06-04

    申请号：US15722368

    申请日：2017-10-02

    Applicant: Lextar Electronics Corporation

    Inventor： Che-Hsuan Huang ,  Hsin-Lun Su ,  Shu-Hsiu Chang ,  Chih-Hao Lin ,  Tzong-Liang Tsai

    IPC: H01L33/08 ,  H01L33/50 ,  H01L33/56

    Abstract: A light emitting diode chip scale packaging structure and a direct type backlight module are disclosed. The light emitting diode chip scale packaging structure includes a light emitting diode chip, a wavelength converting layer, a diffusion structure and a lens. The wavelength converting layer is disposed on the light emitting diode chip and directly contacting the light emitting diode chip, and the wavelength converting layer includes phosphor powders. The diffusion structure covers the light emitting diode chip and the wavelength converting layer, a ratio of a height of the diffusion structure to a width of the diffusion structure is 1:2 to 5:4, and the lens covers the diffusion structure. An outer surface of the lens is a free-form surface, and a material of the lens is different from a material of the diffusion structure.

    LIGHT-EMITTING DIODE MODULE AND LAMP USING THE SAME
    5.
    发明申请
    LIGHT-EMITTING DIODE MODULE AND LAMP USING THE SAME 有权
    发光二极管模块和灯使用相同

    公开(公告)号：US20160322420A1

    公开(公告)日：2016-11-03

    申请号：US15088616

    申请日：2016-04-01

    Applicant: LEXTAR ELECTRONICS CORPORATION

    Inventor： Fang-Chang Hsueh ,  Yu-Min Lin ,  Chih-Hao Lin ,  Tzong-Liang Tsai

    IPC: H01L27/15 ,  H01L33/58 ,  F21V8/00 ,  H01L33/50 ,  F21V3/00 ,  F21K99/00

    CPC classification number: H01L27/15 ,  F21K9/23 ,  F21K9/232 ,  F21V3/00 ,  F21Y2101/00 ,  F21Y2105/16 ,  F21Y2115/10 ,  G02B6/0073 ,  H01L25/0753 ,  H01L33/36 ,  H01L33/486 ,  H01L33/505 ,  H01L33/58

    Abstract: A light-emitting diode (LED) module and a lamp using the same are provided. The LED module includes a substrate and several light-emitting packages. Each light-emitting package includes an optical wavelength conversion layer and a light-emitting diode having a first light-output surface, a bonding surface, and several second light-output surfaces. The bonding surface is opposite the first light-output surface and connected to the substrate. The second light-output surfaces are between the first light-output surface and the bonding surface. The optical wavelength conversion layer covers the first and second light-output surfaces. The distance between the bonding surface and the top surface of the optical wavelength conversion layer represents a light source thickness. The distance between two adjacent light-emitting packages represents a spacing of light sources. Specifically, the ratio of the spacing of light sources to the light source thickness is between 1 and 6.3.

    Abstract translation: 提供了一种发光二极管（LED）模块和使用其的灯。 LED模块包括基板和几个发光封装。 每个发光封装包括光波长转换层和具有第一光输出表面，接合表面和几个第二光输出表面的发光二极管。 接合表面与第一光输出表面相对并连接到基板。 第二光输出面位于第一光输出面和接合面之间。 光波长转换层覆盖第一和第二光输出表面。 光波长转换层的接合面和顶面之间的距离表示光源厚度。 两个相邻的发光封装之间的距离表示光源的间隔。 具体地说，光源间距与光源厚度之比为1〜6.3。

    Electrode structure and light emitting diode structure having the same
    6.
    发明授权
    Electrode structure and light emitting diode structure having the same 有权
    电极结构和发光二极管结构相同

    公开(公告)号：US09093613B2

    公开(公告)日：2015-07-28

    申请号：US14247408

    申请日：2014-04-08

    Applicant: Lextar Electronics Corporation

    Inventor： Tsung-Yu Yang ,  Tzong-Liang Tsai

    IPC: H01L33/36 ,  H01L33/40 ,  H01L33/42 ,  H01L33/46

    CPC classification number: H01L33/405 ,  H01L33/36 ,  H01L33/42 ,  H01L33/46

    Abstract: An electrode structure includes at least one reflection layer, a barrier layer, and a conductive pad. The barrier layer includes a first barrier layer and a second barrier layer. The first and second barrier layers are stacked on the reflection layer in sequence. The first and second barrier layers are made of different materials. The conductive pad is located on the barrier layer.

    Abstract translation: 电极结构包括至少一个反射层，阻挡层和导电焊盘。 阻挡层包括第一阻挡层和第二阻挡层。 第一和第二阻挡层依次层叠在反射层上。 第一和第二阻挡层由不同的材料制成。 导电垫位于阻挡层上。

    Low blue light backlight module
    8.
    发明授权
    Low blue light backlight module 有权

    公开(公告)号：US11294238B1

    公开(公告)日：2022-04-05

    申请号：US17083328

    申请日：2020-10-29

    Applicant: Lextar Electronics Corporation

    Inventor： Kiet Tuong Ly ,  Fu-Hsin Chen ,  Yi-Ting Tsai ,  Hung-Chia Wang ,  Chia-Chun Hsieh ,  Hung-Chun Tong ,  Yu-Chun Lee ,  Tzong-Liang Tsai

    IPC: H01L33/50 ,  G02F1/13357

    Abstract: A low blue light backlight module configured to emit a white light is provided. The low blue light backlight module includes a first light-emitting element, a second light-emitting element, a third light-emitting element and a fourth light-emitting element. The first light-emitting element is configured to emit a first light having a peak emission wavelength of about 610-660 nm. The second light-emitting element is configured to emit a second light having a peak emission wavelength of about 520-550 nm. The third light-emitting element is configured to emit a third light having a peak emission wavelength of about 480-580 nm. The fourth light-emitting element is configured to emit a fourth light having a peak emission wavelength of about 445-470 nm. The white light has an emission spectrum, and an area ratio of the spectrum under wavelength of 415-455 nm to the spectrum under wavelength of 400-500 nm is below 50%.

    Light emitting structure, light device and backlight module
    10.
    发明授权
    Light emitting structure, light device and backlight module 有权

    公开(公告)号：US09966505B2

    公开(公告)日：2018-05-08

    申请号：US14887451

    申请日：2015-10-20

    Applicant: Lextar Electronics Corporation

    Inventor： Ching-Yi Chen ,  Hung-Chun Tong ,  Li-Cheng Yang ,  Wen-Wan Tai ,  Yu-Chun Lee ,  Tzong-Liang Tsai

    IPC: H01L33/50 ,  F21V8/00

    CPC classification number: H01L33/504 ,  G02B6/0003 ,  G02B6/0035 ,  G02B6/0073

    Abstract: The present disclosure provides a light emitting structure including a blue light source, a first fluorescent material layer and a second fluorescent material layer. The blue light source has a light emitting surface. The first fluorescent material layer covers the light emitting surface of the blue light source. The first fluorescent material layer consists of a first fluorescent material. An excitation band of the first fluorescent material is in a blue wave band, and an emission band of the first fluorescent material is in a green wave band. The second fluorescent material layer covers the first fluorescent material layer. The second fluorescent material layer consists of a second fluorescent material. An excitation band of the second fluorescent material is in a green wave band, and an emission band of the second fluorescent material is in a red wave band. A light device and a backlight module are also provided herein.

Patent Agency Ranking