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公开(公告)号：US07547242B2
公开(公告)日：2009-06-16
申请号：US10558257
申请日：2004-05-19
CPC分类号： B24B37/013 , B24B37/205 , B24B49/08 , B24B49/12 , H01L21/30625 , H01L21/31053 , H01L21/3212
摘要： A substrate polishing apparatus polishes a substrate to a flat mirror finish. The substrate polishing apparatus has a polishing table against which a substrate is pressed, a light-emitting and light-receiving device to emit measurement light from the polishing table to the substrate and to receive reflected light from the substrate for measuring a film on the substrate, a fluid supply passage for supplying a measurement fluid, through which the measurement light and the reflected light pass, to a fluid chamber provided at a light-emitting and light-receiving position of the polishing table, and a fluid supply control device for controlling supply of the measurement fluid to the fluid chamber.
摘要翻译： 基板研磨装置将基板抛光成平面镜面。 基板研磨装置具有：被加压基板的研磨台，发光和受光装置，用于将来自研磨台的测量光发射到基板，并接收来自基板的反射光，以测量基板上的膜 用于将测量光和反射光通过的测量流体供应到设置在抛光台的发光和光接收位置处的流体室的流体供给通道和用于控制的流体供应控制装置 将测量流体供应到流体室。
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公开(公告)号：US20090130956A1
公开(公告)日：2009-05-21
申请号：US12292453
申请日：2008-11-19
申请人： Shinrou Ohta , Noburu Shimizu , Yoichi Kobayashi
发明人： Shinrou Ohta , Noburu Shimizu , Yoichi Kobayashi
CPC分类号： B24B37/005 , B24B49/12 , B24B49/16 , H01L21/3212 , H01L22/12 , H01L22/26
摘要： A polishing apparatus makes it possible to polish and remove an extra conductive film while preventing the occurrence of erosion and without lowering of the throughput. The polishing apparatus includes: a polishing table having a polishing surface; a top ring for holding a workpiece having a surface conductive film, and pressing the conductive film against the polishing surface to polish the conductive film; an optical sensor for monitoring the polishing state of the conductive film by emitting light toward the conductive film of the workpiece held by the top ring, receiving reflected light from the conductive film, and measuring a change in the reflectance of the reflected light; and a control section for controlling a pressure at which the workpiece is pressed on the polishing surface.
摘要翻译： 抛光装置可以抛光和除去额外的导电膜，同时防止腐蚀的发生而不降低生产量。 抛光装置包括：具有抛光表面的抛光台; 用于保持具有表面导电膜的工件的顶环，并将导电膜压靠在抛光表面上以抛光导电膜; 光传感器，用于通过向由顶环保持的工件的导电膜发射光，接收来自导电膜的反射光并测量反射光的反射率的变化来监测导电膜的抛光状态; 以及控制部，用于控制在抛光面上压入工件的压力。
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43.发明申请公开(公告)号：US20090011680A1
公开(公告)日：2009-01-08
申请号：US12230317
申请日：2008-08-27
申请人： Yoichi Kobayashi , Shunsuke Nakai , Hitoshi Tsuji , Yasuo Tsukuda , Junki Ishimoto , Kazunari Shinya
发明人： Yoichi Kobayashi , Shunsuke Nakai , Hitoshi Tsuji , Yasuo Tsukuda , Junki Ishimoto , Kazunari Shinya
IPC分类号： B24B49/12
CPC分类号： B24B49/12 , B24B37/013
摘要： A polishing state monitoring apparatus measures characteristic values of a surface, being polished, of a workpiece to determine the timing of a polishing end point. The polishing state monitoring apparatus includes a light-emitting unit for applying light from a light source to a surface of a workpiece being polished, a light-receiving unit for receiving reflected light from the surface of the workpiece, a spectroscope unit for dividing the reflected light received by the light-receiving unit into a plurality of light rays having respective wavelengths, and light-receiving elements for accumulating the detected light rays as electrical information. The polishing state monitoring apparatus further includes a spectral data generator for reading the electrical information accumulated by the light-receiving elements and generating spectral data of the reflected light, and a processor for calculating a predetermined characteristic value on the surface of the workpiece based on the spectral data generated by the spectral data generator.
