Abstract:
The width and location of a hysteresis window of an interferometric modulator may be altered by adjusting various physical characteristics of the interferometric modulator. Thus, depending on the particular application for which the interferometric modulators are manufactured, the width and location of the hysteresis window may be altered. For example, in some applications, reducing the power required to operate an array of interferometric modulators may be an important consideration. In other applications, the speed of the interferometric modulators may be of more importance, where the speed of an interferometric modulator, as used herein, refers to the speed of actuating and relaxing the moveable mirror. In other applications, the cost and ease of manufacturing may be of most importance. Systems and methods are introduced that allow selection of a width and location of a hysteresis window by adjusting various physical characteristics.
Abstract:
Another embodiment has a method of driving a display device including an array of MEMS elements is disclosed. The MEMS elements are characterized by a preferred set of drive potential differences including preferred positive and preferred negative actuation potential differences, preferred positive and preferred negative hold potential differences, and a preferred release potential difference, where the preferred set of drive potential differences is symmetric about a voltage differing from 0V by an offset δV. Another embodiment has a reduced set of supply voltages are used, while maintaining the charge balancing effects of applying potential differences of opposite polarity without visible artifacts.
Abstract:
A package is made of a transparent substrate having an interferometric modulator and a back plate. A non-hermetic seal joins the back plate to the substrate to form a package, and a desiccant resides inside the package. A method of packaging an interferometric modulator includes providing a transparent substrate and manufacturing an interferometric modulator array on a backside of the substrate. A back plate is provided and a desiccant is applied to the back plate. The back plate is sealed to the backside of the substrate with a back seal in ambient conditions, thereby forming a package.
Abstract:
Embodiments of exemplary MEMS interferometric modulators are arranged at intersections of rows and columns of electrodes. In certain embodiments, the column electrode has a lower electrical resistance than the row electrode. A driving circuit applies a potential difference of a first polarity across electrodes during a first phase and then quickly transition to applying a bias voltage having a polarity opposite to the first polarity during a second phase. In certain embodiments, an absolute value of the difference between the voltages applied to the row electrode is less than an absolute value of the difference between the voltages applied to the column electrode during the first and second phases.
Abstract:
A package is made of a transparent substrate having an interferometric modulator and a back plate. A non-hermetic seal joins the back plate to the substrate to form a package, and a desiccant resides inside the package. A method of packaging an interferometric modulator includes providing a transparent substrate and manufacturing an interferometric modulator array on a backside of the substrate. A back plate is provided and a desiccant is applied to the back plate. The back plate is sealed to the backside of the substrate with a back seal in ambient conditions, thereby forming a package
Abstract:
A MEMS device is packaged with a control material that is included in the package to affect an operation of a moveable element of the device. The control material may affect operational characteristics including actuation and release voltages and currents, mechanical affects including damping and stiffness, lifetime of the device, optical properties, thermal affects and corrosion. The control material may be inserted into the package as part of any of several structural components of the package or the MEMS device.
Abstract:
An array of movable elements is arranged on a substrate. Each element has a cavity and a movable member to move through the cavity. The pressure resistance of the elements varies, allowing actuation signals to be manipulated to activate elements with different pressure resistance at different levels of the actuation signal.
Abstract:
An apparatus and method for reducing perceived color shift as a function of viewing angle is disclosed. One embodiment is a display device that includes a color light modulator and a color filter. The filter is configured to filter wavelengths of light that would be perceived as color shifted light when reflected by the modulator at an off-axis viewing angle. Another embodiment includes a color light modulator and a color light source configured to provide light having a spectral content that lacks the wavelengths that would be perceived as color shifted light by a view of the display at an off-axis viewing angle. Another embodiment are methods of making such display devices.
Abstract:
MEMS switches are formed with membranes or layers that are deformable upon the application of a voltage. In some embodiments, the application of a voltage opens switch contacts.
Abstract:
The fabrication of a MEMS device such as an interferometric modulator is improved by employing an etch stop layer between a sacrificial layer and a mirror layer. The etch stop may reduce undesirable over-etching of the sacrificial layer and the mirror layer. The etch stop layer may also serve as a barrier layer, buffer layer, and/or template layer.