摘要翻译： 抛光状态监视装置测量被抛光表面的特征值，以确定抛光终点的定时。 抛光状态监视装置包括用于将光从光源施加到被抛光的工件的表面的发光单元，用于接收来自工件表面的反射光的光接收单元，用于将反射的 由光接收单元接收的多个光具有各自的波长的光;以及用于将检测到的光线累积的光接收元件作为电信息。 抛光状态监视装置还包括：光谱数据发生器，用于读取由光接收元件累积的电信息并产生反射光的光谱数据;以及处理器，用于基于工件的表面计算工件表面上的预定特征值 光谱数据生成器生成的光谱数据。
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公开(公告)号：US20070254565A1
公开(公告)日：2007-11-01
申请号：US11806445
申请日：2007-05-31
IPC分类号： B24B7/00
CPC分类号： B24B37/205 , B24B37/013 , B24B49/12
摘要： A substrate polishing apparatus for polishing a polishing surface of a substrate has a film thickness monitoring device for monitoring a state of a film thickness of a thin film on the polishing surface of the substrate during polishing. The apparatus includes a table, a polishing member fixed on a surface of the table, a substrate support member for pressing the substrate onto the polishing member, an optical system composed of an optical fiber for irradiating the polishing surface of the substrate with a light of irradiation and an optical fiber for receiving a reflected light reflected on the polishing surface of the substrate, an analysis-processing system for processing an analysis of the reflected light received with the optical system, and the film-thickness monitoring device. The table is provided with a liquid-feeding opening for feeding a translucent liquid into a through-hole disposed in the polishing member.
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公开(公告)号：US07241202B2
公开(公告)日：2007-07-10
申请号：US11169797
申请日：2005-06-30
IPC分类号： B24B49/00
CPC分类号： B24B37/205 , B24B37/013 , B24B49/12
摘要： A substrate polishing apparatus for polishing a polishing surface of a substrate has a film thickness monitoring device for monitoring a state of a film thickness of a thin film on the polishing surface of the substrate during polishing. The apparatus includes a table, a polishing member fixed on a surface of the table, a substrate support member for pressing the substrate onto the polishing member, an optical system composed of an optical fiber for irradiating the polishing surface of the substrate with a light of irradiation and an optical fiber for receiving a reflected light reflected on the polishing surface of the substrate, an analysis-processing system for processing an analysis of the reflected light received with the optical system, and the film-thickness monitoring device. The table is provided with a liquid-feeding opening for feeding a translucent liquid into a through-hole disposed in the polishing member.
摘要翻译： 用于抛光基板的抛光表面的基板抛光装置具有用于在抛光期间监测基板的研磨表面上的薄膜的膜厚状态的膜厚监视装置。 该装置包括：台子，固定在工作台的表面上的抛光部件，用于将基板按压到研磨部件上的基板支撑部件;光学系统，其由用于向基板的研磨面照射基板的光 照射和用于接收在基板的研磨表面上反射的反射光的光纤，用于处理由光学系统接收的反射光的分析的分析处理系统和膜厚监视装置。 该台设置有用于将半透明液体供给到设置在抛光构件中的通孔中的供液口。
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公开(公告)号：US06942543B2
公开(公告)日：2005-09-13
申请号：US10854250
申请日：2004-05-27
IPC分类号： G01B11/06 , B24B37/013 , B24B37/20 , B24B49/12 , B24D7/12 , H01L21/304 , B24B1/00
CPC分类号： B24B37/205 , B24B37/013 , B24B49/12
摘要： The substrate polishing apparatus for polishing a polishing surface of a substrate comprises a film thickness monitoring device for monitoring a state of a film thickness of a thin film on the polishing surface of the substrate during polishing. The apparatus includes a table, a polishing member fixed on a surface of the table, a substrate support member for pressing the substrate onto the polishing member, an optical system composed of an optical fiber for irradiating the polishing surface of the substrate with a light of irradiation and an optical fiber for receiving a reflected light reflected on the polishing surface of the substrate, an analysis-processing system for processing an analysis of the reflected light received with the optical system, and the film-thickness monitoring device. The table is provided with a liquid-feeding opening for feeding a translucent liquid into a through-hole disposed in the polishing member.
摘要翻译： 用于研磨基板的研磨面的基板研磨装置包括膜研磨装置，该装置用于监测研磨时的基板的研磨面上的薄膜的膜厚的状态。 该装置包括：台子，固定在工作台的表面上的抛光部件，用于将基板按压到研磨部件上的基板支撑部件;光学系统，其由用于向基板的研磨面照射基板的光 照射和用于接收在基板的研磨表面上反射的反射光的光纤，用于处理由光学系统接收的反射光的分析的分析处理系统和膜厚监视装置。 该台设置有用于将半透明液体供给到设置在抛光构件中的通孔中的供液口。
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47.发明申请Paper feeder, recording apparatus, and method of detecting a position of a terminal edge of a recording material in the recording apparatus 有权送纸器，记录装置和检测记录装置中的记录材料的端边缘的位置的方法公开(公告)号：US20050062216A1
公开(公告)日：2005-03-24
申请号：US10980323
申请日：2004-11-04
申请人： Toru Fukushima , Kazuhisa Kawakami , Masafumi Furuyama , Yoji Sasai , Norihiro Yamashita , Yoichi Kobayashi , Hirotomo Tanaka
发明人： Toru Fukushima , Kazuhisa Kawakami , Masafumi Furuyama , Yoji Sasai , Norihiro Yamashita , Yoichi Kobayashi , Hirotomo Tanaka
CPC分类号： B65H3/0607 , B65H1/022 , B65H3/0661 , B65H7/02 , B65H2301/42344 , B65H2403/512 , B65H2511/24 , B65H2511/514 , B65H2513/10 , B65H2513/511 , B65H2553/61 , B65H2553/612 , B65H2557/20 , B65H2557/24 , B65H2557/60 , B65H2557/61 , B65H2601/322 , B65H2701/1313 , B65H2220/03 , B65H2220/01
摘要： A paper feed unit includes a hopper on which sheets are stacked and which is turned around a rotation shaft. The hopper is turned to move apart from or move to a paper feed roller. The paper feed unit has three modes: a large release mode in which the hopper is turned to be most apart from the paper feed roller, a non-release mode in which the printing sheet is abutted against the paper feed roller, and a small release mode in which the printing sheet, is slightly separated from the paper feed roller, and is at a medium level between the above two modes. When a paper feeding job is still present, a state that the uppermost printing sheet is slightly separated from the paper feed roller is retained by the small release mode, whereby a swing range of the hopper is minimized.
摘要翻译： 供纸单元包括料斗，板料被堆叠在该料斗上，并且围绕旋转轴转动。 料斗被转动以移动或移动到送纸辊。 供纸单元具有以下三种模式：其中料斗被转动到最远离送纸辊的大的释放模式，其中打印纸抵靠进纸辊的非释放模式和小的释放 打印纸与进纸辊略微分离，并且在上述两种模式之间处于中等水平的模式。 当送纸作业仍然存在时，最上面的打印纸与供纸辊稍微分离的状态通过小的释放模式保持，从而使料斗的摆动范围最小化。
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公开(公告)号：US06772029B2
公开(公告)日：2004-08-03
申请号：US10181293
申请日：2002-07-16
IPC分类号： G06F1760
CPC分类号： G06Q50/04 , G06Q10/04 , G06Q10/06 , H01L21/67276 , Y02P90/30 , Y10S414/135 , Y10S438/907 , Y10S438/908
摘要： The present invention provides a substrate transfer controlling apparatus which can easily maximize the throughput of a substrate processing apparatus such as a semiconductor fabrication apparatus, and can satisfy a demand for immediacy of actions of a transfer device. The substrate transfer controlling apparatus comprises an input device (12) for inputting times required for actions of transfer devices (1a through 1c) and times required to process substrates in processing devices (3a through 9d), and a schedule calculator (21) for calculating execution times of actions of the transfer devices (1a through 1c) for allowing the time when a final one of the substrates to be processed is fully processed and returned from the substrate processing apparatus to be earliest, based on a predetermined conditional formula including, as parameters, the inputted times. The substrate transfer controlling apparatus further comprises an action commander (24) for instructing the corresponding transfer devices to perform the actions at the calculated execution times of the actions of the transfer devices (1a through 1c).
摘要翻译： 本发明提供一种能够容易地使半导体制造装置等基板处理装置的生产能力最大化的基板转印控制装置，能够满足对转印装置的动作的即时性的要求。 基板传送控制装置包括：输入装置（12），用于输入传送装置（1a至1c）的动作所需的时间和处理装置（3a至9d）中处理基板所需的时间;以及计算计算器（21），用于计算 基于规定的条件式，将从基板处理装置开始最后处理的基板的处理时间最短的传送装置（1a〜1c）的动作的执行时间作为 参数，输入时间。 基板传送控制装置还包括动作指令器（24），用于指示相应的传送装置在计算出的传送装置（1a至1c）的动作的执行时间执行动作。
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公开(公告)号：US5700099A
公开(公告)日：1997-12-23
申请号：US635317
申请日：1996-04-19
申请人： Yoichi Kobayashi , Kiyoto Komuro
发明人： Yoichi Kobayashi , Kiyoto Komuro
CPC分类号： B41J13/10 , B41J11/005
摘要： A paper discharge section for a printer having a printer body includes first and second support portions mounted on the printer body. At least one of the support portions is slidable towards and away from the other support portion. The first support portion can rotate between at least a first position at which the first support portion supports a first bottom side portion of the sheet of paper and at least a second position in which the first support portion does not support the first bottom side portion of a sheet of paper. A slidable edge guide for guiding a first side edge of a sheet of paper is provided and slidable towards the other edge guide. A linkage mechanism links the slidable edge guide to the first support portion to cause the edge guide and first support portion to slide together. A switch for reversibly moving the first support portion from a first position at which the first portion supports a first bottom side portion of a sheet of paper when the edge guide is positioned to accept paper that requires support to a second position at which the first support portion does not support the first bottom side portion of a sheet of paper when the edge guide is positioned to accept paper that does not require support upon discharge, and for moving the first support portion from a second position at which the first support portion does not support the first bottom side portion of a sheet of paper when the edge guide is positioned to accept paper that does not require support upon discharge.
摘要翻译： 具有打印机主体的打印机的排纸部分包括安装在打印机主体上的第一和第二支撑部分。 支撑部分中的至少一个可朝向和远离另一支撑部分滑动。 第一支撑部分可以在第一支撑部分支撑纸张的第一底侧部分的至少第一位置和至少第二位置之间旋转，在第二位置中第一支撑部分不支撑第一底部侧部分 一张纸。 提供用于引导纸张的第一侧边缘的滑动边缘引导件，并且可朝向另一边缘引导件滑动。 联动机构将可滑动边缘引导件连接到第一支撑部分，以使边缘引导件和第一支撑部分一起滑动。 一种用于当第一部分支撑纸张的第一底侧部分的第一位置可逆地移动第一支撑部分的开关，当边缘引导件被定位成接受需要支撑的纸张到第二位置时，第一支撑件 当边缘引导件定位成接收在排出时不需要支撑的纸张，并且用于将第一支撑部分从第一支撑部分不在第二位置移动的第一支撑部分移动时，部分不支撑一张纸的第一底侧部分 当边缘引导件被定位成接受放电时不需要支撑的纸张时，支撑一张纸的第一底侧部分。
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公开(公告)号：US4957860A
公开(公告)日：1990-09-18
申请号：US112068
申请日：1987-10-26
申请人： Tatsuhiko Kan , Yoichi Kobayashi
发明人： Tatsuhiko Kan , Yoichi Kobayashi
CPC分类号： C12P19/14 , Y10S435/911 , Y10S435/913 , Y10S435/918
摘要： The present invention provides a method of producing oligosaccharides by the reaction between lactose and .beta.-galactosidase from aspergillus oryzae in which an concentration of lactose in an enzyme reaction mixture is between 50 and 90% (w/v) and a reaction temperature is within the range of 55.degree. C. to the temperature at which the .beta.-galactosidase in the reaction mixture is inactivated. This invention therefore makes it possible to obtain the sugar mixture containing high-purity oligosaccharides, small amounts of unreacted lactose and by produced monosaccharides.
摘要翻译： 本发明提供了通过乳糖和来自米曲霉的β-半乳糖苷酶之间的反应制备寡糖的方法，其中酶反应混合物中的乳糖浓度为50-90％（w / v），反应温度在 范围为55℃至反应混合物中β-半乳糖苷酶失活的温度。 因此，本发明使得可以获得含有高纯度寡糖，少量未反应的乳糖和产生的单糖的糖混合物。
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